Infrared Array Sensor Grid-EYE (AMG88)
High Precision
Infrared Array Sensor
based on Advanced
MEMS Technology
New
Infrared Array Sensor
Grid-EYE
FEATURES
TYPICAL APPLICATIONS
1. Temperature detection achieved on
a two dimensional area with 8 × 8 (64)
pixels.
2. Digital output (temperature values
can be output)
3. Miniature SMD package (reflow
mounting supported)
• High performance home appliance
(Microwave oven and air conditioner)
• Energy savings in office (Airconditioning and lighting controls)
• Digital signage
• Automatic door and elevator
RoHS compliant
ORDERING INFORMATION
AMG
8
8
Vertical pixel
8: 8 pixels
Horizontal pixel
8: 8 pixels
Applied voltage
3: 3.3 V DC
5: 5 V DC
Amplification factor
1: High gain
2: Low gain
TYPES
Product name
Number of pixel
Operating voltage
3.3 V DC
Infrared array sensor
Grid-EYE
64
(Vertical 8 × Horizontal 8 Matrix)
5.0 V DC
Amplification factor
Part number
High gain
Low gain
High gain
Low gain
AMG8831
AMG8832
AMG8851
AMG8852
Tape and reel package: 1,000 pcs.
RATING
Standard
Item
High gain
Applied voltage
Temperature range of measuring object
Operating temperature range
Storage temperature range
ASCTB22E 201201-T
Low gain
3.3V±0.3V or 5.0V±0.5V
0°C to 80°C +32°F to +176°F
0°C to 80°C +32°F to +176°F
–20°C to 80°C –4°F to +176°F
Panasonic Corporation
Automation Controls Business Unit
–20°C to 100°C –4°F to +212°F
–20°C to 80°C –4°F to +176°F
–20°C to 80°C –4°F to +176°F
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Infrared Array Sensor Grid-EYE (AMG88)
ABSOLUTE MAXIMUM RATINGS
Item
Applied voltage
Input voltage
Output sink current
Static electricity (Human body model)
Static electricity (Machine model)
Standard
Terminal
Vdd
SCL, SDA, AD_SELECT
INT, SDA
All terminals
All terminals
–0.3 to 6.5V
–0.3 to Vdd + 0.3V
–10 to 10mA
1kV
200V
CHARACTERISTICS
Standard
Item
High gain
Typical ±2.5°C ±4.5°F
Temperature accuracy
Detection distance*1
Viewing angle
Optical axis gap
Low gain
Typical ±3.0°C ±5.4°F
Max. 5m 16.404ft
Typical 60°
Within Typical ±5.6°
Typical 4.5mA (normal mode)
Typical 0.2mA (sleep mode)
Typical 0.8mA (stand-by mode)
Current consumption
Typical 50ms (Time to enable communication after setup)
Typical 15s (Time to stabilize output after setup)
Setup time
Note: *1. To have more than 4°C 7.2°F of temperature difference from background
Detection object size: 700 × 250 mm 27.559 × 9.843 inch (Assumable human body size)
FUNCTIONS
Item
Value
64 (Vertical 8 × Horizontal 8 Matrix)
I2C (fast mode)
Typical 10 frames/sec or 1 frame/sec
Normal
Sleep
Stand-by (10 sec or 60 sec intermittence)
Temperature output
No moving average or Twice moving average
0.25°C
2 (I2C slave address)
–20°C to 80°C –4°F to +176°F
0.0625°C
Number of pixel
External interface
Frame rate
Operating mode
Output mode
Calculate mode
Temperature output resolution
Number of sensor address
Thermistor output temperature range
Thermistor output resolution
INTERNAL CIRCUIT
3.3V DC or 5V DC
Infrared array sensor
Sensor chip
2
VDD
SDA
ROM
9
I2C I/F
3
SCL
Selector
Control
Capacitor
10µF
5
Gain
amp
GND
ADC
4
6
AD_SELECT
INT
Thermistor
GND
* INT terminal 4 normally has same voltage as VDD. When interrupting, same as GND (0V).
Panasonic Corporation
Automation Controls Business Unit
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ASCTB22E 201201-T
Infrared Array Sensor Grid-EYE (AMG88)
PIXEL ARRAY AND VIEWING FIELD
1. Pixel array
Pixel array from 1 to 64 is shown below.
2. Viewing field
Sensor viewing field (typical) is shown below.
64 63 62 61 60 59 58 57
56 55 54 53 52 51 50 49
48 47 46 45 44 43 42 41
40 39 38 37 36 35 34 33
32 31 30 29 28 27 26 25
Vertical viewing angle 60°
Horizontal viewing angle 60°
24 23 22 21 20 19 18 17
16 15 14 13 12 11 10
9
8
1
7
6
5
4
3
2
OPTICAL PROPERTIES
Vertical viewing central angle, (°)
Each pixel’s vertical viewing angle (°)
2. Each pixel’s viewing angle (half angle)
Central 4 pixels (Pixel No. 28, 29, 36, 37) viewing angle
(half angle): horizontal direction 7.5° (Typical)
vertical direction 8° (Typical)
Each pixel’s horizontall viewing angle (°)
1. Each pixel’s viewing central angle
Sensor’s optical center (the origin of graph below) gap: within
±5.6° (Typical) (Both of horizontal and vertical directions)
20
15
10
5
0
1
5
9 13 17 21 25 29 33 37 41 45 49 53 57 61
Pixel number
20
15
10
5
0
1
5
9 13 17 21 25 29 33 37 41 45 49 53 57 61
Pixel number
Horizontal viewing central angle, (°)
DIMENSIONS (mm inch)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e
Recommended PC board pad
External dimensions
CAD Data
w
Lens
2.6 .102
I
2.0
.079
P
51
8.0
.315
Q
Part No.
(Printed without “AMG88”)
Q
W
E
R
T
Y
U
5.3
.209
U
11.6
.457
Lot No.
Terminal layout
NC
I
SDA
O
SCL
P
INT
{
AD_SELECT
}
GND
q
NC
w
NC
VDD
AVDD-PC
NC
DVDD-PC
VPP
NC
Note: Leave terminal “NC (No. Q, U, I, { and w)”
unconnected.
Make electrical potential of terminals O and
q the same.
8.9
.350
11.0±0.05
.433±.002
(0.75)
(.030)
3.5 8.7
.138 .343
3.6
.142
10-0.7
10-.028
*Four corners
4-0.8
4-.031
±0.05
P1.27 ×4=5.08
P.050±.002×4=.200
4.3
.169
1.5
.059
14-0.5
14-.020
U
Q
3.0
.118
7.8
.307
w
13-2.0
13-.079
ASCTB22E 201201-T
I
P1.27×4
P.050×4
10.9
.429
Tolerance outside of that indicated: ±0.2 ±.008
Panasonic Corporation
Automation Controls Business Unit
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Infrared Array Sensor Grid-EYE (AMG88)
RECOMMENDED EXTERNAL CIRCUIT
1. In case of setting I2C slave address of the sensor 1101000
* Connect terminal T (AD_SELECT) to GND.
2. In case of setting I2C slave address of the sensor 1101001
* Connect terminal T (AD_SELECT) to VDD.
VDD
VDD
10kΩ 10kΩ 10kΩ 10kΩ
10kΩ 10kΩ 10kΩ
WSDA
ESCL
RINT
TAD_SELECT
YGND
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
qVPP
}DVDD-PC
PAVDD-PC
OVDD
1µF
20Ω
WSDA
ESCL
RINT
TAD_SELECT
YGND
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
qVPP
}DVDD-PC
PAVDD-PC
OVDD
1µF
20Ω
1.5µF
1.5µF
10µF
10µF
GND
GND
Recommended external circuit
This circuit is an example to drive infrared array sensor “Grid-EYE”, so that we will not take any responsibility of loss which
is due to this circuit.
PACKING FORMAT (Tape and reel) (mm inch)
Tape dimensions
16.0±0.3
.630±.012
7.5±0.1
.295±.004
1.75±0.1
.069±.004
Dimensions of tape reel
21.0
.827±0.8
0.35±0.05
.014±0.05
2.0±0.5
.079±.020
1.5 +0.1
−0 dia.
.059+.004
dia.
−0
Direction of picking
17.5±1.0
.689±1.0
±0.8
Top cover tape
Embossed carrier tape
380.0±2 dia.
14.961±.079 dia.
100.0±2 dia.
±.079
dia.
3.937
13±0.5 dia.
.512±.020 dia.
±0.1
4.0
.157±.004
21.5±3.0
.846±3.0
16.0±0.1
.630±.004
1.5 +0.1
0 dia.
.059+.004
dia.
0
12.6±0.1
.496±.004
2.0±0.1
.079±.004
9.0±0.1
.354±.004
4.7±0.1
.185±.004
NOTES
1. Checkpoints relating to principle of
operation
The Infrared array sensor is a thermobiletyped infrared sensor which detects
quantity of infrared ray. Generally,
temperature accuracy will be degraded in
the following situations. Be sure to verify
performance and reliability under actual
conditions of use and make any
necessary temperature corrections.
• There is a heat emitting body located
close to where the sensor is mounted.
• A flow of warm or cold air is hitting the
sensor.
• The temperature of the sensor is subject
to sudden changes.
• When an object made of glass, acrylic
or other subject which far infrared rays
have difficult passing through is located
between the sensor and what is to be
detected.
• A substance (dirt or water droplets) that
makes it difficult for far infrared rays to
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pass through is attached to the sensor
lens.
2. Ambient operating conditions
1) Temperature: Please refer to
“RATING”.
2) Humidity: 15% to 85% R.H. (No
freezing nor condensation at low
temperature)
3) Atmospheric pressure: 86 to 106 kPa
4) Protect the sensor from impact and
vibration, because these can cause
damage that leads to malfunction and
degraded performance. And avoid
applying a load or impact since this will
deform or scratch the lens, making
proper operation impossible and causing
a deterioration in its performance.
5) The sensors do not have a water-proof
or dust-proof construction. Depending on
the ambient operating conditions, some
means of providing protection from water
and dust and preventing the formation of
Automation Controls Business Unit
ice and condensation must be provided
prior to using the sensors.
If condensation occurs, heat source
detection response may become delayed
by several seconds.
6) Please avoid using or storing the
infrared array sensor in a place exposed
to corrosive gases (such as the gases
given off by organic solvents, sulfurous
acid gas, hydrogen sulfides, etc.) which
will adversely affect the performance of
the infrared array sensor.
7) Since the internal circuitry may be
destroyed if an external surge voltages is
supplied, provide an element which will
absorb the surges.
8) Malfunctioning may occur if the
product is in the vicinity of electrical noise
such as that from static electricity,
lightning, a mobile phone, an amateur
radio and a broadcasting station.
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ASCTB22E 201201-T
Infrared Array Sensor Grid-EYE (AMG88)
9) Although the ambient temperature
(humidity) range is a temperature
(humidity) range which can operate a
sensor continuously, the humidity range
changes with temperature.
So please use it in the humidity range.
And please avoid continuation use near a
limit. This humidity range does not
guarantee durability ability.
3. Other handling cautions
To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect its
performance.
1) This sensor may malfunction if
dropped on its own before it is installed.
Do not use if this happens.
2) Caution is required because writing
except for register and bit specified can
be cause of malfunction and performance
degradation. (Please consult us.)
3) Caution is required because
differences in the temperature range and
the method of connection can lead to
breakdown.
4) If the sensor get high frequency
vibration, it can be cause of breakdown.
When the product get impulse like below,
do not use it.
• Touch to a object made of metal
• Touch of mutual sensors
5) Since static charge can damage the
sensor, bear in mind the following
handling precautions.
• Plastic containers should not be used to
store or transport the sensors since they
readily become charged.
• Please store or transport the sensor in
an environment that hinders the
occurrence of static electricity (for
example, places with 45% to 60%
humidity) and protect the product using
electrically conductive packaging.
• Implement static electricity prevention
measures once the product packaging
has been opened.
(1) Any personnel handling the sensor
should wear electrostatic clothing and be
body grounded.
(2) Place an electrically conducting board
on the work surface and ground any
devices used such as measuring
instruments and jigs.
(3) Use a soldering iron with a low leak
current or else ground the tip.
(4) Make sure that customer equipment
used for device assembly is grounded.
• Use a regulated power supply as the
power supply. Otherwise, power supply
superimposed noise may cause the
sensors to malfunction.
ASCTB22E 201201-T
4. Ambient temperature (humidity)
range
Although the ambient temperature
(humidity) range is a temperature
(humidity) range which can operate a
sensor continuously, the humidity range
changes with temperature.
So please use it in the humidity range
shown below. And please avoid
continuation use near a limit. Generally
under high temperature or high humidity,
deterioration of electronic parts
accelerates. To ensure reliability, please
verify quality under conditions of actual
use.
• This humidity range does not guarantee
durability ability.
High gain type
Humidity, %RH
85
Tolerance range
(Avoid freezing
when used at
(Avoid
temperatures
condensation)
lower than
0°C 32°F)
15
–20
–4
0
+32
80
+176
Temperature, °C °F
Low gain type
Humidity, %RH
85
Tolerance range
(Avoid freezing
when used at
temperatures
lower than
0°C 32°F)
15
–20
–4
(Avoid
condensation
when used at
temperatures
higher than 0°C 32°F)
0
+32
80
+176
Temperature, °C °F
5. Mounting
Use lands on the PC boards to which the
sensor can be securely fixed.
Recommended PC board is FR4
(thickness1.6 mm .063 inch). As for
mounting unrecommended PC board,
please verify quality in advance.
• Malfunctioning may occur if much noise
is present in the power supply used for
this sensor. In order to prevent, in
particular, superimposed noise, please
install the recommended capacitor
between the sensor input terminals
(between VDD and GND) closest to the
sensor (a position within 20 mm .787 inch
of the PC pattern length). However,
please reselect an ideal capacitor after
performing tests on the actual equipment.
• Since the top surface (where the part
number is visible) of the sensor is GND,
please make sure that the metallic parts
of other components do not come into
contact.
Panasonic Corporation
Automation Controls Business Unit
6. Soldering
Due to the thermal capacity of the
infrared array sensor is low, therefore,
take steps to minimize the effects of
external heat. Damage and changes to
characteristics may occur due to heat
deformation. Use a non-corrosive resin
type of flux.
1) Manual soldering
• Set the soldering tip from 350 to 400°C
662 to 752°F (30 to 60W), and solder
within 3 seconds or less.
• Please note that output may be
changed if the load is applied to the
terminals when the soldering.
• Carefully clean the tip of soldering iron.
2) Reflow soldering
The recommended reflow temperature
profile conditions are given below.
• We recommend the screen solder
printing method as the method of cream.
• Please refer to the recommended PC
board specification diagram for the PC
board foot pattern.
• Self alignment may not always work as
expected; therefore, please carefully
adjust the position of the terminals and
pattern.
• The temperature of the profile is
assumed to be a value measured with
the PC board of the terminal
neighborhood.
• When you do the reflow solder to the
back of the PC board after the reflow of
the sensor, please execute fixed
processing, for instance, with the
adhesive etc.
T3
T2
T1
t1
T1 = 150 to 180°C 302 to 356°F
T2 = 230°C 446°F
T3 = within 250°C 482°F
t2
t1 = 60 to 120s
t2 = within 30s
3) When you cut or fold the PC board
after mounting the sensor, be careful not
to stress to the soldered parts.
4) Solder reworking
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Please do
not add more flux when reworking.
• The temperature of the soldering tip
must be under the above-mentioned
temperature.
5) The sensor terminals are designed to
be exposed, so contact of the terminals
with metal shards and the like will cause
output errors. Therefore, please be
careful not to touch the terminals with the
metal piece or the hand.
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Infrared Array Sensor Grid-EYE (AMG88)
6) To prevent the insulation of the PC
board after soldering, please be careful
not to place the chemicals on the sensor
when coating.
7. Connections
1) Please perform connections correctly
in accordance with the terminal
connection diagram. In particular, be
careful not to reverse wire the power
supply as this will cause damage or
degrade to the sensor.
2) Please do not connect wires in an
empty terminal. It causes the sensor
breakdown.
3) When using the sensors with cables, it
is recommended that cables which are
shielded and as short as possible be
used in order to safeguard against the
effects of noise.
8. Cleaning
Avoid ultrasonic cleaning since this may
cause breaks or disconnections in the
wiring.
9. Transportation and storage
1) Extreme vibration and shock during
transport will damage the sensor. Handle
the outer box and reel with care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended.
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
3) The sensors are sensitive to moisture
and come in moisture-proof packages.
Observe the following cautions when
storing.
• After the moisture-proof package is
unsealed, take the sensors out of storage
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as soon as possible (within 1 week
30°C 86°F/60% R.H.).
• If the sensors are to be left in storage for
a considerable period after the moistureproof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
*When mounting with solder, if thermal
stress is applied to sensors that have
absorbed moisture, the moisture will
vaporize, swelling will occur, and the
inside of the package will become
stressed. This may cause the package
surface to blister or crack. Therefore,
please take caution and observe the
soldering conditions.
10. Special remarks
Although the best attention will be paid
for the quality controls of the products,
please consider the followings:
1) To prevent unexpected failures as
much as possible under the conditions
not shown in this specifications, please
let us know the detailed information on
the application, such as the
environmental, operational and mounting
condition.
2) By any chance, if the failure of the
product is considered to cause a
personal injury or death or property
damage, the safety rate should be added
to the specified values shown in this
specifications and the dual safety
structure or circuit is recommended to be
taken from the stand point of the product
liability indemnity.
3) We will either repair or replace any
products or parts there of which prove to
be defective against only the items
written in this specifications within 1 year
from the date of products acceptance at
the site of delivery. Following cases are
not covered by this guarantee.
Automation Controls Business Unit
• The case of other damage caused by
the failure or defect of the product.
• The case that the product condition
changed by handling, storage and/or
transportation after delivery.
• The case caused by the phenomenon
which has never been discovered and is
impossible to be foreknown with the
existing technologies.
• The case of force majeure, such as acts
of God, public enemy or war, fires, floods
and any other causes beyond the control
of the people concerned.
11. Export control
[To customers in Japan]
This product is restricted under Japan’s
“Foreign Exchange and Foreign Trade
Law.” An export permit from the
Japanese government is required when
you export or take this product outside
Japan. (As of Apr.2011)
This product may not be used for any
purpose other than those specified.
Reselling the product to third parties is
prohibited. When disposing of the
product, it must first be converted into
non-reusable and non-controlled form.
[To customers outside Japan]
This product is restricted under Japan’s
laws and regulations relating to security
export control (Foreign Exchange and
Foreign Trade Law). We have obtained an
export permit from the Japanese
government to sell or provide this product
to your company, subject to the following:
This product may not be used for any
purpose other than those specified. This
product may be subject to further export
restrictions under the laws and
regulations of other countries (including
your own). Reselling the product to third
parties is prohibited. When disposing of
the product, it must first be converted into
non-reusable and non-controlled form.
industrial.panasonic.com/ac/e
ASCTB22E 201201-T