Request for your special attention and precautions in using the technical information and semiconductors described in this book (1)An export permit needs to be obtained form the competent authorities of the Japanese Government if any of the products or technologies described in this book and controlled under the Foreign Exchange and Foreign Trade Law is to be exported or taken out of Japan. (2)The technical information described in this book is limited to showing representative characteristics and applied circuit examples of products.It does not constitute the warranting of industrial property,the granting of relative rights,or the granting of any license. (3)The products described in this book are intended to be used for standard applications or general electric equipment(such as office equipment, communications equipment,measuring instruments and household appliances). Consult one of our sales offices in advance for the following applications: ・ Special applications(such as for airplanes,aerospace,automobiles,traffic control equipment,combustion equipment,life support systems and safety devices)in which special quality and reliability are required,and the failure or malfunction of the products may directly jeopardize life or harm the human body ・Any applications other than the standard applications intended (4)When designing your equipment,than the standard applications intended those of maximum rating,the range of operating power supply voltage and heat radiation characteristics. Otherwise,we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values,redundant design is recommended,so that such equipment may not violate relevant law or regulations because of the function of our products. (5)When dry packing is required for the products,make sure of the details of the warranty. Observe the conditions(including shelf life and after-unpacking standby time)in their use. Notes for Handling Total number of pages Page 6 1 [Concerning the storage and guarantee conditions] 1. Storage environment CCD image sensors (hereinafter referred to as CCD) are precision optical products. For storage of CCDs, control the environments of temperatures and humidity, radiant rays, static electricity, etc. Take care of the storage environments with regard to the following points: (1) Use our original package for storing the CCD. (2) Keep the temperature and humidity for storage: Ta = 5 to 35°C and RH = 35 to 60%. Pay special attention when the humidity is low (45% or less), because the charged voltage will be rapidly increased. (3) Do not store the CCD at the location subject to strong lights, such as direct sunlight or ultraviolet rays. If a strong light incidents for a long time, the transmittance of the filter and/or lens materials will be degraded. (4) Avoid a rapid temperature change in which condensation occurs. (5) Do not expose the CCD to radiant rays, static electricity, or strong magnetic field. (6) If you use tap water when humidifying the environment with humidifiers in winter, chlorine, etc. contained in the tap water may cause rust on the leads. Boil it before using. (7) Avoid load, vibration, and shock, which may deform the package. 2. About the guarantee CCDs shall be guaranteed based on the “About the guarantee of CCD”, as long as the conditions below and the contents of the separate “About the guarantee of CCD ” are met. • When the conditions in these note for handling are met • When the conditions on the pages describing the operating conditions are met [Guarantee] White defects are extemporaneously caused on CCDs due to cosmic rays along the time lapse. Except these white defects, the image taking characteristics described on the “page of specifications of image taking characteristics” shall be guaranteed. If you have any concerns about white defects on the products left unused for a long period (18 moths after our shipment), we are in a position to coordinate supports including re-inspection of such products based on discussions with you. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Notes for Handling Total number of pages Page 6 2 [Concerning notes for handling] Notes for handling of CCD image sensors (hereinafter referred to as CCD) as an optical element consisting of MOS type integrated circuits (ICs) are described below: 1. Notes on static electricity (Basically handle CCDs in an ESD (electrostatic discharge) protection area (EPA). If an excessive voltage is applied to any terminals of the CCD due to static electricity, it may cause the degradation of the transfer efficiency and/or the variation of the characteristics leading the damage to the protection circuit and malfunction of the device in the worst case. (1) In an dry air, it is highly probable that static electricity is generated due to friction. Control the humidity in the environment of usage, using air conditioners, to 50% RH or more Particularly, if the humidity is lowered to 45% or less, static electricity of several thousand to several ten thousand volts is generated. If this is applied to the CCDs, it is highly probable that they may be subject to an electrostatic discharge damage. Abundance of caution is required. (2) In order to promote the spontaneous discharge of static electricity charged on the insulators in the vicinity, using a static eliminator (ionizer, etc.) is effective. (3) Human bodies and man-made fiber clothing may be charged with static electricity reaching several thousand volts by friction. Wear working wears of non-electrostatic propensity. Also, wear shoes of non-electrostatic propensity. (4) For gloves for handling CCDs, avoid nylon gloves and use cotton gloves. Make sure to ground human bodies. For grounding human bodies, grounding wrist straps are generally used. For operations, use grounding wrist straps with a resistor of about 1 MÙ inserted between the straps and ground for safety. Lay conductive mats on the floor and the working tables in a workshop to ground them in order to protect them from being charged. (5) For storage of CCDs, do not remove them from the packing cases (conductive containers). Furthermore, do not place CCDs on a plastic object or replace the cushioning with styrene foam, which are easily charged. If some CCDs should be returned, use the conductive containers used for delivery. (6) For soldering, make sure to ground the tip of a soldering iron to avoid leaks of high tension. (7) Make sure to ground measuring instruments, such as oscilloscopes and digital voltmeters, used for inspection, etc. Also, make sure to ground thermostatic chambers, life test instruments, etc. used for the reliability test. (8) When handling CCDs, take care not to touch the leads with your bare hands or not to drop the CCDs. (9) Set unused pins of a CCD (except pins of the IC) to the same potential as that of GND pins. (10) When handling printed circuit boards built in with a CCD, handle them similarly to CCDs alone. (11) For containers, with which CCDs or printed circuit boards built in with a CCD are transported, use those conductive or processed for charge protection. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Notes for Handling Total number of pages Page 6 3 2. Precautions for application of power supply Precautions for application of supply voltage are described in Attachment “Precautions for application of supply voltage”. Furthermore, take care of the following: (1) Do not exceed the maximum ratings specified in the product specifications. (2) Note that wrong connection of the CCD terminals causes source, drain, and the protective transistor to be biased forward, leading passing of large currents. They may melt down the aluminum wirings. (3) Do not use a power supply, the transient voltage of which exceeds the maximum ratings. (4) In order to prevent latch-up from occurring, use the “Examples of application circuits (examples of latch-up protection peripheral circuitry)”. If latch-up occurs, abnormal currents will pass between φV-PW (P-well) and SUB (substrate), which will heat up the CCD, leading to its malfunction. 3. Precautions for soldering CCD, unlike general SMD-type semiconductors, is not supported for reflow mounting. (1) Do not use solder dip or reflow. (2) Conditions of soldering recommended by Matsushita • Use a soldering iron for soldering. • Soldering iron tip temperature = 370°C • Within two seconds for each terminal (3) Marginal temperature of each section of CCD Marginal temperature of each section of CCD is, considering the physical margins of composing materials, thought as follows: Marginal temperature CCD elements ≤ 170°C Adverse effects expected when the marginal temperature is exceeded: Deterioration of on-chip filter and lens materials Section where glass is adhered Package section (plastic type) ≤ 80°C Deterioration of sealing materials ≤ 260°C Thermal expansion or deterioration of plastic materials (4) For soldering, take care not to contact the package with a soldering iron. (5) Take care of re-soldering a CCD removed, because the package may be damaged. (6) When fixing or removing a soldered CCD, cool the soldered areas sufficiently. When using an automatic solder gobbler, used one with temperature control and static electricity protection. Also, ground the motor of a vacuum pump to avoid surging. (7) For soldering, make sure to ground the tip of a soldering iron to avoid leaks of high tension. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Notes for Handling Total number of pages Page 6 4 4. Precautions for avoidance of package damage Take the following cares to avoid the damages to the package: (1) Plastic or ceramic materials are used for packages of CCD. Take care not to drop CCDs or apply shock to CCDs. Particularly when outer leads are fixed on the socket or substrate, CCDs may be damaged by a small shock which does not damage the CCDs alone. (2) When mounting CCDs, do not apply a stress to the roots of the CCD outer leads. Otherwise, a root of the leads will be cracked. (3) When mounting a CCD on a substrate, mount it so that a warp of the package is avoided. The package is slightly warped; if a solid plate, etc. is inserted, the package may be cracked. 5. Precautions for cover glass The surface of the glass of the CCDs is washed sufficiently before shipping. Observe the following precautions to protect the surface of the glass from flaws and adherence of dirt. (1) Work in a clean environment, such as a clean booth (with a cleanliness class of 1000 or so). (2) Do not touch the surface of the glass with your bare hands or any objects to avoid dirt from adhering. If dirt adheres, blow air on it in an antistatic environment. If dirt adheres by static electricity, using ionized air is recommended. Note that when blowing air, ground all the CCD’s terminals to protect them from static electricity. (3) If oily dirt has adhered and cannot be blown off with air, wipe it off using a cotton swab or cleaning paper impregnated with isopropyl alcohol, taking care not to damage it. Even if a soft cloth or cotton swab is used, dirt may be generated from it when it is dry, which may damage the surface of the glass. (4) Do not scratch or apply a shock to the surface of the glass. The surface of the glass will be damaged or flawed and its characteristics will be impaired. (5) It is necessary to store CCDs in their packing case to avoid dirt. (6) When transporting CCDs to a room with a large temperature difference, eliminate the difference by cooling or heating the room beforehand to avoid condensation. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Notes for Handling Total number of pages Page 6 5 6. Precautions for products with a seal protecting glass surface (1) Static electricity is caused when the glass surface protection seal is peeled off, which may lead to the CCD damage. When peeling off the protective seal, eliminate static electricity by using a static eliminator (ionizer, etc.) Furthermore, ensure that the charging level of the product does not exceed ±500 V. (2) An ionizer is effective for eliminating static electricity caused by charging between the seal adhesive and the cover glass when the protective seal is peeled off. When using an ionizer, observe the following precautions: • Ion balance: • Static elimination speed: Depending on the static elimination speed of the ionizer, peel off the protective seal slowly (while eliminating static electricity). • The charge level will be different depending on the temperature and humidity in the working environment. Adjust the output and air volume of the ionizer in accordance with the charge level of the product. Check and maintain the ionizer periodically, because the capacity of the ionizer may deteriorate depending on the stain on the ion generating part (electrode needle). • If you install a static electricity sensor to monitor the charge level, install it so that the vicinity of the CCD cover glass can be measured, because the charge level of the product is different from that of the working environment. Ensure that the ion balance does not increase the charge through reversed charging. More specifically, do not use an ionizer, which only generates either positive or negative ions. (3) Cleaning has been carried out for the glass surface. However, adhesion of micro dust particles or air bubbles in the protective seal caused when it is applied cannot be avoided completely. Where there is adhesive residue on the glass surface, clean it and make sure not to damage the glass surface. (4) Even when a denticle is applied to the protective seal, flaws will be caused on the glass surface. Please handle CCDs carefully. (5) Re-pasting a protective seal must not be carried out, because it may cause electrostatic discharge damage or stains. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Notes for Handling Total number of pages Page 6 6 7. Precautions for the optical element (1) Micro lenses to increase light condensing for the photo diodes and color filters to identify color information are on-chip mounted on the photoelectric transfer section of a CCD. The on-chip structure is formed with resin. The transmittance of the filters and the lens materials will deteriorate depending on the spectrum and amount of incident light for the CCD and the length of exposure. Therefore, do not expose CCDs to strong ultraviolet rays, sunlight, etc., irrespective of use (storage, transportation or processing). (2) When the same image pattern is taken for a long time, burn-in of the pattern or granulation will result, irrespective of whether the CCD is driven or not, depending on the amount of incident light or length of the exposure. When the CCD is not in use, shield it from light and turn the power OFF. (3) White defects are extemporaneously caused on CCDs due to cosmic rays over time. Provide a defect compensation circuit for white defects. Apr. 3, 2003 CCD Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd.