REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline U. Add vendor CAGE 69210 for device type 01UX. Editorial changes throughout. 93-04-23 M. A. FRYE B Add footnote 2/ to VLT, VRIN, VRIT, and VON tests as specified under Table I. Add footnote 2/ under Table I which states; “If not tested, shall be guaranteed to the limits specified in table I herein.” Changes in accordance with NOR 5962-R088-96. 96-03-29 M. A. FRYE C Add case outline E. Update boilerplate. Redrawn. - rpp 97-09-15 R. MONNIN D Add case outline X. Make changes to 1.2.2, 1.3, 1.4, figure 1 and figure 2. - ro 98-12-08 R. MONNIN E Make change to theta JC, theta JA under 1.3 and output impedance test as specified in table I. - ro 99-03-24 R. MONNIN F Make change to theta JC, theta JA for case Y under 1.3 and dropout voltage test as specified in table I. Correct terminal connection for case outline X. - rrp 99-08-06 R. MONNIN G Add case outlines M and N. - ro 02-03-29 R. MONNIN H Drawing updated to reflect current requirements. - rrp 09-04-22 J. RODENBECK J Add device type 02. Add Radiation Hardened enhanced low dose rate sensitivity (ELDRS) free requirements. Add 3.1.1. Add appendix A for microcircuit bare die. Add power dissipation limit under 1.3. Table I, output impedance test, under the condition column, delete “VIN = 0 V” and substitute “VIN = 10 V”. - ro 10-05-05 C. SAFFLE K Add device types 03 and 04. - ro 12-08-09 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV K K K K K K SHEET 15 16 17 18 19 20 REV STATUS REV K K K K K K K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK C. OFFICER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY CHARLES E. BESORE APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 89-09-22 REVISION LEVEL K MICROCIRCUIT, LINEAR, 1.0 A, LOW DROPOUT 5 V VOLTAGE REGULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-89587 1 OF 20 5962-E387-12 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 89587 01 X A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 R Federal stock class designator \ RHA designator (see 1.2.1) 89587 02 V X A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 1/ 02 1/ LM2940-5.0 LM2940-5.0 03 1/ 04 1/ LM2940-5.0 LM2940-5.0 Circuit function 1.0 A, low dropout, 5 V regulator Radiation hardened, 1.0 A, low dropout, 5 V regulator 1.0 A, low dropout, 5 V regulator Radiation hardened, 1.0 A, low dropout, 5 V regulator _______ 1/ For case outline X, package material for device types 01 and 02 are aluminum nitride and package material for device types 03 and 04 are aluminum oxide. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals E M GDIP1-T16 or CDIP2-T16 See figure 1 16 3 N U CBCC1-N3 See figure 1 3 3 X 1/ Y GDFP1-G16 MBFM1-P2 16 2 Package style Dual-in-line Flange mount, glass sealed with gull wing leads Bottom terminal chip carrier TO-257, single row flange mount with isolated tab, glass sealed Flat pack with gull wing leads Flange mounted 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Input voltage (VIN): Survival voltage (≤ 100 ms) ..................................................................... Operational voltage ................................................................................. Storage temperature range ......................................................................... Power dissipation (PD) with no heat sink (TA = +25°C) ............................... Lead temperature (soldering, 10 seconds) .................................................. Junction temperature (TJ) ........................................................................... Thermal resistance, junction-to-case (θJC): Device types 01 and 02: Case E ................................................................................................. Case M ................................................................................................. Case N ................................................................................................. Cases U ............................................................................................... Cases X and Y ..................................................................................... Device types 03 and 04: Case X ................................................................................................. 60 V dc 26 V dc -65°C to +150°C 1 W 3/ +300°C +150°C 3°C/W 7.6°C/W 5.9°C/W 3.5°C/W 5°C/W 13°C/W _____ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ With heat sinking, the maximum power is 5 watts, but then this will depend upon the temperature of the heat sink, the efficiency of the heat sink, and the efficiency of the heat flow between the package body and the heat sink. The manufacturer can not predict these values. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 3 1.3 Absolute maximum ratings - continued. 2/ Thermal resistance, junction-to-ambient (θJA): Device types 01 and 02: Case E ................................................................................................. Case M ................................................................................................. Case N ................................................................................................. Case U ................................................................................................. Case X ................................................................................................. Case Y ................................................................................................. Device types 03 and 04: Case X ................................................................................................. 73°C/W 60°C/W 80°C/W 50°C/W 122°C/W 40°C/W 136°C/W still air 87°C/W 500 linear feet per minute (LFPM) 1.4 Recommended operating conditions. Input voltage (VIN) ....................................................................................... 10 V dc Output voltage (IO) ...................................................................................... 1 A Ambient operating temperature range (TA) ................................................. -55°C to +125°C 1.5 Radiation features. Maximum total dose available (dose rate = 10 mrads(Si)/s) ....................... 100 krads(Si) 4/ The manufacturer supplying device types 02 and 04 on this drawing has performed a characterization test to demonstrate that the parts do not exhibit enhanced low dose rate sensitivity (ELDRS) according to MIL-STD-883 Method 1019 paragraph 3.13.1.1. Therefore, device types 02 and 04 may be considered ELDRS free and distinguish them from device types 01 and 03 which are not RHA devices. 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _____ 4/ For device types 02 and 04, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, method 1019, condition D. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 4 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C Group A subgroups VIN = 10 V, IO = 1 A, Device type COUT = 22 µF Limits 3/ Min Unit Max unless otherwise specified Output voltage VOUT VIN = 10 V, IO = 5 mA VIN = 6 V, IO = 5 mA VIN = 7 V, IO = 5 mA VIN = 26 V, IO = 5 mA VIN = 10 V, IO = 1 A VIN = 6 V, IO = 1 A VIN = 6 V, IO = 50 mA VIN = 10 V, IO = 50 mA Maximum line transient VLT VO ≤ 6 V, RO = 100 Ω, 1 01,02, 4.85 5.15 2,3 03,04 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1 4.85 5.15 2,3 4.75 5.25 1,2,3 t = 20 ms 4/ 01,02, V 40 V 03,04 Reverse polarity input voltage dc VRIN RO = 100 Ω 4/ 1,2,3 01,02, 03,04 -15 V Reverse polarity input voltage transient VRIT RO = 100 Ω, t = 20 ms 4/ 1,2,3 01,02, 03,04 -45 V Output noise voltage VON VIN = 10 V, IO = 5 mA, 1,2,3 01,02, 10 Hz – 100 kHz 4/ Quiescent current IQ 700 µV rms mA 03,04 VIN = 10 V, IO = 5 mA VIN = 7 V, IO = 5 mA VIN = 26 V, IO = 5 mA VIN = 10 V, IO = 1 A 1 01,02, 15 2,3 03,04 20 1 15 2,3 20 1 15 2,3 20 1 50 2,3 100 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ 2/ -55°C ≤ TA ≤ +125°C VIN = 10 V, IO = 1 A, Group A subgroups Device type COUT = 22 µF Limits 3/ Min Unit Max unless otherwise specified Line regulation Load regulation VRLN VRLD 1 01,02, ±40 IO = 5 mA 2,3 03,04 ±50 VIN = 10 V, 1 01,02, ±50 2,3 03,04 ±100 1 01,02, 0.7 2,3 03,04 1 7 V ≤ VIN ≤ 26 V, 50 mA ≤ IO ≤ 1 A Dropout voltage VDO IO = 1 A IO = 100 mA Output impedance RO 1 200 2,3 300 1,2,3 VIN = 10 V, 4/ 01,02, 1 mV mV V mV Ω 03,04 IO = 100 mA dc to 20 mA ac, fO = 120 Hz Short circuit current Ripple rejection IOS RR VIN = 10 V VIN = 10 V + 1 V rms, IO = 5 mA, f = 1 kHz 1 01,02, 1.5 2,3 03,04 1.3 4 01,02, 60 5,6 03,04 50 A dB 1/ RHA devices supplied to this drawing are characterized and tested to all levels M, D, P, L, and R of irradiation. Pre and Post irradiation values are identical unless otherwise specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. 2/ For device types 02 and 04, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, method 1019, condition D. 3/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 7 Case outline M Symbol Inches Millimeters Min Max Min Max A .190 .210 4.83 5.33 b --- .030 --- 0.76 D .410 .430 10.41 10.92 D1 .580 .610 14.73 15.49 e --- .100 --- 2.54 e1 --- .200 --- 5.08 E .410 .420 10.41 10.67 L1 .090 .110 2.29 2.79 L .115 .125 2.92 3.18 N 3 3 NOTE: The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 8 Case outline U Letter Inches Millimeters Min Max Min Max A .190 .200 4.83 5.08 A1 .035 .045 0.89 1.14 A2 .120 BSC 3.05 BSC φb .025 .035 0.64 0.89 D .645 .665 16.38 16.89 D1 .410 .430 10.41 10.92 D3 .000 .065 0.00 1.65 e .100 BSC 2.54 BSC E .410 .422 10.41 10.71 L .500 .750 12.70 19.05 O .527 .537 13.39 16.64 φP .140 .150 3.56 3.81 NOTE: The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 9 Device types 01 01 01 01 01, 02, 03, 04 01 Case outlines Terminal number 1 E M N U 1/ X Y 2/ NC INPUT OUTPUT VIN NC INPUT 2 NC GND INPUT GND NC OUTPUT 3 VOUT OUTPUT GND VOUT VOUT --- 4 NC --- --- NC NC --- 5 GND --- --- --- GND --- 6 NC --- --- --- NC --- 7 NC --- --- --- NC --- 8 NC --- --- --- NC --- 9 NC --- --- --- NC --- 10 NC --- --- --- NC --- 11 GND --- --- --- GND --- 12 GND --- --- --- GND --- 13 GND --- --- --- NC --- 14 GND --- --- --- NC --- 15 NC --- --- --- NC --- 16 VIN --- --- --- VIN --- Terminal symbol 1/ Terminal 4 is the tab (see figure 1). 2/ Case is connected to ground. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 11 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 Subgroups (in accordance with MIL-PRF-38535, table III) 1 1 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3, 1/ 4,5,6 1,2,3,4,5,6 1,2,3 1,2,3 1,2,3 1,2,3 Device class Q Device class V 1,2,3, 2/ 4,5,6 1,2,3 --- --- 1,4 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the zero hour electrical parameters (see table I). TABLE IIB. Operating life test delta parameters. TA = +25°C. Parameter Output voltage Load regulation Symbol VO VRLOAD Condition 1/ Device types Min Max Unit 02, 04 -30 30 mV VIN = 6 V, IOUT = 5 mA -30 30 VIN = 7 V, IOUT = 5 mA -30 30 VIN = 26 V, IOUT = 5 mA -30 30 VIN = 10 V, IOUT = 1 A -30 30 VIN = 6 V, IOUT = 1 A -30 30 VIN = 6 V, IOUT = 50 mA -30 30 VIN = 10 V, IOUT = 50 mA -30 30 -20 20 VIN = 10 V, IOUT = 5 mA VIN = 10 V, 02, 04 50 mA ≤ IOUT ≤ 1 A mV 1/ This is worst case drift, deltas are performed at room temperature post operation life. All other parameters, no deltas required. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 12 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition D for device types 02, 04 and as specified herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-0544. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 13 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 14 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 R Federal stock class designator \ RHA designator (see A.1.2.1) 89587 02 V 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 02 Circuit function LM2940-5.0 Radiation hardened, 1.0 A, low dropout, 5 V regulator A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-89587 A REVISION LEVEL K SHEET 15 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 02 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 02 A-1 A.1.2.4.3 Interface materials. Die type Figure number 02 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 02 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 16 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein. A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 17 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 18 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 19 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-89587 Die bond pad coordinate locations (F step). 1/ Signal name Pad number X/Y coordinates X Pad size Y X Y VIN 1 741 427 135 x 140 OUTPUT 2 -652 1007 130 x 140 OUTPUT 3 -652 717 130 x 140 OUTPUT 4 -739 -422 139 x 140 NC 5 -763 -636 90 x 90 NC 6 -763 -760 90 x 78 NC 7 -763 -878 90 x 78 NC 8 -763 -997 90 x 78 NC 9 -763 -1120 90 x 78 GND 10 -583 -1064 139 x 139 NC 11 7 -601 153 x 109 NC 12 148 -957 88 x 78 NC 13 555 -1094 140 x 140 GND 14 637 -133 140 x 140 VIN 15 741 137 135 x 140 1/ Referenced to die center, coordinates in µm. NC = No connection. NU = Not used Die bonding pad locations and electrical functions Die physical dimensions. Die size: 1753.6 µm x 2463.8 µm 69.0 mils x 97.0 mils Die thickness: 304.8 µm nominal Interface materials. Top metallization: AL 0.5 % CU Backside metallization: Bare back Glassivation. Type: Vapox over metal (VOM only) Thickness: 8 kÅ to 12 kÅ Substrate: Silicon Assembly related information. Substrate potential: GND Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions - continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89587 A REVISION LEVEL K SHEET 20 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 12-08-09 Approved sources of supply for SMD 5962-89587 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8958701EA 3/ LM2940J-5.0/883 5962-8958701MA 3/ OM2940-5SRM/883B 5962-8958701NA 3/ OM2940-5N5M/883B 5962-8958701UA 3/ OM2940-5STM 5962-8958701XA 3/ LM2940WG-5.0/883 5962-8958701YA 3/ LM2940K-5.0/883 5962R8958702VXA 3/ LM2940WG5.0RLQV 5962R8958702V9A 27014 LM2940-5.0 MDE 5962-8958703XA 27014 LM2940GW5.0/883 5962R8958704VXA 27014 LM2940GW5.0RLQV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 27014 Vendor name and address National Semiconductor 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.