Protection Device TVS (Transient Voltage Suppressor) ESD114-U1-02 Series Uni-directional, 5.3 V, 0.4 pF, 0402, 0201, RoHS and Halogen Free compliant ESD114-U1-02ELS ESD114-U1-02EL Data Sheet Revision 1.0, 2014-10-30 Final Power Management & Multimarket Edition 2014-10-30 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD114-U1-02 Series Product Overview 1 Product Overview 1.1 Features • • • • • • • ESD / Transient protection of high speed data lines exceeding – IEC61000-4-2 (ESD): ±20 kV (contact) – IEC61000-4-4 (EFT): ±2 kV / ±40 A (5/50 ns) – IEC61000-4-5 (surge): ±3 A (8/20 μs) Maximum working voltage: VRWM = ±5.3 V Ultra low capacitance: CL = 0.4 pF (typical) Very low clamping voltage VCL = +20 / -15 V (typical) at ITLP = 16 A Low dynamic resistance RDYN = 0.5 Ω (typical) Very small form factor down to 0.62 x 0.32 x 0.31 mm3 Pb-free (RoHS compliant) and halogen free package 1.2 • • Application Examples USB 2.0, Mobile HDMI Link, MDDI, MIPI, etc. HDMI, DisplayPort, DVI, Ethernet, Firewire, S-ATA 1.3 Product Description Pin 1 Pin 1 Pin 1 marking (lasered) Pin 2 Pin 2 a) Pin configuration b) Schematic diagram Single _Die_diode_PinConf_and_SchematicDiag.vst .vsd Figure 1 Pin Configuration and Schematic Diagram Table 1 Ordering Information Type Package Configuration Marking code ESD114-U1-02ELS TSSLP-2-3 1 line, uni-directional K ESD114-U1-02EL TSLP-2-19 1 line, uni-directional K FinalData Sheet 4 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Maximum Ratings 2 Maximum Ratings Table 2 Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Values Unit VESD ±20 kV IPP ±3 A Operating temperature range TOP -55 to 125 °C Storage temperature 1) VESD according to IEC61000-4-2 Tstg -65 to 150 °C ESD contact discharge Peak pulse current (tp = 8/20 μs) 2) 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 3 Electrical Characteristics at TA = 25 °C, unless otherwise specified Figure 2 %& ' &( ' &) ' ') !" !!# $ Definitions of Electrical Characteristics FinalData Sheet 5 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Electrical Characteristics at TA = 25 °C, unless otherwise specified Table 3 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Reverse working voltage VRWM Values Unit Note / Test Condition Min. Typ. Max. – – 5.3 V Pin 1 to Pin 2 Breakdown voltage VBR 6 – – V IBR = 1 mA, from Pin 1 to Pin 2 Reverse current IR – <10 100 nA VR = 5.3 V, from Pin 1 to Pin 2 Table 4 RF Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Line capacitance1) CL – 0.4 0.6 pF VR = 0 V, f = 1 MHz Serie inductance LS – 0.2 – nH ESD114-U1-02ELS – 0.4 – nH ESD114-U1-02EL Unit Note / Test Condition V ITLP = 1 A, from Pin 1 to Pin 2 1) Total capacitance line to ground Table 5 ESD Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol VCL Clamping voltage Values Min. Typ. Max. – 10 – – 20 – ITLP = 16 A, from Pin 1 to Pin 2 – 28 – ITLP = 30 A, from Pin 1 to Pin 2 – 3 – ITLP = 1 A, from Pin 2 to Pin 1 – 15 – ITLP = 16 A, from Pin 2 to Pin 1 – 21 ITLP = 30 A, – from Pin 2 to Pin 1 Dynamic resistance 1) RDYN – 0.56 – 0.43 – V Pin 1 to Pin 2 – V Pin 2 to Pin 1 1) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between IPP1 = 10 A and IPP2 = 40 A. FinalData Sheet 6 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Typical Characteristics Diagrams 4 Typical Characteristics Diagrams Typical characteristics diagrams at TA = 25°C, unless otherwise specified 10-2 -3 10 10-4 10-5 10-6 IR [A] 10-7 -8 10 -9 10 10-10 10-11 -12 10 10-13 Figure 3 0 1 2 3 VR [V] 4 5 6 Reverse leakage current:IR = f(VR) 1 0.9 0.8 CL [pF] 0.7 0.6 0.5 0.4 1 MHz 0.3 1 GHz 0.2 Figure 4 0 0.5 1 1.5 2 2.5 3 3.5 VR [V] 4 4.5 5 5.5 6 Line capacitance: CL = f(VR) FinalData Sheet 7 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Typical Characteristics Diagrams 120 Scope: 6 GHz, 20 GS/s 100 VCL [V] 80 VCL-max-peak = 112 V 60 VCL-30ns-peak = 17 V 40 20 0 -20 -50 Figure 5 0 50 100 150 200 tp [ns] 250 300 350 400 450 IEC61000-4-2 : VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 20 Scope: 6 GHz, 20 GS/s 0 VCL [V] -20 -40 -60 VCL-max-peak = -99 V -80 VCL-30ns-peak = -13 V -100 -120 -50 Figure 6 0 50 100 150 200 tp [ns] 250 300 350 400 450 IEC61000-4-2 : VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 FinalData Sheet 8 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Typical Characteristics Diagrams 180 Scope: 6 GHz, 20 GS/s 160 140 VCL [V] 120 VCL-max-peak = 154 V 100 80 VCL-30ns-peak = 25 V 60 40 20 0 -20 -50 Figure 7 0 50 100 150 200 tp [ns] 250 300 350 400 450 IEC61000-4-2 : VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 20 Scope: 6 GHz, 20 GS/s 0 -20 VCL [V] -40 -60 -80 -100 VCL-max-peak = -139 V -120 VCL-30ns-peak = -19 V -140 -160 -180 -50 Figure 8 0 50 100 150 200 tp [ns] 250 300 350 400 450 IEC61000-4-2 : VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 FinalData Sheet 9 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Typical Characteristics Diagrams ESD114-U1-02EL RDYN 20 RDYN = 0.56 Ω 30 15 20 10 10 5 0 0 -10 -5 -20 -10 -30 -15 Equivalent VIEC [kV] ITLP [A] 40 RDYN = 0.43 Ω -40 -35 -30 -25 -20 -15 -10 -5 0 5 VTLP [V] Figure 9 -20 10 15 20 25 30 35 Clamping voltage (TLP): ITLP = f(VTLP) [1], pin 1 to pin 2 FinalData Sheet 10 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Package Information 5 Package Information 5.1 TSSLP-2-3 (mm)[3] Top view Bottom view 0.31 +0.01 -0.02 0.32 ±0.05 0.355 0.62 ±0.05 2 Pin 1 marking 0.05 MAX. 0.26 ±0.035 0.2 ±0.035 1) 1 1) 1) Dimension applies to plated terminals TSSLP-2-3, -4-PO V01 TSSLP-2-3: Package overview 0.19 0.24 Solder mask 0.19 0.57 0.62 Copper 0.19 0.27 0.14 0.32 0.24 Figure 10 Stencil apertures TSSLP-2-3, -4-FP V02 Figure 11 TSSLP-2-3 Footprint 0.35 Tape type Ex Ey Punched Tape 0.43 0.73 Embossed Tape 0.37 0.67 8 Ey 4 Deliveries can be both tape types (no selection possible). Specification allows identical processing (pick & place) by users. Pin 1 marking Figure 12 Ex TSSLP-2-3, -4-TP V03 TSSLP-2-3: Packing 1 Type code Pin 1 marking TSSLP-2-3, -4-MK V01 Figure 13 TSSLP-2-3: Marking (example) FinalData Sheet 11 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Package Information 5.2 TSLP-2-19 (mm)[3] Top view Bottom view 0.31 +0.01 -0.02 0.6 ±0.05 0.05 MAX. 1±0.05 0.65 ±0.05 2 0.25 ±0.035 1) 1 0.5 ±0.035 1) Pin 1 marking 1) Dimension applies to plated terminals TSLP-2-19, -20-PO V01 TSLP-2-19: Package Overview 0.28 0.35 Solder mask 0.38 0.93 1 Copper 0.28 0.45 0.3 0.6 0.35 Figure 14 Stencil apertures TSLP-2-19, -20-FP V01 TSLP-2-19: Footprint 0.93 0.3 0.35 0.28 1 Copper 0.28 0.45 0.35 0.6 Solder mask 0.38 Figure 15 Stencil apertures TSLP-2-19, -20-FP V01 Figure 16 TSLP-2-19: Packing Type code 12 Pin 1 marking TSLP-2-19, -20-MK V01 Figure 17 TSLP-2-19: Marking (example) FinalData Sheet 12 Revision 1.0, 2014-10-30 ESD114-U1-02 Series References References [1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP [2] Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire, ...) using ESD5V3U1U) [3] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package FinalData Sheet 15 Revision 1.0, 2014-10-30 ESD114-U1-02 Series Revision History: Rev.09, 2014-06-20 Page or Item Subjects (major changes since previous revision) Revision 1.0, 2014-10-30 All Status change to Final Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 FinalData Sheet 3 Revision 1.0, 2014-10-30 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG