Protection Device TVS (Transient Voltage Suppressor) ESD205-B1 Series Bi-directional, 5.5 V, 5 pF, 0201, 0402, RoHS and Halogen Free compliant ESD205-B1-02ELS ESD205-B1-02EL Data Sheet Revision 1.4, 2014-05-14 Final Power Management & Multimarket Edition 2014-05-14 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD205-B1 Series Product Overview 1 Product Overview 1.1 Features • • • • • • ESD / transient protection of signal lines in low voltage applications according to: – IEC61000-4-2 (ESD): ±20 kV (air / contact) – IEC61000-4-4 (EFT): ±2.5 kV / ±50 A (5/50 ns) – IEC61000-4-5 (Surge): ±2.5 A (8/20 μs) Bi-directional, working voltage up to VRWM = ±5.5 V Low capacitance: CL = 5 pF (typical) Low clamping voltage: VCL = +10 / -12 V (typical) at ITLP = 16 A Very low reverse current: IR < 1 nA (typical) Pb-free (RoHS compliant) and halogen free package 1.2 • • • Application Examples Keypad, touchpad, buttons, convenience keys LCD displays, Camera, audio lines, mobile communication, Consumer products (E-Book, MP3, DVD, DSC...) Notebooks tablets and desktop computers and their peripherals 1.3 Product Description Pin 1 marking (lasered) Pin 1 Pin 1 Pin 2 Pin 2 PinConf_and_SchematicDiag.vsd Figure 1-1 Pin Configuration and Schematic Diagram Table 1-1 Ordering Information Type Package Configuration Marking code ESD205-B1-02ELS TSSLP-2-3 1 line, bi-directional I ESD205-B1-02EL TSLP-2-19 1 line, bi-directional I Final Data Sheet 3 Revision 1.4, 2014-05-14 ESD205-B1 Series Maximum Ratings 2 Maximum Ratings Table 2-1 Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Values Unit ESD air discharge ESD contact discharge1) VESD ±20 ±20 kV Peak pulse power2) PPK 30 W Peak pulse current2) IPP ±2.5 A Operating temperature range TOP -55 to 125 °C Storage temperature 1) VESD according to IEC61000-4-2 Tstg -65 to 150 °C 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 3 Electrical Characteristics at TA = 25 °C, unless otherwise specified ( )!! %! )* ! +! )#! % ##%# !"!!""!" #$%"&!'!! Figure 3-1 Definitions of electrical characteristics Final Data Sheet 4 Revision 1.4, 2014-05-14 ESD205-B1 Series Electrical Characteristics at TA = 25 °C, unless otherwise specified Table 3-1 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Reverse working voltage VRWM -5.5 – 5.5 V Trigger voltage Vt1 6 – – V Holding voltage Vh 6 8 10 V IT = 1 mA Reverse current IR – <1 100 nA VR = 5.5 V Unit Note / Test Condition Table 3-2 AC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Line capacitance CL 4 – 5 5 7 – pF VR = 0 V, f = 1 MHz VR = 0 V, f = 1 GHz Series inductance LS – – 0.2 0.4 – – nH ESD205-B1-02ELS ESD205-B1-02EL Table 3-3 ESD and SurgeCharacteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Clamping voltage 1) VCL Values Min. Typ. Max. – 10 – Unit Note / Test Condition V ITLP = 16 A, tp = 100 ns from Pin 1 to Pin 2 – 13 – ITLP = 30 A, tp = 100 ns from Pin 1 to Pin 2 – 12 – ITLP = 16 A, tp = 100 ns from Pin 2 to Pin 1 – 17 – ITLP = 30 A, tp = 100 ns from Pin 2 to Pin 1 2) Clamping voltage – 8 – IPP = 1 A, tp = 8/20 µs from Pin 1 to Pin 2 – 8.5 – IPP = 2.5 A, tp = 8/20 µs from Pin 1 to Pin 2 – 8 – IPP = 1 A, tp = 8/20 µs from Pin 2 to Pin 1 – 9 – IPP = 2.5 A,tp = 8/20 µs from Pin 2 to Pin 1 Dynamic resistance 1) RDYN – 0.2 – Ω Pin 1 to Pin 2 – 0.3 – Ω Pin 2 to Pin 1 1) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps. 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 Final Data Sheet 5 Revision 1.4, 2014-05-14 ESD205-B1 Series Typical Characteristics Diagrams 4 Typical Characteristics Diagrams Typical characteristics diagrams at TA = 25°C, unless otherwise specified 10-6 10-7 -8 IR [A] 10 -9 10 10-10 -11 10 10-12 -6 -5 -4 -3 -2 -1 0 1 VR [V] 2 3 4 5 6 5 6 Figure 4-1 Reverse leakage current: IR = f (VR) 7 6 1 GHz CL [pF] 5 4 3 1 MHz 2 1 0 -6 -5 -4 -3 -2 -1 0 VR [V] 1 2 3 4 Figure 4-2 Line capacitance: CL = f (VR) Final Data Sheet 6 Revision 1.4, 2014-05-14 ESD205-B1 Series Typical Characteristics Diagrams 70 60 VCL [V] 50 VCL-max-peak = 45.0 [V] 40 VCL-30ns-peak = 10.7 [V] 30 20 10 0 -10 -100 0 100 200 300 400 500 tp [ns] 600 700 800 900 Figure 4-3 Clamping voltage (ESD): VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 10 0 VCL [V] -10 -20 -30 VCL-max-peak = -66.7 [V] -40 VCL-30ns-peak = -9.7 [V] -50 -60 -70 -100 0 100 200 300 400 500 tp [ns] 600 700 800 900 Figure 4-4 Clamping voltage (ESD) VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 Final Data Sheet 7 Revision 1.4, 2014-05-14 ESD205-B1 Series VCL [V] Typical Characteristics Diagrams 110 100 90 80 70 60 50 40 30 20 10 0 -10 -20 -100 VCL-max-peak = 74.5 [V] VCL-30ns-peak = 12.0 [V] 0 100 200 300 400 500 tp [ns] 600 700 800 900 VCL [V] Figure 4-5 Clamping voltage (ESD) VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -100 VCL-max-peak = -96.9 [V] VCL-30ns-peak = -15.6 [V] 0 100 200 300 400 500 tp [ns] 600 700 800 900 Figure 4-6 Clamping voltage (ESD) VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 Final Data Sheet 8 Revision 1.4, 2014-05-14 ESD205-B1 Series Typical Characteristics Diagrams 40 20 ESD205-B1 Series RDYN 30 15 20 10 10 5 0 0 -10 -5 -20 -10 Equivalent VIEC [kV] ITLP [A] RDYN = 0.2 Ω RDYN = 0.3 Ω -30 -40 -20 -15 -15 -10 -5 0 5 10 15 -20 20 VTLP [V] Figure 4-7 Clamping voltage (TLP): ITLP = f(VTLP)[1], pin 1 to pin 2 Final Data Sheet 9 Revision 1.4, 2014-05-14 ESD205-B1 Series Typical Characteristics Diagrams 4 ESD205-B1 Series 3 2 IPP [A] 1 0 -1 -2 -3 -4 -15 -10 -5 0 VCL [V] 5 10 15 Figure 4-8 Clamping voltage (Surge): IPP = f(VCL)[1], pin 1 to pin 2 Final Data Sheet 10 Revision 1.4, 2014-05-14 ESD205-B1 Series Typical Characteristics Diagrams Figure 4-9 Insertion loss vs. frequency in a 50 Ω system Final Data Sheet 11 Revision 1.4, 2014-05-14 ESD205-B1 Series Package Information 5 Package Information 5.1 TSSLP-2-3 Top view Bottom view 0.31 +0.01 -0.02 0.32 ±0.05 0.355 0.62 ±0.05 2 0.05 MAX. Pin 1 marking 0.26 ±0.035 0.2 ±0.035 1) 1 1) 1) Dimension applies to plated terminals TSSLP-2-3, -4-PO V01 Figure 5-1 TSSLP-2-3 Package outline 0.19 0.24 Solder mask 0.19 0.57 0.14 0.62 Copper 0.19 0.27 0.24 0.32 Stencil apertures TSSLP-2-3, -4-FP V02 Figure 5-2 TSSLP-2-3 Footprint 0.35 Tape type Ex Ey Punched Tape 0.43 0.73 Embossed Tape 0.37 0.67 8 Ey 4 Pin 1 marking Deliveries can be both tape types (no selection possible). Specification allows identical processing (pick & place) by users. Ex TSSLP-2-3, -4-TP V03 Figure 5-3 TSSLP-2-3 Packing Figure 5-4 TSSLP-2-3 Marking example, Type code see: Table 1-1 “Ordering Information” on Page 3 Final Data Sheet 12 Revision 1.4, 2014-05-14 ESD205-B1 Series Package Information 5.2 TSLP-2-19 Top view Bottom view 0.31 +0.01 -0.02 0.6 ±0.05 0.05 MAX. 1±0.05 0.65 ±0.05 2 0.25 ±0.035 1) 1 0.5 ±0.035 1) Pin 1 marking 1) Dimension applies to plated terminals TSLP-2-19, -20-PO V01 Figure 5-5 TSLP-2-19 Package outline 0.28 0.35 Solder mask 0.38 0.93 0.3 1 Copper 0.28 0.45 0.35 0.6 Stencil apertures TSLP-2-19, -20-FP V01 Figure 5-6 TSLP-2-19 Footprint 0.4 1.16 Pin 1 marking 8 4 0.76 TSLP-2-19, -20-TP V02 Figure 5-7 TSLP-2-19 Packing Type code 12 Pin 1 marking Figure 5-8 TSLP-2-19 Marking example, Type code see: Table 1-1 “Ordering Information” on Page 3 Final Data Sheet 13 Revision 1.4, 2014-05-14 ESD205-B1 Series References References [1] Infineon AG - Application Note AN210: Effective ESD Protection design at System Level Using VF-TLP Characterization Methodology [2] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Packages Final Data Sheet 14 Revision 1.4, 2014-05-14 ESD205-B1 Series Revision History: Revision 1.3,.2013-03-08 Page or Item Subjects (major changes since previous revision) Revision 1.4, 2014-05-14 All New type ESD205-B1-02EL inserted Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Final Data Sheet 15 Revision 1.4, 2014-05-14 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG