TVS Diode Transient Voltage Suppressor Diode ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array ESD5V3U4U-HDMI Data Sheet Revision 1.1, 2012-07-03 Final Powermanagement & Multi-Market Edition 2012-07-03 Published by Infineon Technologies AG 81726 Munich, Germany © 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 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ESD5V3U4U-HDMI Revision History Revision 1.0, 2012-06-30 Page or Item Subjects (major changes since previous revision) Revision 1.1, 2012-07-03 7 Figure 2-1 Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 FinalData Sheet 3 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1 Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1.1 Features • • • • • • • ESD / Transient protection of high speed data lines exceeding: – IEC61000-4-2 (ESD): ±20 kV (air / contact) – IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) – IEC61000-4-5 (surge): 3 A (8/20 μs) Maximum working voltage: VR = 5.3 V Very low reverse current: IR < 1 nA typ. Extremely low capacitance: 0.4 pF typ. (I/O to GND) Four-lines protection array with pad pitch = 0.5 mm Flow-through design for optimal PCB layout of differential lines Pb-free package (RoHS compliant) and halogen free package 1.2 • • • Application Examples Protection of high speed digital interfaces like: HDMI 1.3, HDMI 1.4a, MHL, DisplayPort, S-ATA, DVI, MIPI, MDDI USB2.0, 10/100/1000 Ethernet, FireWire 2 Product Description Pin 9 Pin 8 Pin 7 Pin 6 Pin 1 I/O Pin 2 I/O Pin 4 I/O Pin 5 I/O GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 a) Pin configuration b) Schematic diagram Figure 2-1 Pin Configuration and Schematic Diagram Table 2-1 Ordering information Type Package Configuration ESD5V3U4U-HDMI PG-TSLP-9-1 4 lines, uni-directional FinalData Sheet Pin 3 4 Marking code Z1 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 3 Characteristics Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. VESD – – 20 kV IPP – – 3 A Operating temperature range TOP -40 – 125 °C Storage temperature 1) VESD according to IEC61000-4-2 2) IPP according to IEC61000-4-5 Tstg -65 – 150 °C ESD (air / contact) discharge 1) Peak pulse current (tp = 8/20 μs) 3.1 2) Electrical Characteristics at TA = 25 °C, unless otherwise specified RDYN: Dynamic resistance IF VBR: Breakdown voltage VRWM: Maximum working voltage IPP VCL: Clamping voltage RDYN VFC: Forward clamping voltage I PP: Peak pulse current IF VCL VBR VRWM VR VF I RWM VF VFC IR VF: Forward voltage I F: Forward current RDYN VR: Reverse voltage I PP I R: Reverse current IR Diode_Charac teris tic_Curv e_Uni-directional. v sd Figure 3-1 Definitions of Electrical Characteristics Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. Reverse working voltage VRWM – – 5.3 V Breakdown voltage 6 – – V VBR Note / Test Condition IBR = 1 mA (I/O to GND) Reverse current IR – <1 50 nA VR = 5.3 V (I/O to GND) FinalData Sheet 5 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Line capacitance CL Values Min. Typ. Max. – 0.4 0.6 Unit Note / Test Condition pF VR = 0 V, f = 1 MHz (I/O to GND) 1) Line capacitance CL – 0.2 0.3 pF VR = 0 V, f = 1 MHz (I/O to I/O) 1) Total capacitance line to ground Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Clamping voltage1) VCL Values Min. Typ. Max. – 19 – Unit Note / Test Condition V IPP = 16 A (I/O to GND) – 28 – V IPP = 30 A (I/O to GND) Forward clamping voltage1) VFC – 10 – V IPP = 16 A (GND to I/O) – 17 – V IPP = 30 A (GND to I/O) Dynamic resistance 1) RDYN – 0.6 – – 0.5 – Ω I/O to GND GND to I/O 1) Please refer to Application Note AN210 [1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP characteristic between IPP1 = 10 A and IPP2 = 40 A. FinalData Sheet 6 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics Typical Characteristics at TA = 25°C, unless otherwise specified 10 -6 10 -7 10-8 IR [A] 3.2 10 10 -9 -10 10-11 25 50 75 100 125 150 TA [°C] Figure 3-2 Reverse current: IR = f(TA) , VR = 5.3 V, (I/O to GND) 0.8 CL [pF] 0.6 0.4 0.2 0 0 0.5 1 1.5 2 2.5 VR [V] 3 3.5 4 4.5 5 Figure 3-3 Diode capacitance: CL = f(VR), (I/O to GND) FinalData Sheet 7 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 0.7 0.6 CL [pF] 0.5 5.3V 0.4 0V 0.3 0.2 0.1 0 -50 -25 0 25 TA [°C] 50 75 100 2000 2500 3000 Figure 3-4 Line capacitance: CL = f(TA) 0.6 0.5 CL [pF] 0.4 0V 5.3V 0.3 0.2 0.1 0 0 500 1000 1500 f [MHz] Figure 3-5 Line capacitance: CL = f(f), (I/O to GND) FinalData Sheet 8 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics RDYN=0.6Ω 30 ITLP [A] 20 ESD5V3U4U-HDMI RDYN 15 20 10 10 5 0 0 5 10 15 20 25 VTLP [V] 30 35 40 Equivalent VIEC [kV] 40 0 Figure 3-6 Forward clamping voltage: ITLP = f(VTLP), (GND to I/O) [1] 20 ESD5V3U4U-HDMI RDYN RDYN=0.5Ω ITLP [A] 30 15 20 10 10 5 0 0 0 5 10 15 VTLP [V] 20 25 30 Equivalent VIEC [kV] 40 Figure 3-7 Reverse clamping voltage: ITLP = f(VTLP), (I/O to GND) [1] FinalData Sheet 9 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 90 80 70 VCL [V] 60 VCL-max-peak = 82.2 [V] 50 VCL-30ns-peak = 17.3 [V] 40 30 20 10 0 -10 -100 0 100 200 300 400 500 tp [ns] 600 700 800 900 700 800 900 Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV positive pulse, (I/O to GND) 10 0 -10 VCL [V] -20 -30 VCL-max-peak = -76.1 [V] -40 -50 VCL-30ns-peak = -8.9 [V] -60 -70 -80 -90 -100 0 100 200 300 400 500 tp [ns] 600 Figure 3-9 IEC61000-4-2 VCL = f(t), 8 kV negative pulse, (I/O to GND) FinalData Sheet 10 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI VCL [V] Characteristics 110 100 90 80 70 60 50 40 30 20 10 0 -10 -100 VCL-max-peak = 104.8 [V] VCL-30ns-peak = 24.1 [V] 0 100 200 300 400 500 tp [ns] 600 700 800 900 700 800 900 VCL [V] Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV positive pulse, (I/O to GND) 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -100 VCL-max-peak = -105.1 [V] VCL-30ns-peak = -13.7 [V] 0 100 200 300 400 500 tp [ns] 600 Figure 3-11 IEC61000-4-2 VCL = f(t), 15 kV negative pulse, (I/O to GND) FinalData Sheet 11 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Application Information 4 Application Information +5V HDMI Source/Sink 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 TMDS Data2 ESD5V3U4U TMDS Data1 TMDS Data0 ESD5V3U4U TMDS Clock CEC SCL HDMI Type A Connector ESD5V3U4U SDA Hot Plug Detect TMDS Channels CEC Line N.C. DDC (I²C Bus) DDC/CEC GND +5V Hot Plug Detect ESD5V3U1U Figure 4-1 4 lines, uni-directional ESD5V3U4U-HDMI For protection on the 5 V supply rail please refer to ESD5V3U1U- TVS diode data sheet. FinalData Sheet 12 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Ordering Information Scheme (Examples) 5 ESD Ordering Information Scheme (Examples) 0P1 RF - XX YY Package XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP For Radio Frequency Applications Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF) ESD 5V3 U n U - XX YY Package or Application XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP S = SOT363 U = SC74 XX = Application family: LC = Low Clamp HDMI Uni- / Bi-directional or Rail to Rail protection Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines) Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF) Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V) Figure 5-1 Ordering information scheme FinalData Sheet 13 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Package Information 6 Package Information 6.1 PG-TSLP-9-1 Bottom view 1±0.035 A (0.03) 0.59 5 6 0.5 B 7 4 0.94 ±0.025 1) 3 2 0.05 A B 0.4 ±0.025 1) 0.05 A B 4 x 0.5 = 2 (0.05) 0.05 MAX. 0.05 A B 8 1 2.3 ±0.035 0.31+0.01 -0.02 8 x 0.2 ±0.025 1) Top view 9 Pin 1 marking 8 x 0.35 ±0.025 1) 0.05 A B 1) Dimension applies to plated terminals TSLP-9-1-PO V02 Figure 6-1 PG-TSLP-9-1: Package overview 1 Copper 0.3 0.2 0.3 0.3 0.2 0.38 0.3 0.38 0.38 0.38 0.2 0.2 2.3 0.3 0.2 0.2 0.3 0.3 0.3 0.2 2.3 0.3 0.3 0.2 1 0.24 0.24 Stencil apertures Solder mask TSLP-9-1-FP V01 Figure 6-2 PG-TSLP-9-1: Footprint FinalData Sheet 14 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Package Information 0.5 8 2.3 4 Pin 1 marking 1.6 TSLP-9-1-TP V03 Figure 6-3 PG-TSLP-9-1: Packing 1234567 Type code Data code (YYWW) Pin 1 marking TSLP-9-1-MK V02 Figure 6-4 PG-TSLP-9-1: Marking (example) FinalData Sheet 15 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI References References [1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP Characterization Methodology FinalData Sheet 16 Revision 1.1, 2012-07-03 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG