ESD5V3U4U-HDMI Data Sheet (1.5 MB, EN)

TVS Diode
Transient Voltage Suppressor Diode
ESD5V3U4U-HDMI
Uni-directional Ultra-low Capacitance ESD / Transient Protection Array
ESD5V3U4U-HDMI
Data Sheet
Revision 1.1, 2012-07-03
Final
Powermanagement & Multi-Market
Edition 2012-07-03
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
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ESD5V3U4U-HDMI
Revision History Revision 1.0, 2012-06-30
Page or Item
Subjects (major changes since previous revision)
Revision 1.1, 2012-07-03
7
Figure 2-1
Trademarks of Infineon Technologies AG
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CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
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MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
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SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
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Other Trademarks
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development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
FinalData Sheet
3
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Uni-directional Ultra-low Capacitance ESD / Transient Protection Array
1
Uni-directional Ultra-low Capacitance ESD / Transient Protection
Array
1.1
Features
•
•
•
•
•
•
•
ESD / Transient protection of high speed data lines exceeding:
– IEC61000-4-2 (ESD): ±20 kV (air / contact)
– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)
– IEC61000-4-5 (surge): 3 A (8/20 μs)
Maximum working voltage: VR = 5.3 V
Very low reverse current: IR < 1 nA typ.
Extremely low capacitance: 0.4 pF typ. (I/O to GND)
Four-lines protection array with pad pitch = 0.5 mm
Flow-through design for optimal PCB layout of differential lines
Pb-free package (RoHS compliant) and halogen free package
1.2
•
•
•
Application Examples
Protection of high speed digital interfaces like:
HDMI 1.3, HDMI 1.4a, MHL, DisplayPort, S-ATA, DVI, MIPI, MDDI
USB2.0, 10/100/1000 Ethernet, FireWire
2
Product Description
Pin 9
Pin 8
Pin 7
Pin 6
Pin 1
I/O
Pin 2
I/O
Pin 4
I/O
Pin 5
I/O
GND
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
a) Pin configuration
b) Schematic diagram
Figure 2-1
Pin Configuration and Schematic Diagram
Table 2-1
Ordering information
Type
Package
Configuration
ESD5V3U4U-HDMI
PG-TSLP-9-1
4 lines, uni-directional
FinalData Sheet
Pin 3
4
Marking code
Z1
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
3
Characteristics
Table 3-1
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
–
–
20
kV
IPP
–
–
3
A
Operating temperature range
TOP
-40
–
125
°C
Storage temperature
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD (air / contact) discharge
1)
Peak pulse current (tp = 8/20 μs)
3.1
2)
Electrical Characteristics at TA = 25 °C, unless otherwise specified
RDYN: Dynamic resistance
IF
VBR: Breakdown voltage
VRWM: Maximum working voltage
IPP
VCL: Clamping voltage
RDYN
VFC: Forward clamping voltage
I PP: Peak pulse current
IF
VCL
VBR
VRWM
VR
VF
I RWM
VF
VFC
IR
VF: Forward voltage
I F: Forward current
RDYN
VR: Reverse voltage
I PP
I R: Reverse current
IR
Diode_Charac teris tic_Curv e_Uni-directional. v sd
Figure 3-1 Definitions of Electrical Characteristics
Table 3-2
DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
5.3
V
Breakdown voltage
6
–
–
V
VBR
Note /
Test Condition
IBR = 1 mA
(I/O to GND)
Reverse current
IR
–
<1
50
nA
VR = 5.3 V
(I/O to GND)
FinalData Sheet
5
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
Table 3-3
RF Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
1)
Line capacitance
CL
Values
Min.
Typ.
Max.
–
0.4
0.6
Unit
Note /
Test Condition
pF
VR = 0 V, f = 1 MHz
(I/O to GND)
1)
Line capacitance
CL
–
0.2
0.3
pF
VR = 0 V, f = 1 MHz
(I/O to I/O)
1) Total capacitance line to ground
Table 3-4
ESD Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Clamping voltage1)
VCL
Values
Min.
Typ.
Max.
–
19
–
Unit
Note /
Test Condition
V
IPP = 16 A
(I/O to GND)
–
28
–
V
IPP = 30 A
(I/O to GND)
Forward clamping
voltage1)
VFC
–
10
–
V
IPP = 16 A
(GND to I/O)
–
17
–
V
IPP = 30 A
(GND to I/O)
Dynamic resistance
1)
RDYN
–
0.6
–
–
0.5
–
Ω
I/O to GND
GND to I/O
1) Please refer to Application Note AN210 [1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns
to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP characteristic between IPP1 = 10 A and
IPP2 = 40 A.
FinalData Sheet
6
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
Typical Characteristics at TA = 25°C, unless otherwise specified
10
-6
10
-7
10-8
IR [A]
3.2
10
10
-9
-10
10-11
25
50
75
100
125
150
TA [°C]
Figure 3-2 Reverse current: IR = f(TA) , VR = 5.3 V, (I/O to GND)
0.8
CL [pF]
0.6
0.4
0.2
0
0
0.5
1
1.5
2
2.5
VR [V]
3
3.5
4
4.5
5
Figure 3-3 Diode capacitance: CL = f(VR), (I/O to GND)
FinalData Sheet
7
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
0.7
0.6
CL [pF]
0.5
5.3V
0.4
0V
0.3
0.2
0.1
0
-50
-25
0
25
TA [°C]
50
75
100
2000
2500
3000
Figure 3-4 Line capacitance: CL = f(TA)
0.6
0.5
CL [pF]
0.4
0V
5.3V
0.3
0.2
0.1
0
0
500
1000
1500
f [MHz]
Figure 3-5 Line capacitance: CL = f(f), (I/O to GND)
FinalData Sheet
8
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
RDYN=0.6Ω
30
ITLP [A]
20
ESD5V3U4U-HDMI
RDYN
15
20
10
10
5
0
0
5
10
15
20
25
VTLP [V]
30
35
40
Equivalent VIEC [kV]
40
0
Figure 3-6 Forward clamping voltage: ITLP = f(VTLP), (GND to I/O) [1]
20
ESD5V3U4U-HDMI
RDYN
RDYN=0.5Ω
ITLP [A]
30
15
20
10
10
5
0
0
0
5
10
15
VTLP [V]
20
25
30
Equivalent VIEC [kV]
40
Figure 3-7 Reverse clamping voltage: ITLP = f(VTLP), (I/O to GND) [1]
FinalData Sheet
9
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Characteristics
90
80
70
VCL [V]
60
VCL-max-peak = 82.2 [V]
50
VCL-30ns-peak = 17.3 [V]
40
30
20
10
0
-10
-100
0
100
200
300
400 500
tp [ns]
600
700
800
900
700
800
900
Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV positive pulse, (I/O to GND)
10
0
-10
VCL [V]
-20
-30
VCL-max-peak = -76.1 [V]
-40
-50
VCL-30ns-peak = -8.9 [V]
-60
-70
-80
-90
-100
0
100
200
300
400 500
tp [ns]
600
Figure 3-9 IEC61000-4-2 VCL = f(t), 8 kV negative pulse, (I/O to GND)
FinalData Sheet
10
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
VCL [V]
Characteristics
110
100
90
80
70
60
50
40
30
20
10
0
-10
-100
VCL-max-peak = 104.8 [V]
VCL-30ns-peak = 24.1 [V]
0
100
200
300
400 500
tp [ns]
600
700
800
900
700
800
900
VCL [V]
Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV positive pulse, (I/O to GND)
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-100
VCL-max-peak = -105.1 [V]
VCL-30ns-peak = -13.7 [V]
0
100
200
300
400 500
tp [ns]
600
Figure 3-11 IEC61000-4-2 VCL = f(t), 15 kV negative pulse, (I/O to GND)
FinalData Sheet
11
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Application Information
4
Application Information
+5V
HDMI Source/Sink
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
TMDS Data2
ESD5V3U4U
TMDS Data1
TMDS Data0
ESD5V3U4U
TMDS Clock
CEC
SCL
HDMI Type A
Connector
ESD5V3U4U
SDA
Hot Plug Detect
TMDS Channels
CEC Line
N.C.
DDC (I²C Bus)
DDC/CEC GND
+5V
Hot Plug Detect
ESD5V3U1U
Figure 4-1 4 lines, uni-directional ESD5V3U4U-HDMI
For protection on the 5 V supply rail please refer to ESD5V3U1U- TVS diode data sheet.
FinalData Sheet
12
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Ordering Information Scheme (Examples)
5
ESD
Ordering Information Scheme (Examples)
0P1
RF
- XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF)
ESD 5V3 U n U - XX YY
Package or Application
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)
Figure 5-1 Ordering information scheme
FinalData Sheet
13
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Package Information
6
Package Information
6.1
PG-TSLP-9-1
Bottom view
1±0.035
A
(0.03)
0.59
5
6
0.5
B
7
4
0.94 ±0.025 1)
3
2
0.05 A B
0.4 ±0.025 1)
0.05 A B
4 x 0.5 = 2
(0.05)
0.05 MAX.
0.05 A B
8
1
2.3 ±0.035
0.31+0.01
-0.02
8 x 0.2 ±0.025 1)
Top view
9
Pin 1 marking
8 x 0.35 ±0.025 1)
0.05 A B
1) Dimension applies to plated terminals
TSLP-9-1-PO V02
Figure 6-1 PG-TSLP-9-1: Package overview
1
Copper
0.3
0.2
0.3
0.3
0.2
0.38
0.3
0.38
0.38
0.38
0.2
0.2
2.3
0.3
0.2
0.2
0.3
0.3
0.3
0.2
2.3
0.3
0.3
0.2
1
0.24
0.24
Stencil apertures
Solder mask
TSLP-9-1-FP V01
Figure 6-2 PG-TSLP-9-1: Footprint
FinalData Sheet
14
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
Package Information
0.5
8
2.3
4
Pin 1
marking
1.6
TSLP-9-1-TP V03
Figure 6-3 PG-TSLP-9-1: Packing
1234567
Type code
Data code (YYWW)
Pin 1 marking
TSLP-9-1-MK V02
Figure 6-4 PG-TSLP-9-1: Marking (example)
FinalData Sheet
15
Revision 1.1, 2012-07-03
ESD5V3U4U-HDMI
References
References
[1]
Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP
Characterization Methodology
FinalData Sheet
16
Revision 1.1, 2012-07-03
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