Protection Device TVS (Transient Voltage Suppressor) ESD217-B1-02EL Bi-directional, +14 / -8 V, 9 pF, 0402, RoHS and Halogen Free compliant ESD217-B1-02EL Data Sheet Revision 1.1, 2014-11-11 Final Power Management & Multimarket Edition 2014-11-11 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD217-B1-02EL Product Overview 1 Product Overview 1.1 Features • • • • • • • ESD / transient protection according to: – IEC61000-4-2 (ESD): ±30 kV (air), ±25 kV (contact) – IEC61000-4-4 (EFT): ±3 kV / ±60 A (5/50 ns) – IEC61000-4-5 (Surge): ±3 A (8/20 µs) Asymmetrical, bi-directional working voltage up to VRWM = +14 V / -8 V Low capacitance: CL = 9 pF (typical) Low clamping voltage: VCL = 26 V (typical) at ITLP = 16 A Very low reverse current: IR < 1 nA (typical) Ultra low dynamic resistance: RDYN = 0.2 Ω (typical) Pb-free (RoHS compliant) and halogen free package 1.2 • • • • • Application Examples USB 2.0, 10/100 Ethernet, Firewire, DVI Mobile communication Consumer products (STD, MP3, DVD, DSC...) LCD display, camera Notebooks and destop computers, peripherals 1.3 Product Description Pin 1 marking (lasered) Pin 1 Pin 1 Pin 2 Pin 2 PinConf_and_SchematicDiag.vsd Figure 1-1 Pin Configuration and Schematic Diagram Table 1-1 Part Information Type Package Configuration Marking code ESD217-B1-02EL TSLP-2-19 1 line, bi-directional B Final Data Sheet 3 Revision 1.1, 2014-11-11 ESD217-B1-02EL Characteristics 2 Characteristics Table 2-1 Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Values Unit ESD air discharge ESD contact discharge1) VESD ±30 ±25 kV Peak pulse power2) PPK 85 W Peak pulse current2) IPP ±3 A Operating temperature range TOP -55 to 125 °C Storage temperature 1) VESD according to IEC61000-4-2 Tstg -65 to 150 °C 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified $% & %' & %( & &( !" !! # Figure 2-1 Definitions of electrical characteristics Final Data Sheet 4 Revision 1.1, 2014-11-11 ESD217-B1-02EL Characteristics Table 2-2 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Reverse working voltage VRWM Breakdown voltage Reverse current Table 2-3 Values Min. Typ. Max. -8 – 14 14.5 8.5 17 11.5 20 14 – <1 50 VBR IR Unit Note / Test Condition V Pin 2 to Pin1 V IR = 1 mA Pin2 to Pin1 Pin1 to Pin2 nA VR = 3.3 V Unit Note / Test Condition VR = 0 V, f = 1 MHz AC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Line capacitance CL – 9 13 pF Series inductance LS – 0.4 – nH Table 2-4 ESD and Surge Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Clamping voltage1) VCL 2) Clamping voltage Dynamic resistance1) RDYN Values Unit Note / Test Condition V ITLP = 16 A, tp = 100 ns Min. Typ. Max. – 26 – – 29 – ITLP = 30 A, tp = 100 ns – 25.5 – IPP = 3 A, tp = 8/20 µs, Pin2 to Pin1 – 24 – IPP = 3 A, tp = 8/20 µs, Pin1 to Pin2 – 0.2 – – 0.4 – Ω tp = 100 ns, Pin2 to Pin1 tp = 100 ns, Pin1 to Pin2 1) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps. 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 Final Data Sheet 5 Revision 1.1, 2014-11-11 ESD217-B1-02EL Typical Characteristics Diagrams 3 Typical Characteristics Diagrams Typical characteristics diagrams at TA = 25°C, unless otherwise specified 10-3 -4 10 -5 10 10-6 -7 IR [A] 10 10-8 -9 10 10-10 10-11 -12 10 10-13 -8 -6 -4 -2 0 2 4 VR [V] 6 8 10 12 14 12 14 CL [pF] Figure 3-1 Reverse leakage current: IR = f(VR), pin 2 to pin 1 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 MHz 1 GHz -8 -6 -4 -2 0 2 4 VR [V] 6 8 10 Figure 3-2 Line capacitance: CL = f(VR), pin 2 to pin 1 Final Data Sheet 6 Revision 1.1, 2014-11-11 ESD217-B1-02EL Typical Characteristics Diagrams 45 22.5 40 20 35 17.5 30 15 25 12.5 20 ITLP [A] 25 ESD217-B1-02EL RDYN RDYN = 0.2 Ω 10 15 7.5 10 5 5 2.5 0 0 -5 -2.5 -10 -5 -15 -7.5 -20 RDYN = 0.4 Ω Equivalent VIEC [kV] 50 -10 -25 -12.5 -30 -15 -35 -17.5 -40 -20 -45 -22.5 -50 -25 -45-40-35-30-25-20-15-10 -5 0 5 10 15 20 25 30 35 40 45 VTLP [V] Figure 3-3 Clamping voltage (TLP): ITLP = f(VTLP)[1], pin 2 to pin 1 Final Data Sheet 7 Revision 1.1, 2014-11-11 ESD217-B1-02EL Typical Characteristics Diagrams 3.5 3 2.5 2 1.5 1 IPP [A] 0.5 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -30 -25 -20 -15 -10 -5 0 5 VCL [V] 10 15 20 25 30 Figure 3-4 Clamping voltage(Surge): IPP = f(VCL)[1], pin 2 to pin 1 Final Data Sheet 8 Revision 1.1, 2014-11-11 ESD217-B1-02EL Typical Characteristics Diagrams 0 Insertion Loss [dB] -5 -10 -15 -20 ESD217-B1-02EL -25 -30 10 100 1000 10000 f [MHz] Figure 3-5 Insertion loss vs. frequency in a 50 Ω system Final Data Sheet 9 Revision 1.1, 2014-11-11 ESD217-B1-02EL Package Information 4 Package Information 4.1 TSLP-2-19 Top view Bottom view 0.31 +0.01 -0.02 0.6 ±0.05 1±0.05 2 1 0.25 ±0.035 1) 0.65 ±0.05 0.05 MAX. 0.5 ±0.035 1) Pin 1 marking 1) Dimension applies to plated terminals TSLP-2-19, -20-PO V01 Figure 4-1 TSLP-2-19 Package outline 0.28 0.35 Solder mask 0.38 0.93 0.3 1 Copper 0.28 0.45 0.35 0.6 Stencil apertures TSLP-2-19, -20-FP V01 Figure 4-2 TSLP-2-19 Footprint 0.4 1.16 Pin 1 marking 8 4 0.76 TSLP-2-19, -20-TP V02 Figure 4-3 TSLP-2-19 Packing Type code 12 Pin 1 marking TSLP-2-19, -20-MK V01 Figure 4-4 TSLP-2-19 Marking example, Type code see: Table 1-1 “Part Information” on Page 3 Final Data Sheet 10 Revision 1.1, 2014-11-11 ESD217-B1-02EL References References [1] Infineon AG - Application Note AN210: Effective ESD Protection design at System Level Using VF-TLP Characterization Methodology [2] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Packages Final Data Sheet 7 Revision 1.1, 2014-11-11 ESD217-B1-02EL Revision History Rev. 1.0, 2014-05-16 Page or Item Subjects (major changes since previous revision) Revision 1.1, 2014-11-11 3 Table 1-1) updated Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Final Data Sheet 2 Revision 1.1, 2014-11-11 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG