SiZ988DT Datasheet

SiZ988DT
www.vishay.com
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
VDS (V)
Channel-1
30
Channel-2
30
RDS(on) () (MAX.)
ID (A)
0.0075 at VGS = 10 V
40 g
0.0120 at VGS = 4.5 V
32 g
0.0041 at VGS = 10 V
60
0.0052 at VGS = 4.5 V
60
Qg (TYP.)
• Optimized Qgs/Qgs ratio improves switching
characteristics
15.4 nC
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
G2
S2 8
7
APPLICATIONS
m
m
1
m
5m
Top View
D1
• CPU core power
S1/D2
(Pin 9)
D1
6
• 100 % Rg and UIS tested
6.9 nC
PowerPAIR® 6 x 5
S2
S2 6
5
• TrenchFET® Gen IV power MOSFETs
1
2 G
3 D 1
4 D 1
1
D1
Bottom View
• Computer / server peripherals
G1
• POL
N-Channel 1
MOSFET
• Synchronous buck converter
• Telecom DC/DC
S1/D2
G2
Ordering Information:
N-Channel 2
MOSFET
SiZ988DT-T1-GE3 (lead (Pb)-free and halogen-free)
S2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
CHANNEL-1
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed Drain Current (t = 100 μs)
g
ID
IDM
Continuous Source Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
CHANNEL-2
30
+20, -16
VDS
VGS
TJ, Tstg
UNIT
V
a
40
60
32 g
60 a
b,
c
17.5
27 b, c
b,
c
14
21.7 b, c
70
140
16.8
33.6
3.2 b, c
4 b, c
10
20
5
20
20.2
40
12.9
25.8
3.8 b, c
4.8 b, c
2.4 b, c
3.1 b, c
-55 to +150
260
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
TYP.
TYP.
MAX.
MAX.
Maximum Junction-to-Ambient b, f
t  10 s
RthJA
26
33
21
26
Maximum Junction-to-Case (Drain)
Steady State
RthJC
4.7
6.2
2.5
3.1
UNIT
°C/W
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 68 °C/W for channel-1 and 57 °C/W for channel-2.
g. TC = 25 °C.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate Source Leakage
VDS
VGS(th)
IGSS
VGS = 0 V, ID = 250 μA
Ch-1
30
-
-
VGS = 0 V, ID = 250 μA
Ch-2
30
-
-
VDS = VGS, ID = 250 μA
Ch-1
1.2
-
2.4
VDS = VGS, ID = 250 μA
Ch-2
1.1
-
2.2
Ch-1
-
-
± 100
Ch-2
-
-
± 100
Ch-1
-
-
1
Ch-2
-
-
1
Ch-1
-
-
10
Ch-2
-
-
10
Ch-1
25
-
-
Ch-2
25
-
-
VGS = 10 V, ID = 10 A
Ch-1
-
0.0057
0.0075
VGS = 10 V, ID = 19 A
Ch-2
-
0.0028
0.0041
VGS = 4.5 V, ID = 8 A
Ch-1
-
0.0077
0.0120
VGS = 4.5 V, ID = 15 A
Ch-2
-
0.0040
0.0052
VDS = 10 V, ID = 10 A
Ch-1
-
54
-
VDS = 10 V, ID = 10 A
Ch-2
-
52
-
Ch-1
-
1000
-
Ch-2
-
2425
-
VDS = 0 V, VGS = ± 20 V, -16 V
VDS = 30 V, VGS = 0 V
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V, TJ = 55 °C
On-State Drain Current b
Drain-Source On-State Resistance b
Forward Transconductance b
ID(on)
RDS(on)
gfs
VDS  5 V, VGS = 10 V
V
V
nA
μA
A

S
Dynamic a
Input Capacitance
Ciss
Output Capacitance
Coss
Channel-1
VDS = 15 V, VGS = 0 V, f = 1 MHz
Ch-1
-
280
-
Ch-2
-
730
-
Reverse Transfer Capacitance
Crss
Channel-2
VDS = 15 V, VGS = 0 V, f = 1 MHz
Ch-1
-
34
-
Crss / Ciss Ratio
VDS = 15 V, VGS = 10 V, ID = 10 A
Total Gate Charge
Qg
Channel-1
VDS = 15 V, VGS = 4.5 V, ID = 10 A
Gate-Source Charge
Qgs
Channel-2
VDS = 15 V, VGS = 4.5 V, ID = 10 A
Gate-Drain Charge
Qgd
Output Charge
Qoss
VDS = 15 V, VGS = 0 V
Rg
f = 1 MHz
Gate Resistance
S15-2567-Rev. A, 02-Nov-15
Ch-2
-
65
-
Ch-1
-
0.034
0.068
Ch-2
-
0.027
0.054
Ch-1
-
14.3
21.5
Ch-2
-
34
51
Ch-1
-
6.9
10.5
Ch-2
-
15.4
23.1
Ch-1
-
2.8
-
Ch-2
-
5.8
-
Ch-1
-
1.6
-
Ch-2
-
2.6
-
Ch-1
-
7.8
-
Ch-2
-
20
-
Ch-1
0.4
1.6
3.2
Ch-2
0.3
1.7
3.4
pF
nC

Document Number: 66937
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
Dynamic
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
Ch-1
-
15
30
Ch-2
-
20
40
Ch-1
-
10
20
Ch-2
-
15
30
Ch-1
-
15
30
Ch-2
-
25
50
Ch-1
-
7
15
UNIT
a
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
Channel-1
VDD = 15 V, RL = 1.5 
ID  10 A, VGEN = 4.5 V, Rg = 1 
td(off)
Channel-2
VDD = 15 V, RL = 1.5
ID  10 A, VGEN = 4.5 V, Rg = 1 
tf
td(on)
tr
Channel-1
VDD = 15 V, RL = 1.5 
ID  10 A, VGEN = 10 V, Rg = 1 
td(off)
Channel-2
VDD = 15 V, RL = 1.5 
ID  10 A, VGEN = 10 V, Rg = 1 
tf
Ch-2
-
10
20
Ch-1
-
10
20
Ch-2
-
10
20
Ch-1
-
10
20
Ch-2
-
10
20
Ch-1
-
15
30
Ch-2
-
27
50
Ch-1
-
5
10
Ch-2
-
10
20
Ch-1
-
-
16.8
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current (t = 100 μs)
Body Diode Voltage
IS
TC = 25 °C
ISM
VSD
Ch-2
-
-
33.6
Ch-1
-
-
70
Ch-2
-
-
140
IS = 5 A, VGS = 0 V
Ch-1
-
0.77
1.2
IS = 10 A, VGS = 0 V
Ch-2
-
0.8
1.2
Ch-1
-
19
35
Ch-2
-
31
62
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Channel-1
IF = 5 A, dI/dt = 100 A/μs, TJ = 25 °C
Ch-1
-
7
14
Ch-2
-
19
40
Reverse Recovery Fall Time
ta
Channel-2
IF = 10 A, dI/dt = 100 A/μs, TJ = 25 °C
Ch-1
-
10
-
Ch-2
-
14
-
Ch-1
-
9
-
Ch-2
-
17
-
Reverse Recovery Rise Time
tb
A
V
ns
nC
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
70
55
VGS = 10 V thru 4 V
44
VGS = 3 V
ID - Drain Current (A)
ID - Drain Current (A)
56
42
28
14
33
TC = 25 °C
22
11
TC = 125 °C
VGS = 2 V
0
TC = - 55 °C
0
0.0
0.5
1.0
1.5
2.0
2.5
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.020
1200
0.016
960
5
0.012
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
Ciss
VGS = 4.5 V
0.008
VGS = 10 V
720
Coss
480
240
0.004
Crss
0
0.000
0
0
14
28
42
ID - Drain Current (A)
56
5
70
10
20
25
30
Capacitance
On-Resistance vs. Drain Current
1.7
10
ID = 10 A
RDS(on) - On-Resistance (Normalized)
ID = 10 A
VGS - Gate-to-Source Voltage (V)
15
VDS - Drain-to-Source Voltage (V)
8
VDS = 15 V
6
VDS = 10 V
VDS = 20 V
4
2
0
0
3
6
9
12
Qg - Total Gate Charge (nC)
Gate Charge
S15-2567-Rev. A, 02-Nov-15
15
VGS = 10 V
1.5
1.3
VGS = 4.5 V
1.1
0.9
0.7
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 66937
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.030
100
ID = 10 A
0.024
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
10
TJ = 150 °C
TJ = 25 °C
1
0.1
0.018
TJ = 125 °C
0.012
0.006
0.01
TJ = 25 °C
0.000
0.001
0.0
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
0
1.5
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
40
0.5
0.2
- 0.1
Power (W)
VGS(th) - Variance (V)
30
ID = 5 mA
- 0.4
20
ID = 250 μA
10
- 0.7
- 1.0
- 50
- 25
0
25
50
75
100
TJ - Temperature (°C)
125
0
0.001
150
Threshold Voltage
0.01
0.1
1
Time (s)
10
100
1000
Single Pulse Power, Junction-to-Ambient
1000
Limited by RDS(on)*
IDM Limited
ID - Drain Current (A)
100
IDM Limited
10
100 μs
1 ms
10 ms
100 ms
1s
10 s
DC
1
0.1
TA = 25 °C
BVDSS Limited
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
50
20
40
30
Power (W)
ID - Drain Current (A)
15
20
10
5
10
0
0
0
25
50
75
100
125
150
25
50
75
100
125
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating a
Power, Junction-to-Case
150
Note
a. The power dissipation PD is based on TJ (max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 68 °C/W
0.02
Single Pulse
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
0.0001
0.001
0.01
0.1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
80
20
VGS = 10 V thru 4 V
70
16
ID - Drain Current (A)
ID - Drain Current (A)
60
50
40
30
VGS = 3 V
12
TC = 25 °C
8
TC = 125 °C
20
4
TC = - 55 °C
10
0
0
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
0.0050
2.5
3.0
3.5
3000
0.0045
2400
VGS = 4.5 V
C - Capacitance (pF)
Ciss
0.0040
0.0035
0.0030
VGS = 10 V
1800
1200
Coss
600
0.0025
Crss
0.0020
0
0
10
20
30
40
50
60
70
80
0
5
ID - Drain Current (A)
10
15
20
25
VDS - Drain-to-Source Voltage (V)
30
Capacitance
On-Resistance vs. Drain Current
1.6
10
RDS(on) - On-Resistance (Normalized)
ID = 10 A
VGS - Gate-to-Source Voltage (V)
2.0
Transfer Characteristics
Output Characteristics
RDS(on) - On-Resistance (Ω)
1.5
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
8
VDS = 7.5 V
6
VDS = 15 V
VDS = 24 V
4
2
0
0
7
14
21
Qg - Total Gate Charge (nC)
Gate Charge
S15-2567-Rev. A, 02-Nov-15
28
35
ID = 10 A
VGS = 10 V
1.4
VGS = 4.5 V
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 66937
8
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
0.010
ID = 10 A
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.008
TJ = 150 °C
10
TJ = 25 °C
1
0.006
TJ = 125 °C
0.004
TJ = 25 °C
0.002
0.1
0.000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
2.1
40
1.9
30
Power (W)
VGS(th) (V)
1.7
1.5
ID = 250 μA
20
1.3
10
1.1
0.9
- 50
- 25
0
25
50
75
100
125
0
0.001
150
TJ - Temperature (°C)
0.01
0.1
1
Time (s)
10
100
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
1000
1000
Limited by RDS(on)*
IDM Limited
ID - Drain Current (A)
100
IDM Limited
10
100 μs
1 ms
10 ms
100 ms
1s
10 s
DC
1
0.1
TA = 25 °C
BVDSS Limited
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
9
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
40
100
80
60
Power (W)
ID - Drain Current (A)
30
Package Limited
40
20
10
20
0
0
0
25
50
75
100
TC - Case Temperature (°C)
Current Derating a
125
150
25
50
75
100
125
150
TC - Case Temperature (°C)
Power, Junction-to-Case
Note
a. The power dissipation PD is based on TJ (max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
10
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ988DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
PDM
0.1
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 57 °C/W
0.02
Single Pulse
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
0.0001
0.001
0.01
0.1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?66937.
S15-2567-Rev. A, 02-Nov-15
Document Number: 66937
11
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
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Vishay Siliconix
PowerPAIR® 6 x 5 Case Outline
Pin 7
Pin 6
Pin 5
Pin 5
Pin 6
Pin 7
Pin 8
K
L
Pin 8
b
z
L3
2X
A
D
0.10 C
K1
E
E1
D1
Pin 1
Pin 2
0.10 C
Pin 3
Pin 4
Pin 3
Pin 4
2X
E2
D1
Pin 2
Pin # 1 ident
(optional)
Pin 1
e
Back side view
Top side view
0.10 C
A1
A3
b1
A
C
0.08 C
F
F
MILLIMETERS
INCHES
DIM.
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.70
0.75
0.80
0.028
0.030
0.032
A1
0.00
-
0.10
0.000
-
0.004
A3
0.15
0.20
0.25
0.006
0.007
0.009
b
0.43
0.51
0.61
0.017
0.020
0.024
b1
0.25 BSC
0.010 BSC
D
4.90
5.00
5.10
0.192
0.196
0.200
D1
3.75
3.80
3.85
0.148
0.150
0.152
E
5.90
6.00
6.10
0.232
0.236
0.240
E1 Option AA (for W/B)
2.62
2.67
2.72
0.103
0.105
0.107
E1 Option AB (for BWL)
2.42
2.47
2.52
0.095
0.097
0.099
E2
0.87
0.92
0.97
0.034
0.036
0.038
e
1.27 BSC
0.050 BSC
0.018 typ.
K Option AA (for W/B)
0.45 typ.
K Option AB (for BWL)
0.65 typ.
0.025 typ.
K1
0.66 typ.
0.025 typ.
L
0.33
0.43
0.53
0.013
0.017
L3
0.23 BSC
0.009 BSC
z
0.34 BSC
0.013 BSC
0.020
ECN: T14-0782-Rev. C, 22-Dec-14
DWG: 6005
Revision: 22-Dec-14
1
Document Number: 63656
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PAD Pattern
www.vishay.com
Vishay Siliconix
Recommended Minimum PAD for PowerPAIR® 6 x 5
0.28
(0.011)
0.53
(0.021)
2.835
(0.112)
0.45
(0.018)
2.12
(0.083)
2.67
(0.105)
4
(0.157)
(0, 0)
0.55
(0.022)
0.66
(0.026)
1.21
(0.048)
0.92
(0.036)
4
(0.157)
2.13
(0.084)
0.44
(0.017)
2.835
(0.112)
1.905
(0.075)
Pin 1
0.53
(0.021)
1.27
(0.050)
0.66
(0.026)
0.61
(0.024)
Dimensions in millimeters (inch)
Note
• Linear dimensions are in black, the same information is provided in ordinate dimensions which are in blue.
Revision: 16-Feb-15
1
Document Number: 67480
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000