TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series SP6002 Series 15pF 30kV EMI Filter Array RoHS Pb GREEN The Littelfuse SP6002 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Features •ESD,IEC61000-4-2, ±30kV contact, ±30kV air •EMIfilteringof frequencies from 800MHz to 3GHz Pinout 1 •Greaterthan-30dB attenuation (TYP) at 1GHz 4 UDFN-08 •Small,low-profileUDFN package (TYP 0.5mm height) GND 5 8 Applications SP6002-04UTG-1 6 1 GND UDFN-12 12 •Keypadinterfacefor portable electronics •Mobilephone •LCDandcameradisplay interfaces for handsets •Portablenavigation device •Smartphone •Connectorinterfacesfor portable electronics 7 SP6002-06UTG-1 Application Dx:Example SP6003-04 Silicon Protection Array LCD Module Controller Input Functional Block Diagram 4 2 3 4 Cd Cd Cd Cd Cd Cd Cd Cd SP6002-06UTG-1 8 1 7 2 6 3 5 4 5 Cd Cd Cd Cd Outside World 1 GND SP6002-04UTG-1 5 12 11 1 8 D1 D2 D3 D4 SP6002-04UTG (µDFN) Signal Ground 10 Cd Cd 9 Cd Cd 8 Cd Cd 6 7 Cd Cd ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 141 Revision: June 27, 2011 SP6002 Series SP6002 Description TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Units TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C Storage Temperature R ange CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units -65 to 150 °C Maximum J unction Temperature 150 °C Maximum L ead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V 7.8 8.5 V 0.1 1.0 µA 100 115 Ω Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VRWM=5V RA IR=10mA CD VR=2.5V,f=1MHz CL VR=2.5V,f=1MHz 24 IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Resistance Diode Capacitance Line Capacitance 1,2 1,2 ESD Withstand Voltage1 Cutoff Frequency3 VESD 7.0 85 15 30 Above this frequency, appreciable attenutation occurs F-3dB pF 36 100 pF MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination Insertion Loss (S21) CH1 S 21 log MAG Analog Crosstalk (S41) 5 dB/ REF 0 dB 1 _:-613 dB CH1 S Cor Cor Del Smo Smo 10 dB/ log MAG REF 0 dB 1 x2 Start SP6002 Series 3.000 000MHz x2 START 3.000 000 MHz Stop 6 000.000.000MHz 142 Revision: June 27, 2011 STOP 6 000.000 000 MHz ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Soldering Parameters Line Capacitance vs. DC Bias 60 Pb – Free assembly Reflow Condition 40 Pre Heat 30 20 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Product Characteristics Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 200°C - Time (min to max) (ts) 60 – 180 secs TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 150 seconds Peak Temperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Lead Plating - Temperature Max (Ts(max)) 3°C/second max 5.0 DC Bias (V) 150°C Average ramp up rate (Liquidus) Temp (TL) to peak Reflow 0 - Temperature Min (Ts(min)) Notes : 1. All dimensions are in millimeters Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 25 4. All specifications comply to JEDEC SPEC MO-223 Issue A time to peak temperature Time 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Marking System Part Numbering System SP 6002 – 0x U T G -1 Silicon Protection Array (SPA ) Family of TVS Diode Arrays Series TM Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 KH4 G= Green T= Tape & Reel KH6 Package J H x 4 = UDFN-08 6 = UDFN-12 Product Series K = SP6002 UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) Assembly Site Ordering Information Part Number Package Size Marking Min. Order Qty. SP6002-04UTG-1 uDFN-08 1.7x1.35mm KH4 3000 SP6002-06UTG-1 uDFN-12 2.5x1.35mm KH6 3000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 143 Revision: June 27, 2011 SP6002 Series SP6002 Capacitance (pF) 50 TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Package Dimensions — UDFN-12 Package Dimensions — UDFN-08 Min Max 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.00 0.05 0.000 0.002 0.127 REF 0.005 REF 0.25 0.006 0.010 b 0.15 0.25 0.006 0.010 1.80 0.063 0.071 D 2.40 2.60 0.094 0.102 D2 1.10 1.30 0.043 0.051 D2 1.90 2.10 0.075 0.083 E 1.25 1.45 0.049 0.057 E 1.25 1.45 0.049 0.057 E2 0.30 0.50 0.012 0.020 E2 0.30 0.50 0.012 0.020 e 0.400 BSC K 0.20 L 0.15 0.35 0.008 0.000 0.006 0.014 e e b K 0.20 L 0.15 o/ D P2 0.000 0.014 A0 F KO BO 0.008 0.006 t W W F 0.35 P Millimetres Inches Min 0.016 BSC Embossed Carrier Tape & Reel Specification – UDFN-12 oD / Max 0.400 BSC E E E2 D2 0.016 BSC Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 F 3.45 3.55 0.136 0.140 - D1 0.55 0.65 0.021 0.025 D1 D P 10P W 1.00 - 1.50 min 3.90 4.10 40.0 +/- 0.20 7.70 8.30 0.040 D 0.059 min 0.154 P 0.161 10P 1.575 +/- 0.008 0.303 0.327 1.50 min 3.90 4.10 40.0 +/- 0.20 0.059 min 0.154 0.161 1.575 +/- 0.008 W 7.90 8.30 0.311 0.327 P2 1.95 2.05 0.077 0.081 P2 1.95 2.05 0.077 0.081 A0 1.55 1.75 0.061 0.069 A0 1.33 1.53 0.052 0.060 B0 1.90 2.1 0.075 0.083 B0 2.63 2.83 0.103 0.111 0.045 K0 0.58 0.78 0.023 0.031 K0 t SP6002 Series A1 A3 1.60 AO Min 0.022 0.15 t P Max 0.018 b D D1 Min 0.55 D Embossed Carrier Tape & Reel Specification – UDFN-08 P2 Max K0 b Min 0.45 BO e 0.005 REF E 0.127 REF D Inches A L E L K E2 D2 A Max 0.45 A3 Millimeters A1 Min A A3 D UDFN-12 Inches K A1 A3 A UDFN-08 Millimeters 0.95 1.15 0.30 max 0.037 t 0.012 max 144 Revision: June 27, 2011 0.22 max 0.009 max ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.