TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series SP1002 Series 5pF 8kV Bidirectional TVS Array RoHS Pb GREEN Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1002-01JTG SP1002-02JTG (SC70-3) (SC70-5) 1 5 1 NC NC 2 Functional Block Diagram SP1002-01JTG 1 t -PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t &4%QSPUFDUJPOPGL7 contact discharge, ±15kV air discharge, (Level 4, IEC61000-4-2) t 4NBMMQBDLBHFTBWFT board space t -JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2A (8/20μs) t &'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) 4 3 t -PXDBQBDJUBODFPGQ' (TYP) I/O to I/O Applications SP1002-02JTG 1 3 t $PNQVUFS1FSJQIFSBMT t -$%1%157T t .PCJMF1IPOFT t 4FU5PQ#PYFT t %JHJUBM$BNFSBT t %7%1MBZFST t %FTLUPQT/PUFCPPLT t .11.1 Application Example 2 5 4 MultiMedia Device MultiMedia Device Audio Out L Audio In L Audio Out R Audio In R 2 x SP1002-01 SCART MultiMedia Application of SP1002-01 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 27 Revision: April 14, 2011 SP1002 Series SP1002 Description TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value IPP Peak Current (tp=8/20μs) TOP Operating Temperature TSTOR Storage Temperature Parameter Units Rating Units -65 to 150 °C 2 A Storage Temperature Range -40 to 85 °C Maximum Junction Temperature 150 °C °C Maximum Lead Temperature (Soldering 10s) 260 °C -60 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VD IR=1mA 8.0 8.8 9.5 V Reverse Standoff Voltage VRWM IR≤1μA with 1 I/O at GND 6.0 V Leakage Current ILEAK 0.5 μA Voltage Drop Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 VR=5V with I/O at GND IPP=1A, tp=8/20μs, Fwd 9.2 13.0 V IPP=2A, tp=8/20μs, Fwd 11.2 16.0 V (VC2 - VC1) / (IPP2 - IPP1) 2.0 IEC61000-4-2 (Contact) ±8 IEC61000-4-2 (Air) ±15 CD Ω kV kV Reverse Bias=0V 6 pF Reverse Bias=2.5V 5 pF Reverse Bias=5V 5 pF Notes: 1 2 Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals Soldering Parameters Reflow Condition Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C SP1002 Series Temperature TP time to peak temperature 28 Revision: April 14, 2011 Time ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Package Dimensions — SC70-3 Package Solder Pad Layout 1.30 [0.0512] 3 0.65 [0.0256] 0.70 [0.0276] E HE Pins 3 JEDEC MO-203 Issue A Millimeters Min 2 1 e e 1.90 [0.0748] D A2 A A1 L Inches Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e 0.90 [0.0354] C SC70-3 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-5 e e 6 5 not used Package 4 Solder Pad Layout E 1 2 SC70-5 Pins 5 JEDEC MO-203 Issue A HE Millimeters 3 B D A2 A A1 Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e C Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 L Product Characteristics ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 29 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. SP1002 Series 6. Package surface matte finish VDI 11-13. Revision: April 14, 2011 SP1002 B TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Part Numbering System Part Marking System BXX SP 1002 – XX J T G BXX Silicon Protection Array (SPATM) Family of TVS Diode Arrays Product Series Number of Channels B = SP1002 Series G= Green Assembly Site T= Tape & Reel (varies) Series Number of Channels Ordering Information Package -01 = 1 Channel, SC70-3 Package -02 = 2 Channel, SC70-5 Package J = SC70-3 SC70-5 Part Number Package Marking Min. Order Qty. SP1002-01JTG SC70-3 BX1 3000 SP1002-02JTG SC70-5 BX2 3000 Embossed Carrier Tape & Reel Specification — SC70-3 PO Millimetres ØD Min t E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t BO B1 F W E P2 ØD1 P KO AO A1 K1 Max Inches Min Max 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 +/- 0.20 7.70 8.10 3.90 4.10 2.30 2.50 1.00 Ref 2.30 2.50 1.90 Ref 1.10 1.30 0.60 Ref 0.27 max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 +/- 0.008 0.303 0.318 0.153 0.161 0.090 0.098 0.039 Ref 0.090 0.098 0.074 0.043 0.051 0.023 Ref 0.010 Millimetres Inches Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t SP1002 Series 30 Revision: April 14, 2011 Max 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 +/- 0.20 7.70 8.10 3.90 4.10 2.14 2.34 2.24 2.44 1.12 1.32 0.27 max Min Max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 +/- 0.008 0.303 0.318 0.153 0.161 0.084 0.092 0.088 0.096 0.044 0.052 0.010 max ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.