5962P9951708V

REVISIONS
LTR
DESCRIPTION
A
DATE (YR-MO-DA)
APPROVED
99-11-15
R. Monnin
00-07-17
R. Monnin
00-10-03
R. Monnin
00-12-22
R. Monnin
02-05-10
R. Monnin
02-08-01
R. Monnin
02-09-05
R. Monnin
06-07-18
R. Monnin
08-09-25
Robert M. Heber
11-11-14
Charles F. Saffle
12-06-27
Charles F. Saffle
15-03-12
Charles F. Saffle
Add device types 03 and 04. – rrp
Changes made to VRLOAD, IADJ(line), VRLINE, VOUT, and VIN/VOUT
tests in table I. – rrp
Add case outline Z. Make change to 1.2.4, 1.3, and figure 2. - ro
Add footnote to 1.5. Change made to 3.2.3. Remove radiation test
circuits. -rrp
Drawing updated to reflect current requirements. – gt
Make change to the radiation hardened VOUT test maximum limits for
device types 03 and 04 as specified under table I. - ro
Make change to VOUT (Recovery) test as specified in table I for device
types 03 and 04. - ro
Add device type 05 tested at Low Dose Rate. Make changes to 1.2.2,
1.3, 1.4, 1.5, table I, figure 2, table IIB, and 4.4.4.1. Drawing updated
to reflect current requirements. -rrp
Add appendix A, die requirements. Change 1.3, ELDRS dose rate
from 12 mrad(Si)/s to 10 mrad(Si)/s. - drw
Add device types 06 and 07. - drw
B
C
D
E
F
G
H
J
K
L
Add device type 08. - ro
Make correction to the Output voltage recovery after output short
circuit current test by adding the post irradiation limit for device type
08 as specified under Table I. Delete references to device class M
requirements. - ro
M
REV
SHEET
REV
M
M
M
M
M
M
M
M
M
M
SHEET
15
16
17
18
19
20
21
22
23
24
REV STATUS
REV
M
M
M
M
M
M
M
M
M
M
M
M
M
M
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Rajesh Pithadia
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
Rajesh Pithadia
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Raymond Monnin
DRAWING APPROVAL DATE
99-05-13
REVISION LEVEL
M
MICROCIRCUIT, LINEAR, RADIATION
HARDENED, ADJUSTABLE, VOLTAGE
REGULATOR, MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-99517
1 OF 24
5962-E230-15
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
P
99517
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
Q
X
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number
Circuit function
LM137H, WG
LM137K
LM117H, WG
LM117K
LM117H, WG
LM117GW
LM117GW
LM137H
1/
1/
1/
1/
Adjustable, negative, voltage regulator
Adjustable, negative, voltage regulator
Adjustable, positive, voltage regulator
Adjustable, positive, voltage regulator
Adjustable, positive, voltage regulator
Adjustable, positive, voltage regulator
Adjustable, positive, voltage regulator
Adjustable, negative, voltage regulator
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z 1/
Descriptive designator
See figure 1
MBFM1-P2
GDFP1-G16
Terminals
3
2
16
Package style
TO-39 can
Flange mount
Flat pack with gullwing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
_____
1/ For case outline Z, package material for device types 03 and 05 are aluminum nitride and package material for device
types 06 and 07 are aluminum oxide.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
2
1.3 Absolute maximum ratings. 2/
Minimum input voltage (VIN):
Device types 01, 02, and 08 .....................................................................
Maximum input voltage (VIN):
Device types 03, 04, 05, 06 and 07 ...........................................................
Input-output voltage differential ...................................................................
Power dissipation: .......................................................................................
Maximum power dissipation at TA = 25C:
Device types 01 and 08 ...........................................................................
Device type 02 .........................................................................................
Device types 03, 05, 06 and 07 ................................................................
Device type 04 .........................................................................................
Storage temperature range .........................................................................
Lead temperature (soldering, 10 seconds) ..................................................
Maximum junction temperature (TJ) ............................................................
Operating junction temperature ...................................................................
Thermal resistance, junction-to-case (JC):
Case X at 1.0 W (device types 01 and 08) ................................................
Case Y (device type 02) ...........................................................................
Case X (device types 03 and 05) .............................................................
Case Y (device type 04) ...........................................................................
Case Z (device type 01) ...........................................................................
Case Z (device types 03 and 05) .............................................................
Case Z (device types 06 and 07) .............................................................
Thermal resistance, junction-to-ambient (JA):
Case X (device types 01 and 08) .............................................................
Case Y (device type 02) ...........................................................................
Case X (device types 03 and 05) .............................................................
Case Y (device type 04) ...........................................................................
Case Z (device type 01) ...........................................................................
Case Z (device types 03 and 05) .............................................................
Case Z (device types 06 and 07) .............................................................
-41.25 V
41.25 V
40 V
Internally limited 3/
2.5 W
28 W
2W
20 W
-65C to +150C
300C
150C 3/
-55C to +150C
15C/W
4C/W
21C/W
1.9C/W
2.7C/W
3.4C/W 1/
7C/W 1/
140C/W still air at 0.5 W
64C/W 500 LFPM air flow at 0.5 W
40C/W still air
14C/W 500 LFPM air flow
186C/W still air
64C/W 500 LFPM air flow
39C/W still air
14C/W 500 LFPM air flow
108C/W still air at 0.5 W
65C/W 500 LFPM air flow at 0.5 W
115C/W still air at 0.5 W 1/
66C/W 500 LFPM air flow at 0.5 W 1/
130C/W still air 1/
80C/W 500 LFPM air flow 1/
1.4 Recommended operating conditions.
Input voltage range:
Device types 01 02, and 08 ...................................................................... -4.25 V to -41.25 V
Device types 03, 04, 05, 06 and 07 .......................................................... 4.25 V to 41.25 V
Ambient operating temperature range (TA) ................................................. -55C to +125C
______
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ, JA, and TA. The
maximum allowable power dissipation at any temperature is PD = (TJMAX – TA)/JA or the number given in the absolute
maximum ratings, whichever is lower.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
3
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s ):
Device classes Q and V (device types 01, 02, and 08) ............................ 30 krads(Si) 4/
Device classes Q and V (device types 03, 04 and 06) ............................. 100 krads(Si) 4/
Maximum total dose available (dose rate = 10 mrads(Si)/s):
Device classes Q and V (device types 05 and 07) ................................... 100 krads(Si) 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
4/ For device types 01, 02, 03, 04, 06, and 08, these parts may be dose rate sensitive in a space environment and may
demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the
conditions specified in MIL-STD-883, method 1019, condition A.
5/ For device types 05 and 07, these parts have been tested lot acceptance testing at low dose rate (10 mrads(Si)/s) and do not
demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions
specified in MIL-STD-883, test method 1019, condition D. Lot acceptance testing at low dose rate will continue to be
performed on each wafer or wafer lot until characterization testing has been performed in accordance with Method 1019 of
MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Output voltage
Symbol
VOUT
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
Group A
subgroups
Device
type
1
01, 02,
08
VIN = -4.25 V, IL = 5 mA
2, 3
-1.3
-1.2
-1.225
-1.3
-1.2
02
-1.275
-1.225
-1.3
-1.2
1
01, 02,
-1.275
-1.225
2, 3
08
-1.3
-1.2
1
2, 3
VIN = -41.25 V, IL = 5 mA
M, D, P
VIN = -41.25 V, IL = 50 mA
1
08
-1.30
-1.225
1
01, 08
-1.275
-1.225
-1.3
-1.2
1
08
-1.30
-1.225
1
02
-1.275
-1.225
-1.3
-1.2
-9
9
-23
23
2, 3
M, D, P
VIN = -41.25 V,
2, 3
IL = 200 mA
Line regulation
VRLINE
1
VIN = -41.25 V to -4.25 V,
2, 3
IL = 5 mA
M, D, P
Load regulation
VRLOAD
VIN = -6.25 V,
IL = 5 mA to 500 mA
VIN = -41.25 V,
IL = 5 mA to 50 mA
VIN = -6.25 V,
IL = 5 mA to 200 mA
IL = 5 mA to 1.5 A
M, D, P
VIN = -41.25 V,
IL = 5 mA to 200 mA
Thermal regulation
Vrth
01, 02,
08
1
08
-9.0
+50
1
01, 08
-12
12
2, 3
-24
24
1
-6
6
2, 3
-12
12
1
-6
6
2, 3
-12
12
-6
6
2, 3
-12
12
1
VIN = -6.25 V,
Max
-1.225
-1.275
2, 3
VIN = -4.25 V, IL = 1.5 A
Min
-1.275
Unit
01, 08
1
VIN = -4.25 V, IL = 500 mA
Limits
02
1
-7.5
7.5
1
-6
6
2, 3
-12
12
VIN = -14.6 V, IL = 500 mA
1
01, 08
-5
5
VIN = -14.6 V, IL = 1.5 A
1
02
-5
5
V
mV
mV
mV
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Adjust pin current
Iadj
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Max
1, 2, 3
01, 02,
25
100
08
25
100
1
08
25
140
1, 2, 3
01, 02,
08
-5
+5
1
01
-20
+20
1, 2, 3
08
01, 08
-70
-5
+20
5
02
-5
5

01, 08
0.5
1.8
A
0.05
0.5

1.5
3.5

0.2
1

VIN = -4.25 V, IL = 5 mA
VIN = -41.25 V, IL = 5 mA
M, D, P
Adjust pin current
change vs. line voltage
Iadj (line)
VIN = -41.25 V to –4.25 V,
IL = 5 mA
M, D, P
M, D, P
Adjust pin current
change vs. load current
Iadj (load)
VIN = -6.25 V,
Limits
Unit
A
A
A
IL = 5 mA to 500 mA
VIN = -6.25 V,
IL = 5 mA to 1.5 A
Output short circuit
current
IOS
1, 2, 3
VIN = -4.25 V
VIN = -40 V
02
VIN = -4.25 V
VIN = -40 V
Output voltage recovery
after output short circuit
current
VOUT
VIN = -4.25 V
(Recovery)
VIN = -40 V
M, D, P
Minimum load current
Iq
VIN = -4.25 V
1
01, 02,
-1.275
-1.225
V
2, 3
08
-1.3
-1.2

1
01, 02,
-1.275
-1.225

2, 3
08
-1.3
-1.2

1
08
-1.30
-1.225

1, 2, 3
01, 02,
0.2
3
mA
08
0.2
3

1
5

-1.275
-1.225
V
-1.3
-1.2

-1.275
-1.225

-1.3
-1.2

-1.3
-1.2
V
VIN = -14.25 V
VIN = -41.25 V
Voltage start-up
Vstart
1
VIN = -4.25 V, IL = 500 mA
01, 08
2, 3
1
VIN = -4.25 V, IL = 1.5 A
02
2, 3
Output voltage
Ripple rejection
3/
VOUT
VIN = -6.25 V, IL = 5 mA
2
01, 02,
08
VIN /
VIN = -6.25 V, IL = 125 mA,
4
01, 08
48
dB
VOUT
ei = 1 Vrms at 2400 Hz
02
50

VIN = -6.25 V, IL = 500 mA,
ei = 1 Vrms at 2400 Hz
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
Group A
subgroups
Device
type
7
01, 08
Max
120
Vrms
02
120

01, 08
80
mV/V
02
80

01, 08
60
4/
mV
02
60
5/

Limits
Min
Output noise voltage
Vno
VIN = -6.25 V, IL = 50 mA
VIN = -6.25 V, IL = 100 mA
Line transient response
VOUT/VIN
7
VIN = -6.25 V,
Unit
VPULSE = -1 V, IL = 50 mA
VIN = -6.25 V,
VPULSE = -1 V,
IL = 100 mA
Load transient response
VOUT/IL
7
VIN = -6.25 V, IL = 50 mA,
IL = 200 mA
VIN = -6.25 V, IL = 100 mA,
IL = 400 mA
Output voltage
VOUT
1,2,3
VIN = 4.25 V, IL = -5 mA
M,D,P,L,R
VIN = 4.25 V, IL = -500 mA
M,D,P,L,R
VIN = 4.25 V, IL = -1.5 A
M,D,P,L,R
M,D,P,L,R
VIN = 41.25 V, IL = -50 mA
M,D,P,L,R
VIN = 41.25 V, IL = -200
mA
M,D,P,L,R
VRLINE
1.2
1.3
1
07
1.2
1.350
1,2,3
03, 05,
1.2
1.3
1
06, 07
1.2
1.350
1,2,3
04
1.2
1.3
1
VIN = 41.25 V, IL = -5 mA
Line regulation
03, 04,
05, 06,
1.2
1.350
1,2,3
03, 04,
1.2
1.3
1
05, 06,
07
1.2
1.350
1,2,3
03, 05,
1.2
1.3
1
06, 07
1.2
1.350
1,2,3
04
1.2
1.3
1.2
1.350
1
1
VIN = 4.25 V to 41.25 V
IL = -5 mA
M,D,P,L,R
-9
9
2, 3
03, 04,
05, 06,
-23
23
1
07
-25
25
V
mV
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
8
TABLE I. Electrical performance characteristics – Continued.
Test
Load regulation
Symbol
VRLOAD
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
Group A
subgroups
Device
type
1,2,3
03, 05,
VIN = 6.25 V,
Limits
Unit
Min
-12
Max
12
-12
12
-3.5
3.5
2, 3
-12
12
1
-7.0
7.0
1
-3.5
3.5
2, 3
-12
12
mV
06, 07
IL = -500 mA to -5 mA
1,2,3
VIN = 41.25 V,
IL = -50 mA to -5 mA
1
VIN = 6.25 V,
IL = -1.5 A to -5 mA
M,D,P,L,R
VIN = 41.25 V,
IL = -200 mA to -5 mA
M,D,P,L,R
Thermal regulation
Adjust pin current
Adjust pin current
change vs. line voltage
04
-7.0
7.0
VIN = 14.6 V, IL = -500 mA
1
03, 05,
06, 07
-12
12
VIN = 14.6 V, IL = -1.5 A
1
04
-12
12
Iadj
VIN = 4.25 V, IL = -5 mA
1, 2, 3
-100
-15

VIN = 41.25 V, IL = -5 mA
03, 04,
05, 06,
07
-100
-15
Iadj (line)
VIN = 4.25 V to 41.25 V,
1, 2, 3
03, 04,
05, 06,
07
-5
5
A
1, 2, 3
03, 05,
06, 07
-5
5
A
04
-5
5
03, 05,
06, 07
-1.8
-0.5
-0.5
-0.05
-3.5
-1.5
-1
-0.18
Vrth
1
IL = -5 mA
Adjust pin current
change vs. load current
Iadj (load)
VIN = 6.25 V,
mV
A
IL = -500 mA to -5 mA
VIN = 6.25 V,
IL = -1.5 A to --5 mA
Output short circuit
current
IOS
1, 2, 3
VIN = 4.25 V
VIN = 40 V
04
VIN = 4.25 V
VIN = 40 V
A
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
9
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Output voltage recovery
after output short circuit
current
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
VOUT
VIN = 4.25 V, RL = 2.5 ,
(Recovery)
CL = 20 F
Group A
subgroups
Device
type
1, 2, 3
03, 05,
06, 07
M,D,P,L,R
1
1, 2, 3
VIN = 4.25 V, RL = 0.833,
04
Limits
Unit
Min
1.2
Max
1.3
V
1.2
1.350

1.2
1.3

1.2
1.350

CL = 20 F
M,D,P,L,R
1
VIN = 40 V, RL = 250
M,D,P,L,R
Minimum load current
Iq
VIN = 4.25 V,
1, 2, 3
03, 04,
1.2
1.3

1
05, 06,
07
1.2
1.350

1, 2, 3
03, 05,
06, 07
-3
-0.5
mA
-3
-0.5

-5
-1

-3
-0.2
-3
-0.2
-5
-0.2
forced VOUT = 1.4 V
VIN = 14.25 V,
forced VOUT = 1.4 V
VIN = 41.25 V,
forced VOUT = 1.4 V
04
VIN = 4.25 V,
mA
forced VOUT = 1.4 V
VIN = 14.25 V,
forced VOUT = 1.4 V
VIN = 41.25 V,
forced VOUT = 1.4 V
Voltage start-up
Vstart
VIN = 4.25 V, IL = -500 mA,
1, 2, 3
03, 05,
06, 07
1.2
1.3
V
1, 2, 3
04
1.2
1.3

1.3
V
RL = 2.5 , CL = 20 F
VIN = 4.25 V, IL = -1.5 A,
RL = 0.833 , CL = 20 F
Output voltage
Ripple rejection
3/
VOUT
VIN = 6.25 V, IL = -5 mA
2
03, 04,
05, 06,
07
1.2
VIN /
VIN = 6.25 V, IL = -125 mA,
ei = 1 Vrms at 2400 Hz
4
03, 05,
06, 07
65
dB
60

65

60

VOUT
M,D,P,L,R
04
VIN = 6.25 V, IL = -500 mA,
ei = 1 Vrms at 2400 Hz
M,D,P,L,R
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
10
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55C  TA  +125C
unless otherwise specified
Group A
subgroups
Device
type
7
03, 05,
06, 07
Limits
Min
Output noise voltage
Vno
VIN = 6.25 V, IL = -50 mA
VIN = 6.25 V, IL = -100 mA
Line transient response
Load transient response
VOUT /
VIN = 6.25 V, VIN = 3 V,
VIN
IL = -10 mA
7
7
VOUT /
VIN = 6.25 V,
IL
IL = -200 mA, IL = -50 mA
VIN = 6.25 V,
Unit
Max
120
Vrms
04
120

03, 05,
06, 07
6
04
18 6/
03, 05,
06, 07
0.6
mV/mA
04
120
7/
mV
IL = -400 mA,
mV/V
mV
IL = -100 mA
1/ Device types 01, 02, and 08 have been characterized through all levels M, D, P of irradiation. However, these devices are
only tested at the “P” level. Device types 03, 04, 05, 06 and 07 have been characterized through all levels M, D, P, L, R of
irradiation. However, these devices are only tested at the “R” level. Pre and Post irradiation values are identical unless
otherwise specified in table I.
2/ For device types 01, 02, 03, 04, 06, and 08, these parts may be dose rate sensitive in a space environment and may
demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the
conditions specified in MIL-STD-883, method 1019, condition A. For device types 05 and 07, these parts have been tested
and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the
conditions specified in MIL-STD-883, test method 1019, condition D.
3/ Tested at TA = +125C, correlated to TA = +150C.
4/ Limit is equivalent to a limit of 0.3 mV/mA.
5/ Limit is equivalent to a limit of 0.15 mV/mA.
6/ Limit of 6 mV/V is equivalent to 18 mV.
7/ Limit of 0.3 mV/V is equivalent to 120 mV.
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Case X
FIGURE 1. Case outline.
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Case X
Symbol
Inches
Millimeters
Notes
Min
Max
Min
Max
A
.165
.195
4.19
4.95
A1
.100
---
2.54
---
7
b
.016
.019
0.41
0.48
3
b1
.016
.021
0.41
0.53
3
D
.335
.370
8.51
9.40
D1
.305
.335
7.75
8.51
e
.200 BSC
5.08 BSC
5
e1
.100 BSC
2.54 BSC
5
F
---
.050
---
1.27
k
.028
.034
0.71
0.86
k1
.029
.045
0.74
1.14
k2
.009
.041
0.23
1.04
L
.500
----
12.70
----
L1
---
.050
---
1.27
L2
.250
---
6.35
---

45 T.P.
4
5
45 T.P.
NOTES:
1. The US government preferred system of measurement is the metric SI system. However, this item was originally
designed using inch-pound units of measurement. In the event of conflict between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. b applies between L1 and beyond .500 inch (12.70 mm) from the seating plane (two leads). Diameter is uncontrolled in
L1 and beyond .500 inch (12.70 mm) from the seating plane.
Two leads.
Two holes.
Two holes located at true position within diameter .010 inch (0.25 mm).
Leads having a maximum diameter of .043 inch (1.09 mm) measured in gauging plane .054 inch (1.37 mm)  .001 inch
(0.03 mm) .000 inch (0.00 mm) below the seating plane shall be located at true position within diameter .014 inch
(0.36 mm).
7. The mounting surface of the header shall be flat to convex within .003 inch (0.08 mm) inside a .930 inch (23.62 mm)
diameter circle on the center of the header and flat to convex within .006 inch (0.15 mm) overall.
3.
4.
5.
6.
FIGURE 1. Case outline – Continued.
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SIZE
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REVISION LEVEL
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Device types
01, 08
02
03 and 05
04
Case outlines
X
Y 1/
X
Y 2/
Terminal
number
1
ADJUSTMENT
ADJUSTMENT
INPUT
ADJUSTMENT
2
OUTPUT
OUTPUT
ADJUSTMENT
INPUT
3
INPUT
---
OUTPUT
---
Terminal symbol
Device types
01
03, 05, 06 and 07
Case outline
Z 3/
Terminal
number
1
NC
NC
2
NC
NC
3
ADJUSTMENT
ADJUSTMENT
4
INPUT
NC
5
NC
INPUT
6
NC
NC
7
NC
NC
8
NC
NC
9
NC
NC
10
NC
NC
11
OUTPUT SENSE
NC
12
OUTPUT
OUTPUT
13
NC
OUTPUT SENSE
14
NC
NC
15
NC
NC
16
NC
NC
Terminal symbol 4/
1/ For case outline Y, case is input.
2/ For case outline Y, case is output.
3/ For case Z to function properly, the “OUTPUT” and “OUTPUT SENSE” pins must be connected on the
users printed circuit board.
4/ NC = No connection
FIGURE 2. Terminal connections.
STANDARD
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4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. .
4.2.1 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein.
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 5, 6, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
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REVISION LEVEL
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TABLE IIA. Electrical test requirements.
Test requirements
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
Device
class V
Interim electrical
Parameters (see 4.2)
1
1
Final electrical
Parameters (see 4.2)
1, 2, 3, 4 1/
1, 2, 3, 4 1/
Group A test
Requirements (see 4.4)
1, 2, 3, 4, 7
1, 2, 3, 4, 7
Group C end-point electrical
parameters (see 4.4)
1, 2,3
1, 2, 3 2/
Group D end-point electrical
parameters (see 4.4)
1, 2, 3
1, 2, 3
Group E end-point electrical
parameters (see 4.4)
1
1
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified,
and the delta limits shall be computed with reference to the previous
endpoint electrical parameters.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point
electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in
table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A for device types 01, 02, 03, 04, 06 and 08; condition D for device type 05 and 07 and as specified
herein.
4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level
greater than 5 krads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be
the pre-irradiation end-point electrical parameter limit at 25C ±5C. Testing shall be performed at initial qualification and after
any design or process changes which may affect the RHA response of the device.
STANDARD
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Table IIB. Group C end-point electrical parameters. TA = 25C
Parameter
VOUT
Device type
Max
VIN = -4.25 V, IL = 5 mA
-0.01 V
0.01 V
VIN = -4.25 V, IL = 500 mA
-0.01 V
0.01 V
02
VIN = -4.25 V, IL = 1.5 A
-0.01 V
0.01 V
01,02, 08
VIN = -41.25 V, IL = 5 mA
-0.01 V
0.01 V
01, 08
VIN = -41.25 V, IL = 50 mA
-0.01 V
0.01 V
02
VIN = -41.25 V, IL = 200 mA
-0.01 V
0.01 V
VIN = 4.25 V, IL = -5 mA
-0.01 V
0.01 V
VIN = 4.25 V, IL = -500 mA
-0.01 V
0.01 V
04
VIN = 4.25 V, IL = -1.5 A
-0.01 V
0.01 V
03,04,05,06,07
VIN = 41.25 V, IL = -5 mA
-0.01 V
0.01 V
03,05,06,07
VIN = 41.25 V, IL = -50 mA
-0.01 V
0.01 V
04
VIN = 41.25 V, IL = -200 mA
-0.01 V
0.01 V
-4 mV
4 mV
-4 mV
4 mV
01, 02, 08
03,04,05,06,07
03,05,06,07
Iadj
VOUT
(Recovery)
01,02, 08
VIN = -41.25 V to -4.25 V,
IL = 5 mA
03,04,
05,06,07
VIN = 4.25 V to 41.25 V,
01, 02, 08
VIN = -4.25 V, IL = 5 mA
-10 A
10 A
VIN = -41.25 V, IL = 5 mA
-10 A
10 A
03,04,
VIN = 4.25 V, IL = -5 mA
-10 A
10 A
05,06,07
VIN = 41.25 V, IL = -5 mA
-10 A
10 A
-0.01 V
0.01 V
-0.01 V
0.01 V
03,05,06,07
IL = -5 mA
VIN = 4.25 V, RL = 2.5,
CL = 20 F
VIN = 40 V, RL = 250
STANDARD
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Delta limit
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01, 08
Vrline
Conditions
SIZE
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REVISION LEVEL
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5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of
compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing.
STANDARD
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APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
A.1 SCOPE
A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using
chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of
military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number
(PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
A.1.2 PIN. The PIN is as shown in the following example:
5962
R
Federal
stock class
designator
\
RHA
designator
(see A.1.2.1)
03
V
9
A
Device
type
(see A.1.2.2)
Device
class
designator
(see A.1.2.3)
Die
code
Die
details
(see A.1.2.4)
99517
/
\/
Drawing number
A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash
(-) indicates a non-RHA die.
A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
03
05
Generic number
Circuit function
LM117H
LM117H
Adjustable, positive, voltage regulator
Adjustable, positive, voltage regulator
A.1.2.3 Device class designator.
Device class
Q or V
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APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding
pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product
and variant supplied to this appendix.
A.1.2.4.1 Die physical dimensions.
Die type
Figure number
03, 05
A-1
A.1.2.4.2 Die bonding pad locations and electrical functions.
Die type
Figure number
03, 05
A-1
A.1.2.4.3 Interface materials.
Die type
Figure number
03, 05
A-1
A.1.2.4.4 Assembly related information.
Die type
Figure number
03, 05
A-1
A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details.
A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details.
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APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
A.2 APPLICABLE DOCUMENTS.
A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARD
MIL-STD-883 - Test Method Standard Microcircuits.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
A.3 REQUIREMENTS
A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V.
A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1.
A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as
specified in A.1.2.4.2 and on figure A-1.
A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1.
A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1.
A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein.
A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed
in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
21
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of
compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall
affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the
requirements herein.
A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
A.4 VERIFICATION
A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM
plan shall not affect the form, fit, or function as described herein.
A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the
manufacturer’s QM plan. As a minimum, it shall consist of:
a.
Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007.
b.
100% wafer probe (see paragraph A.3.4 herein).
c.
100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the
alternate procedures allowed in MIL-STD-883, method 5004.
A.4.3 Conformance inspection.
A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see
A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of
packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4,
4.4.4.1, and 4.4.4.1.1 herein.
A.5 DIE CARRIER
A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or
as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and
electrostatic protection.
A.6 NOTES
A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with
MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and
logistics purposes.
A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 432183990 or telephone (614)-692-0540.
A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed within MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to
DLA Land and Maritime -VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
22
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
Die bonding pad locations and electrical functions
Die physical dimensions.
Die size: 2184.40 µm x 2362.20 µm
86.0 mils x 93.0 mils
Die thickness: 254 µm
Minimum pitch: 1827.53 µm
Interface materials.
Top metallization: AL 0.5% CU
Backside metallization: Gold
Glassivation.
Type: Vapox over metal only (VOM only)
Thickness: 8 kÅ to 12 kÅ
Substrate: Silicon
Assembly related information.
Substrate potential: Output
Special assembly instructions: None
FIGURE A-1. Die bonding pad locations and electrical functions.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
23
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-99517
Die Bond Pad Coordinate Locations (C-Step)
(Referenced to die center, coordinates in µm) NC = No connection
Signal
Name
Pad
Number
Input
Output
NC
NC
Output
Adj
NC
Input
Output
1
2
3
4
5
6
7
8
9
X/Y Coordinates
X
10
-655
-680
-826
-914
913
800
254
603
Y
986
515
-673
-689
-1000
-996
-391
-91
514
Pad Size
X
213
228
91
88
193
195
208
193
226
Y
210
187
91
170
198
205
208
233
185
X
X
X
X
X
X
X
X
X
FIGURE A-1. Die bonding pad locations and electrical functions - continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-99517
A
REVISION LEVEL
M
SHEET
24
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-03-12
Approved sources of supply for SMD 5962-99517 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9951701VZA
3/
LM137WG-QMLV
5962P9951701QXA
3/
LM137HPQML
5962P9951701QZA
3/
LM137WGPQML
5962P9951701VXA
3/
LM137HPQMLV
5962P9951701VZA
3/
LM137WGPQMLV
5962P9951702QYA
3/
LM137KPQML
5962P9951702VYA
3/
LM137KPQMLV
5962-9951703VZA
3/
LM117WG-QMLV
5962R9951703QXA
3/
LM117HRQML
5962R9951703QZA
3/
LM117WGRQML
5962R9951703V9A
3/
LM117H MDR
5962R9951703VXA
3/
LM117HRQMLV
5962R9951703VZA
3/
LM117WGRQMLV
5962R9951704QYA
3/
LM117KRQML
5962R9951704VYA
3/
LM117KRQMLV
5962R9951705V9A
3/
LM117H MDE
5962R9951705VXA
3/
LM117HRLQMLV
5962R9951705VZA
3/
LM117WGRLQMLV
See footnotes at end of table.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN – CONTINUED.
DATE: 15-03-12
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9951706QZA
3/
LM117GW-QML
5962R9951706VZA
3/
LM117GWRQMLV
5962R9951707VZA
3/
LM117GWRLQMLV
5962P9951708VXA
27014
LM137H1PQMLV
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
27014
National Semiconductor
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2