SiHF6N40D www.vishay.com Vishay Siliconix D Series Power MOSFET FEATURES PRODUCT SUMMARY VDS (V) at TJ max. • Optimal Design - Low Area Specific On-Resistance - Low Input Capacitance (Ciss) - Reduced Capacitive Switching Losses - High Body Diode Ruggedness - Avalanche Energy Rated (UIS) • Optimal Efficiency and Operation - Low Cost - Simple Gate Drive Circuitry - Low Figure-of-Merit (FOM): Ron x Qg - Fast Switching • Compliant to RoHS Directive 2011/65/EU 450 RDS(on) max. at 25 °C () VGS = 10 V 1.0 Qg max. (nC) 18 Qgs (nC) 3 Qgd (nC) 4 Configuration Single D TO-220 FULLPAK Note * Pb containing terminations are not RoHS compliant, exemptions may apply G G D S APPLICATIONS S • Consumer Electronics - Displays (LCD or Plasma TV) • Server and Telecom Power Supplies - SMPS • Industrial - Welding - Induction Heating - Motor Drives • Battery Chargers N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free TO-220 FULLPAK SiHF6N40D-E3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage LIMIT VDS 400 VGS Gate-Source Voltage AC (f > 1 Hz) Continuous Drain Current (TJ = 150 °C)e SYMBOL VGS at 10 V TC = 25 °C TC = 100 °C Pulsed Drain Currenta ID IDM Linear Derating Factor ± 30 UNIT V 30 6 4 A 13 0.24 W/°C Single Pulse Avalanche Energyb EAS 104 mJ Maximum Power Dissipation PD 30 W TJ, Tstg - 55 to + 150 °C Operating Junction and Storage Temperature Range Drain-Source Voltage Slope TJ = 125 °C Reverse Diode dV/dtd Soldering Recommendations (Peak Temperature) for 10 s dV/dt 24 0.48 300c V/ns °C Notes a. Repetitive rating; pulse width limited by maximum junction temperature. b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 , IAS = 9.5 A. c. 1.6 mm from case. d. ISD ID, starting TJ = 25 °C. e. Limited by maximum junction temperature. S12-0687-Rev. A, 02-Apr-12 1 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHF6N40D www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. Maximum Junction-to-Ambient RthJA - 65 Maximum Junction-to-Case (Drain) RthJC - 4.1 UNIT °C/W SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage (N) VDS VGS = 0 V, ID = 250 μA 400 - - V VDS/TJ Reference to 25 °C, ID = 250 μA - 0.53 - V/°C VGS(th) VDS = VGS, ID = 250 μA 3 - 5 V Gate-Source Leakage IGSS VGS = ± 30 V - - ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 400 V, VGS = 0 V - - 1 VDS = 320 V, VGS = 0 V, TJ = 125 °C - - 10 μA - 0.85 1.0 gfs VDS = 50 V, ID = 3 A - 1.7 - S Input Capacitance Ciss 311 - Coss - 38 - Reverse Transfer Capacitance Crss VGS = 0 V, VDS = 100 V, f = 1 MHz - Output Capacitance - 7 - Effective output capacitance, energy relateda Co(er) - 44 - Effective output capacitance, time relatedb Co(tr) - 54 - - 9 18 - 3 - - 4 - Drain-Source On-State Resistance Forward Transconductance RDS(on) VGS = 10 V ID = 3 A Dynamic pF VGS = 0 V, VDS = 0 V to 320 V Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Turn-On Delay Time td(on) - 12 24 tr VDD = 400 V, ID = 3 A, VGS = 10 V, Rg = 9.1 - 11 22 - 14 28 - 8 16 f = 1 MHz, open drain - 1.9 - - - 6 - - 24 - - 1.2 - 236 - ns - 1.1 - μC - 9 - A Rise Time Turn-Off Delay Time VGS = 10 V td(off) Fall Time tf Gate Input Resistance Rg ID = 3 A, VDS = 320 V nC ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS Pulsed Diode Forward Current ISM Diode Forward Voltage VSD Reverse Recovery Time trr Reverse Recovery Charge Qrr Reverse Recovery Current IRRM MOSFET symbol showing the integral reverse p - n junction diode D A G TJ = 25 °C, IS = 3 A, VGS = 0 V TJ = 25 °C, IF = IS = 3 A, dI/dt = 100 A/μs, VR = 20 V S V Notes a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDS. b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS. S12-0687-Rev. A, 02-Apr-12 2 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHF6N40D www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 15 V 14 V 13 V 12 V 11 11 V V 10 V 9V 8V 7V 6V BOTTOM 5 V 3 TOP 12 9 TJ = 25 °C RDS(on), Drain-to-Source On Resistance (Normalized) ID, Drain-to-Source Current (A) 15 6 3 2.5 2 1.5 1 VGS = 10 V 0.5 0 0 5 10 15 20 25 ID = 3 A 0 - 60 - 40 - 20 0 30 VDS, Drain-to-Source Voltage (V) Fig. 4 - Normalized On-Resistance vs. Temperature Fig. 1 - Typical Output Characteristics 1000 10 15 V 14 V 13 V 12 V 11 V 10 V 9V 8V 7V BOTTOM 6 V 8 6 TJ = 150 °C ġ Capacitance (pF) ID, Drain-to-Source Current (A) TOP 4 Ciss VGS = 0 V, f = 1 MHz Ciss = Cgs + Cgd, Cds Shorted ġ Crss = Cgd ġ Coss = Cds + Cgd 100 ġ Coss 10 ġ Crss 2 5V 0 0 5 10 15 20 1 25 0 30 VDS, Drain-to-Source Voltage (V) 50 100 150 200 250 300 350 400 VDS, Drain-to-Source Voltage (V) Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 2 - Typical Output Characteristics 24 VGS, Gate-to-Source Voltage (V) 16 ID, Drain-to-Source Current (A) 20 40 60 80 100 120 140 160 TJ, Junction Temperature (°C) 12 8 TJ = 150 °C 4 TJ = 25 °C VDS = 320 V VDS = 200 V VDS = 80 V 20 16 12 8 4 0 0 0 5 10 15 20 0 25 VGS, Gate-to-Source Voltage (V) Fig. 3 - Typical Transfer Characteristics S12-0687-Rev. A, 02-Apr-12 4 8 12 16 Qg, Total Gate Charge (nC) Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage 3 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHF6N40D www.vishay.com Vishay Siliconix 6 5 TJ = 150 °C 10 ID, Drain Current (A) ISD, Reverse Drain Current (A) 100 TJ = 25 °C 1 0.1 4 3 2 1 VGS = 0 V 0 0.01 0.2 0.4 0.6 0.8 1 1.2 1.4 25 1.6 VSD, Source-Drain Voltage (V) 75 100 125 150 TJ, Case Temperature (°C) Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 9 - Maximum Drain Current vs. Case Temperature 100 500 IDM = Limited 475 VDS, Drain-to-Source Brakdown Voltage (V) ID, Drain Current (A) 50 Limited by RDS(on)* 10 100 μs Operation in this Area Limited by RDS(on) 1 TC = 25 °C TJ = 150 °C Single Pulse 400 10 ms 350 - 60 - 40 - 20 0 10 100 1000 VDS, Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified 20 40 60 80 100 120 140 160 TJ, Junction Temperature (°C) Fig. 8 - Maximum Safe Operating Area Normalized Effective Transient Thermal Impedance 425 375 BVDSS Limited 0.1 1 1 ms 450 Fig. 10 - Temperature vs. Drain-to-Source Voltage 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.02 0.05 Single Pulse 0.01 0.0001 0.001 0.01 0.1 1 Pulse Time (s) Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case S12-0687-Rev. A, 02-Apr-12 4 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHF6N40D www.vishay.com Vishay Siliconix RD VDS QG 10 V VGS D.U.T. RG QGS + - VDD QGD VG 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Charge Fig. 12 - Switching Time Test Circuit Fig. 16 - Basic Gate Charge Waveform Current regulator Same type as D.U.T. VDS 90 % 50 kΩ 12 V 0.2 µF 0.3 µF + 10 % VGS D.U.T. td(on) td(off) tf tr - VDS VGS 3 mA Fig. 13 - Switching Time Waveforms IG ID Current sampling resistors Fig. 17 - Gate Charge Test Circuit L Vary tp to obtain required IAS VDS D.U.T RG + - IAS V DD 10 V 0.01 Ω tp Fig. 14 - Unclamped Inductive Test Circuit VDS tp VDD VDS IAS Fig. 15 - Unclamped Inductive Waveforms S12-0687-Rev. A, 02-Apr-12 5 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiHF6N40D www.vishay.com Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + D.U.T. Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer + - - Rg • • • • + dV/dt controlled by Rg Driver same type as D.U.T. ISD controlled by duty factor “D” D.U.T. - device under test + - VDD Driver gate drive P.W. Period D= P.W. Period VGS = 10 Va D.U.T. lSD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt Re-applied voltage Inductor current VDD Body diode forward drop ISD Ripple ≤ 5 % Note a. VGS = 5 V for logic level devices Fig. 18 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91501. S12-0687-Rev. A, 02-Apr-12 6 Document Number: 91501 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information Vishay Siliconix TO-220 FULLPAK (HIGH VOLTAGE) A E A1 ØP n d1 d3 D u L1 V L b3 A2 b2 c b e MILLIMETERS DIM. A A1 A2 b b2 b3 c D d1 d3 E e L L1 n ØP u v ECN: X09-0126-Rev. B, 26-Oct-09 DWG: 5972 MIN. 4.570 2.570 2.510 0.622 1.229 1.229 0.440 8.650 15.88 12.300 10.360 INCHES MAX. 4.830 2.830 2.850 0.890 1.400 1.400 0.629 9.800 16.120 12.920 10.630 MIN. 0.180 0.101 0.099 0.024 0.048 0.048 0.017 0.341 0.622 0.484 0.408 13.730 3.500 6.150 3.450 2.500 0.500 0.520 0.122 0.238 0.120 0.094 0.016 2.54 BSC 13.200 3.100 6.050 3.050 2.400 0.400 MAX. 0.190 0.111 0.112 0.035 0.055 0.055 0.025 0.386 0.635 0.509 0.419 0.100 BSC 0.541 0.138 0.242 0.136 0.098 0.020 Notes 1. To be used only for process drawing. 2. These dimensions apply to all TO-220, FULLPAK leadframe versions 3 leads. 3. All critical dimensions should C meet Cpk > 1.33. 4. All dimensions include burrs and plating thickness. 5. No chipping or package damage. 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