DATASHEET

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Add two packages, C-5 and C-4. Make changes to table I, and throughout.
For case X, the dimensions have been changed and figure 2 has been
replaced with D-10 configuration. Inactivate devices 01XX and 02XX for new
design. Use M38510 device. Add a truth table.
90-01-24
M. A. Frye
B
Add device types 05, 06, 07, and 08. Add vendors CAGES 1ES66, OH9K9,
and 33256. Editorial changes throughout.
93-03-15
M. A. Frye
C
Add class V devices. Add Z package. Editorial changes throughout.
97-04-15
R. Monnin
D
Changes in accordance with NOR 5962-R368-97. – drw
97-06-23
Raymond Monnin
E
Change descriptive designator for case outline Z from GDFP2-F28 to
CDFP3-F28. Editorial changes throughout. Redrawn. - drw
99-12-30
Raymond Monnin
F
Sheet 7, table I, VIL test, change max limit from –0.8 V to 0.8 V. - drw
00-03-01
Raymond Monnin
G
Add radiation features and post irradiation limits. - drw
01-05-16
Raymond Monnin
H
Add device type 01 to the post irradiation limits in table I. - drw
02-07-10
Raymond Monnin
J
Sheet 6, table I, Integral linearity error test (ILE), post irradiation limits for
device types 01 and 02, subgroup 1, change from -1.0 LSB min to
-1.5 LSB min and from 1.0 LSB max to 1.5 LSB max.
03-04-25
Raymond Monnin
K
Redrawn. Update paragraphs to MIL-PRF-38535 requirements. - drw
15-08-13
Charles F. Saffle
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED
REV
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REV
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15
16
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18
19
20
REV STATUS
REV
K
K
K
K
K
K
K
K
K
K
K
K
K
K
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Sandra B. Rooney
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
Charles E. Besore
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Michael A. Frye
DRAWING APPROVAL DATE
86-07-10
REVISION LEVEL
K
MICROCIRCUIT, LINEAR, MICROPROCESSOR
COMPATIBLE, 12-BIT ANALOG TO DIGITAL
CONVERTERS, MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-85127
1 OF 20
5962-E433-15
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
85127
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
X
A
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
For device class V:
5962
-
85127
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
V
X
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
574AU
02
574AT
03
574AU
04
574AT
05
574ZA
06
574ZB
07
574AU
08
574AT
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Circuit function
Monolithic, high performance, 12-bit A/D converter with
microprocessor interface
Monolithic, medium performance, 12-bit A/D converter with
microprocessor interface
Multi-chip, high performance, 12-bit A/D converter with
microprocessor interface
Multi-chip, medium performance, 12-bit A/D converter with
microprocessor interface
Monolithic, high performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, medium performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, high performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, medium performance, low power, 12-bit A/D converter
with microprocessor interface
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
2
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
Outline letter
X
Y
Z
3
Descriptive designator
Terminals
GDIP1-T28 or CDIP2-T28
CQCC1-N44
CDFP3-F28
CQCC1-N28
28
44
28
28
Package style
dual-in-line
square leadless chip carrier
flat pack
square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
VCC to digital common ....................................................................................................
VEE to digital common ....................................................................................................
VLOG to digital common ..................................................................................................
Analog to digital common:
Device types 01, 02, 03, 04 ........................................................................................
Device types 05, 06, 07, 08 ........................................................................................
Control inputs (CE, CS, AO, 12/8, R/C) to digital common .............................................
Analog inputs (REF IN, BIP OFF, 10 VIN) to analog common ........................................
20 VIN analog input voltage to analog common ..............................................................
VREF OUT ..........................................................................................................................
Power dissipation at 75°C:
Device types 01, 02, 05, 06, 07, 08 ............................................................................
Device types 03, 04 ....................................................................................................
Lead temperature (soldering, 10 seconds) ....................................................................
Storage temperature ......................................................................................................
Thermal resistance, junction-to-ambient (θJA):
Cases X and 3 ............................................................................................................
Case Y........................................................................................................................
Case Z ........................................................................................................................
Thermal resistance, junction-to-case (θJC) .....................................................................
Junction temperature (TJ)...............................................................................................
0 to +16.5 V dc
0 to -16.5 V dc
0 to +7 V dc
+1 V dc
-0.5 V dc to +1 V dc
-0.5 V dc to VLOG +0.5 V dc
VEE to VCC
+24 V dc
Indefinite short to common,
10 ms short to VCC
1,000 mW 2/
2,080 mW 2/
+300°C
-65°C to +150°C
70°C/W
38°C/W
60°C/W
See MIL-STD-1835
+175°C
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For cases X and 3, derate linearly above TA = +75°C at 20.8 mW/°C.
For cases Y, derate linearly above TA = +75°C at 22.7 mW/°C.
For cases Z, derate linearly above TA = +115°C at 17 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
3
1.4 Recommended operating conditions.
Power supply
Operating voltage range:
Positive supply (VLOG) .............................................................................................
Positive supply (VCC) ...............................................................................................
Negative supply (VEE)..............................................................................................
Ambient operating temperature range ...........................................................................
+4.5 V dc to +5.5 V dc
+11.4 V dc to +16.5 V dc
-11.4 V dc to -16.5 V dc
-55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rad(Si)/s) ..................................... ≤100 Krads (Si)
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Block diagrams. The block diagrams shall be as specified on figure 3.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 81 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TA ≤ +125°C
VCC = +15 V, VLOG = +5 V,
VEE = -15 V 1/
Group A
subgroups
Device
type
1, 2, 3
01, 02,
03, 04
1
01, 02
40
1, 2, 3
05, 06,
07, 08
1
1, 2, 3
01, 02
5
1
01, 02
5
03, 04
15
05, 06,
07, 08
9
unless otherwise specified
Power supply current
From VLOG
Min
ILOG
M, D, P, L, R
Power supply current
ICC
M, D, P, L, R
From VCC
1, 2, 3
Power supply current
IEE
1, 2, 3
M, D, P, L, R
From VEE
Resolution
Integral linearity error
ILE
DLE
TA = +25°C
M, D, P, L, R
Unipolar offset drift
2/
∆VIO
Using internal reference
mA
mA
1
01, 02
-30
1, 2, 3
05, 06,
07, 08
0
1, 2, 3
All
12
1
All
-0.5
0.5
mA
Bits
-1.0
1.0
1
01, 02
-1.5
1.5
1
All
12
LSB
Bits
12
1
All
-2.0
2.0
1
01, 02
-3.0
3.0
12
01
-1.0
1.0
01, 02
-1.0
1.0
LSB
LSB
1, 2, 3
∆T
Max
40
-30
2, 3
VIO
Unit
01, 02,
03, 04
2, 3
M, D, P, L, R
Differential linearity error
(minimum resolution for
which no missing codes
guaranteed)
2/
Unipolar offset voltage error
Limits
3/
2, 3
LSB
03, 04
05, 06
07, 08
Bipolar offset voltage error
BZ
TA = +25°C
M, D, P, L, R
Bipolar zero offset drift
2/
∆BZ
Using internal reference
1
All
-4.0
4.0
1
01, 02
-5.0
5.0
12
01
-2.0
2.0
01
-1.0
1.0
-2.0
2.0
1, 2, 3
T
3/
2, 3
1, 2, 3
2, 3
LSB
03,
05, 07
3/
02
04,
06, 08
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
6
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
∆AE
Gain error
Conditions
-55°C ≤ TA ≤ +125°C
VCC = +15 V, VLOG = +5 V,
VEE = -15 V 1/
Group A
subgroups
Device
type
unless otherwise specified
TA = +25°C
1
01, 02
Max
0.25
% of
M, D, P, L, R
1
01, 02
0.35
F.S.
1
03, 04,
0.30
Min
With 50Ω resistor from
REF OUT to REF IN
∆AE
2/
∆T
Unit
05, 06,
07, 08
12
Gain error drift
Limits
Using internal reference
1, 2, 3
01
3/
2, 3
0.125
01
-12.5
12.5
-25.0
25.0
ppm/°C
03,
05, 07
1, 2, 3
Power supply sensitivity
+PSS1
02
2, 3
04,
06, 08
1
All
-1.0
1.0
1
All
-0.5
0.5
1
All
-1.0
1.0
LSB
TA = +25°C
(Maximum change in
full scale calibration)
+13.5 V < VCC < +16.5 V
3/
+PSS2
+11.4 V < VCC < +12.6 V
TA = +25°C
2/
+PSS3
+4.5 V < VLOG < +5.5 V
TA = +25°C
-PSS1
-16.5 V < VEE < -13.5 V
TA = +25°C
-PSS2
-12.6 V < VEE < -11.4 V
TA = +25°C
Input Impedance
ZIN
2/
10 V span, TA = +25°C
4
All
3
7
20 V span, TA = +25°C
4
01, 02,
6
14
05, 06,
07, 08
15
25
1
01, 02
9.98
10.02
1
01, 02
9.95
10.05
1
03, 04
07, 08
9.90
10.10
kΩ
03, 04
Internal reference voltage
VREF
TA = +25°C
4/
M, D, P, L, R
Output current
2/, 5/
IO
Available for external loads
05, 06
9.97
10.03
12
01
9.99
10.01
1
01, 02,
1.5
V
mA
03, 04
TA = +25°C
05, 06,
07, 08
2.0
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
7
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Input voltage (CE, CS, 12/8,
R/C, AO)
2/, 6/
VIH
Input current
Conditions
-55°C ≤ TA ≤ +125°C
VCC = +15 V, VLOG = +5 V,
VEE = -15 V 1/
Group A
subgroups
Device
type
1
01, 02,
05, 06,
07, 08
unless otherwise specified
Logic “1”, TA = +25°C
(DB11-DB0)
IIN
TA = +25°C
1
01, 02,
03, 04,
07, 08
-20
+20
05,06
-1
VOL
Logic “0”, TA = +25°C,
ISINK = +1.6 mA
1
All
VOH
Logic “1”, TA = +25°C,
1
All
2.4
ISOURCE = +500 µA
1
High-Z state, TA = +25°C,
DB11 – DB0 only
1
01, 02,
03, 04,
07, 08
-20
+20
05, 06
-5
+5
IZ
See 4.4.1b, TA = +25°C
All
9, 10, 11
01, 02
250
03, 04
350
05, 06,
07, 08
50
9, 10, 11
tDS
2/, 7/
High R/C pulse width
01, 02,
03, 04
600
05, 06,
07, 08
200
03, 04
15
See figure 4
9, 10, 11
01, 02,
05, 06,
07, 08
300
1000
03, 04
300
1200
See figure 4
9, 10, 11
01, 02,
03, 04
300
05, 06,
07, 08
150
tHRH
2/, 8/
µA
ns
01, 02,
05, 06,
07, 08
tHS
V
V
9, 10, 11
2/, 7/
µA
1
See figure 4
tHDR
V
0.4
7
tHRL
See figure 4
STS delay after valid data
2/,7/
5.5
0.8
2/, 7/
Data valid after R/C low
2.4
-0.5
See figure 4
STS delay from R/C
03, 04
All
Functional tests
Low R/C pulse width
Max
5.5
1
2/
High impedance state
output current
2/
Min
2.0
Logic “0”, TA = +25°C
2/
Output voltage
Unit
VIL
2/
Output voltage
(DB11-DB0, STS)
Limits
ns
25
ns
ns
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
8
TABLE I. Electrical performance characteristics – continued.
Conditions
Test
Data access time
2/, 8/
STS delay from CE
2/, 8/
CE pulse width
2/, 8/
Conversion time
Symbol
tDDR
tDSC
tHEC
tC
-55°C ≤ TA ≤ +125°C
VCC = +15 V, VLOG = +5 V,
VEE = -15 V 1/
Group A
subgroups
Device
type
9, 10, 11
01, 02,
03, 04
unless otherwise specified
See figure 4
Min
See figure 4
9, 10, 11
See figure 5
9, 10, 11
8-bit cycle
9, 10, 11
See figure 5
2/, 9/
12-bit cycle
9, 10, 11
See figure 5
Access time (from CE)
tDD
Limits
See figure 6
9, 10, 11
2/, 7/
Data valid after CE low
2/, 7/
tHD
See figure 6
9, 10, 11
Output float delay
tHL
See figure 6
9, 10, 11
2/, 7/
Unit
Max
250
05, 06,
07, 08
150
01, 02,
03, 04
350
05, 06,
07, 08
200
01, 02,
03, 04
300
05, 06,
07, 08
50
01,02 5/
10
24
03, 04,
05, 06,
07, 08
10
17
01,02 5/
15
35
03, 04,
05, 06,
07, 08
15
25
200
03, 04
250
05, 06,
07, 08
150
25
03, 04
15
ns
ns
01, 02
01, 02,
05, 06,
07, 08
ns
µs
ns
ns
01, 02
100
03, 04,
05, 06,
07, 08
150
ns
1/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However, this
device is only tested at the “R” level. Pre and post irradiation values are identical unless otherwise specified in table I. When
performing post irradiation electrical measurements for any RHA level, TA = +25°C.
2/ This parameter is not tested post irradiation.
3/ Guaranteed to the limits specified, if not tested for subgroup 1.
4/ The reference voltage external load current shall be a constant dc and shall not exceed 1.5 mA.
5/ Reference should be buffered for operation on +12 V supplies. External load should not change during conversion.
6/ For devices 01 and 02, 12/8 is not TTL compatible and must be hard wired to VLOG or digital ground.
7/ Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits.
8/ Parameters tHRH, tDDR, tDSC, and tHEC, if not tested, shall be guaranteed to the specified limits.
9/ For devices 03 and 04, time measured from 50 percent level of digital transitions, tested with 50 pF and 3.0 kΩ load.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
9
Device types
All
01, 02
01, 02, 05, 06, 07, 08
03, 04
Case outlines
X
Z
3
Y
Terminal
number
1
Terminal symbol
Terminal symbol
VLOG
VLOG
2
3
4
12/8
12/8
CS
AO
CS
AO
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
R/C
CE
VCC
REF OUT
AGND
REF IN
VEE
BIP OFF
10 VIN
20 VIN
DGND
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
DB9
DB10
DB11 (MSB)
STS
NC
NC
NC
NC
R/C
CE
VCC
REF OUT
AGND
REF IN
VEE
NC
BIP OFF
10 VIN
20 VIN
NC
NC
NC
NC
DGND
NC
NC
DB0
DB1
DB2
NC
DB3
DB4
DB5
DB6
DB7
DB8
DB9
NC
NC
NC
NC
DB10
DB11 (MSB)
STS
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
10
CE
CS
R/C
12/8
AO
Operation
0
X
X
1
X
X
X
X
X
X
None
None
1
1
0
0
0
0
X
X
0
1
Initiate 12-bit conversion
Initiate 8-bit conversion
1
0
1
1
X
Enable 12-bit parallel output
1
1
0
0
1
1
0
0
0
1
Enable 8 most significant bits
Enable 4 LSBs + 4 trailing zeros
FIGURE 2. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
11
Device types 01, 02, 03, and 04
NOTE: For device types 03 and 04, the resistor value is 9.95 kΩ.
FIGURE 3. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
12
Device types 05, 06, 07, and 08
FIGURE 3. Block diagram - continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
13
B
O
FIGURE 4. High/low pulse for R/C outputs.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
14
FIGURE 5. Convert start diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
15
FIGURE 6. Read cycle timing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
16
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Optional subgroup 12, for device 01, is used for grading the part selection at 25°C.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
17
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
c.
Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
d.
Optional subgroup 12, for device 01, is used for grading the part selection at 25°C.
TABLE IIA. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Device
class Q
Device
class V
1
1
1
1/
1, 2, 3, 4, 12
1/
1, 2, 3, 4, 12
1/, 2/
1, 2, 3, 4, 12
1, 2, 3, 4, 7, 9,
10, 11, 12
1, 2, 3, 4, 7, 9,
10, 11, 12
1, 2, 3, 4, 7, 9,
10, 11, 12
1, 4
1, 4
2/
1, 4
1, 4
1, 4
1, 4
---
---
1
Subgroups
(in accordance with
MIL-PRF-38535, table III)
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed
with reference to the previous interim electrical parameters.
TABLE IIB. 240 hour burn-in and group C end-point electrical parameters.
Test title
Endpoint limits
Delta limits
Units
2
+0.5
LSB
-5.5
4.5
+1
LSB
-0.35
0.35
+.10
%FSR
Min
Max
Uni Vio
-1
Bpze
Ae
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
18
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table IIA herein.
c.
When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
19
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
VLOG
12/8
CS
A0
R/C
CE
VCC
REF OUT
AGND
REF IN
VEE
BIP OFF
VIN
DGND
D0-D11
STS
NC
Logic supply
Data mode select input
Chip select input
Byte address/short cycle input
Read/convert input
Chip enable input
Positive power supply
Reference output
Analog ground
Reference input
Negative power supply
Bipolar offset input
Span input
Digital ground
Tree-state data outputs
Status output
No connection
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of
compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-85127
A
REVISION LEVEL
K
SHEET
20
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-08-13
Approved sources of supply for SMD 5962-85127 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
5962-85127013A
5962-8512701XA
5962-8512701XC
5962-8512701VXA
5962-8512701VZA
5962R8512701VXA
5962R8512701VZA
5962-85127023A
5962-85127023C
Vendor
CAGE
number
24355 (2)
24355 (2)
3/
3/
3/
24355 (4)
24355 (4)
24355 (2)
1ES66
Vendor
similar
PIN 2/
AD574AUE/883B
AD574AUD/883B
MX574AUD/883B
AD574AUD/QMLV
AD574AUF/QMLV
AD574AUD/QMLR
AD574AUF/QMLR
AD574ATE/883B
MX574ATE/883B
5962-8512702XA
5962-8512702XC
5962-8512702VXA
5962-8512702VZA
5962R8512702VXA
5962R8512702VZA
5962-8512703XA
5962-8512703YA
5962-8512704XA
5962-8512704YA
5962-85127053A
24355 (2)
3/
3/
3/
3/
24355 (4)
24355 (4)
3/
3/
34371
3/
3/
AD574ATD/883B
MX574ATQ/883B
MX574ATD/883B
AD574ATD/QMLV
AD574ATF/QMLV
AD574ATD/QMLR
AD574ATF/QMLR
HI1-574AUD/883
HI4-574AUE/883
HI1-574ATD/883
HI4-574ATE/883
HADC574ZAMC/883
5962-8512705XC
5962-85127063A
5962-8512706XC
5962-85127073C
5962-8512707XC
5962-85127083C
5962-8512708XC
3/
3/
3/
3/
3/
3/
3/
HADC574ZAMJ/883
HADC574ZBMC/883
HADC574ZBMJ/883
HS574AU/B-LCC
HS574AU/B
HS574AT/B-LCC
HS574AT/B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Sheet 1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN – continued.
DATE: 15-08-13
Vendor CAGE
number
Vendor name
and address
24355 (2)
Analog Devices
Rt 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact:
804 Woburn Street
Wilmington, MA 01887-3462
24355 (4)
Analog Devices
Rt 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact:
7910 Triad Center Drive
Greensboro, NC 27409-9605
1ES66
Maxim Integrated
160 Rio Robles
San Jose, CA 95134
34371
Intersil Corporation
1650 Robert J. Conlan Blvd. NE
Palm Bay, FL 32905-3406
Sheet 2 of 2
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.