Silicon Protection Arrays TM 8pF ESD Protection Array RoHS Pb SP1001 Lead-Free/Green Series GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1001-04 (SC70-5) SP1001-05 (SC70-6) 1 1 3 2 5 1 6 2 2 5 3 3 4 4 SP1001-02 (SOT 553) SP1001-04 (SOT 553) NC 5 SP1001-05 (SOT 563) 1 5 2 2 NC 4 3 4 1 6 2 5 3 4 SP1001-02 2 t 4NBMMQBDLBHFTBWFT board space t -JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2.5A (8/μs) t $PNQVUFS1FSJQIFSBMT t -$%1%157T t .PCJMF1IPOFT t 4FU5PQ#PYFT t %JHJUBM$BNFSBT t %7%1MBZFST t %FTLUPQT/PUFCPPLT t .11.1 2 SP1001-04 1 4 5 3 5 t &4%QSPUFDUJPOPGL7 contact discharge, 15kV air discharge, (Level 4, IEC61000-4-2) Applications SP1001-02 2 t -PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t &'5QSPUFDUJPO IEC61000-4-4, 40A (5/50 ns) Functional Block Diagram 1 t -PXDBQBDJUBODFPGQ' (TYP) per I/O SP1001-05 4 6 5 4 3 1 2 3 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 11 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 SP1001-02 (SC70-3) Silicon Protection Arrays TM 8pF ESD Protection Array Absolute Maximum Ratings Symbol Parameter IP Peak Current (tp=8/20μs) TOP TSTOR Value Units 2 A Operating Temperature -40 to 85 °C Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Storage Temperature Range Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 300 °C Electrical Characteristics (TOP = 25°C) Symbol Test Conditions Min Typ Max Units Forward Voltage Drop Parameter VF IF=10mA 0.7 0.9 1.2 V Reverse Voltage Drop VR IR=10mA 6.0 6.7 8.0 V Reverse Standoff VRWM IR≤1μA 5.5 V Reverse Leakage Current ILEAK VR=5V 0.5 μA Clamp Voltage1 VC ESD Withstand Voltage1,2 VESD CD Diode Capacitance1 IPP=1A, tp=8/20μs, Fwd 8.0 11.0 V IPP=2A, tp=8/20μs, Fwd 9.7 13.0 V IEC61000-4-2 (Contact) ±8 IEC61000-4-2 (Air) ±15 kV kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) SP1001 Lead-Free/Green Series 12 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM 8pF ESD Protection Array Design Consideration directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors Application Example LCD module Controller Input Outside World D1 D2 D3 D4 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 217°C 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Lead-Free/Green SP1001 Reflow Condition 13 SP1001 Lead-Free/Green Series Silicon Protection Arrays TM 8pF ESD Protection Array Part Numbering System Product Characteristics SP1001-02 J T G Silicon Protection Array G= Green T= Tape & Reel Package Series J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty Number of Channels 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Part Marking System Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters AXX AXX 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Product Series Number of Channels A = SP1001 series (varies) 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Assembly Site 6. Package surface matte finish VDI 11-13. (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 AX2 3000 SP1001-02XTG SOT553 AX2 5000 SP1001-04JTG SC70-5 AX4 3000 SP1001-04XTG SOT553 AX4 5000 SP1001-05JTG SC70-6 AX5 3000 SP1001-05XTG SOT563 AX5 5000 Package Dimensions - SC70-3 B Solder Pad Layout 3 Package SC70-3 Pins 3 JEDEC E HE 2 1 e MO-203 Issue A Millimeters e D A2 A Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e A1 C Inches Min 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 L SP1001 Lead-Free/Green Series 14 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM 8pF ESD Protection Array Package Dimensions - SC70-5 Package e e 6 5 Solder Pad Layout 4 not used MO-203 Issue A Millimeters Min 3 2 1 5 JEDEC HE E SC70-5 Pins B D A2 A A1 L Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e C Inches Max 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions - SC70-6 6 5 Package Solder Pad Layout 4 E 1 2 SC70-6 Pins 6 JEDEC MO-203 Issue A HE Millimeters Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 3 B D A2 A A1 C e L Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions - SOT553 A 6 5 (not used) 2 Package L D Pins 5 Millimeters 4 E HE Solder Pad Layout 3 e SOT 553 A c B Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.018 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 15 Inches Min 0.50 BSC 0.014 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 B B Silicon Protection Arrays TM 8pF ESD Protection Array Package Dimensions - SOT563 A D 6 5 4 E 2 3 e Package L SOT 563 Pins 6 Millimeters Solder Pad Layout Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A c B Inches Min HE e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Embossed Carrier Tape & Reel Specification - SC70-3 Dimensions Millimetres Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 7.70 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 2.50 0.090 1.30 0.043 B0 1.00 Ref 2.30 B1 K0 16 8.10 1.574 +/- 0.008 W A1 SP1001 Lead-Free/Green Series Inches 0.303 0.039 Ref 1.90 Ref 1.10 0.318 0.098 0.074 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM 8pF ESD Protection Array Embossed Carrier Tape & Reel Specification - SC70-5 and SC70-6 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.051 t 0.27 max 0.010 max Embossed Carrier Tape & Reel Specification - SOT553 and SOT563 Dimensions 17 Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t ©2008 Littelfuse, Inc. Min E 10P0 Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Inches Max 0.22 max 0.010 max SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Millimetres Min