SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection RoHS Pb SP3050 Lead-Free/Green Series GREEN Description The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 I/O 3 6 1 t-PXDBQBDJUBODFPGQ' (TYP) per I/O t&'5*&$" (5/50ns) t-PXMFBLBHFDVSSFOUPG ç"."9 BU7 t-JHIUOJOH*&$ "çT t4NBMM405 packaging Applications 5 2 4 t-$%1%157T t'JSFXJSF t.POJUPST t4FU5PQ#PYFT t/PUFCPPLT t'MBU1BOFM%JTQMBZT t&UIFSOFU t1PSUBCMF.FEJDBM 3 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 1 SP3050 Lead-Free/Green Series Lead-Free/Green SP3050 Functional Block Diagram t&4%*&$ L7DPOUBDUL7BJS SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Absolute Maximum Ratings Symbol Parameter Value Units 10.0 " Operating Temperature -40 to 85 °C Storage Temperature -50 to 150 °C IPP Peak Current (tpçT 1 TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 /POSFQFUJUJWFQVMTFQFSXBWFGPSNPOQBHF Thermal Information Parameter Storage Temperature Range Rating Units -65 to 150 °C .BYJNVN+VODUJPO5FNQFSBUVSF 150 °C .BYJNVN-FBE5FNQFSBUVSF4PMEFSJOHT 260 °C Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter V38. IRõ" 3FWFSTF-FBLBHF$VSSFOU I-&", VR=5V Clamp Voltage VC 1 Min Max Units 6.0 V 0.1 0.5 " IPP"UpT*0UP(/%2 8.8 10.0 V IPP"UpT*0UP(/% 11.5 13.0 V IPP"UpT*0UP(/% 13.2 15.0 V 2 2 ESD Withstand Voltage1 VESD Diode Capacitance1 C*0(/% Diode Capacitance CI/O-I/O 1 Typ IEC61000-4-2 (Contact) ±20 kV *&$"JS ±30 kV 3FWFSTF#JBT7 2.4 3.0 3FWFSTF#JBT7 2.0 Q' 3FWFSTF#JBT7 1.2 Q' Q' /PUFT Parameter is guaranteed by design and/or device characterization. 1 2 Repetitive pulse per waveform on page 3. SP3050 Lead-Free/Green Series 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Capacitance vs. Reverse Bias Pulse Waveform 110% 3.0 100% 2.5 90% 2.0 80% VCC =3.3V Capacitance (pF) VCC=Float VCC =5V 1.5 1.0 70% 60% 50% 40% 30% 20% 0.5 10% 0% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 DC Bias (V) 5.0 10.0 15.0 20.0 25.0 30.0 Clamping Voltage vs. IPP 20.0 18.0 Clamp Voltage (VC ) 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 1 2 3 4 5 6 7 8 9 Lead-Free/Green SP3050 0.0 10 Peak Pulse Current-IPP (A) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3 SP3050 Lead-Free/Green Series SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Application Example Dual Port Protection VBUS VBUS RT D+ RT USB Controller D- VBUS CT SP3050-04HTG CT USB Port GND VBUS VBUS RT D+ RT D- CT USB Port GND CT 10/100 Ethernet Differential Protection RJ45 Unused TX + 10/100 Ethernet PHY TX - TX - 1 6 2 5 3 4 RX + SP3050-04HTG RX - RX + Unused To Twisted-Pair Network Unused TX + Unused 75 RX - 75 75 75 VCC VCC GND SP3050 Lead-Free/Green Series 4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Soldering Parameters Reflow Condition Pre Heat 1Co'SFFBTTFNCMZ - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak ¡$TFDPOENBY TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate ¡$TFDPOENBY Time 25°C to peak Temperature (TP) NJOVUFT.BY Do not exceed 260°C Package Dimensions - SOT23-6 Package SOT23-6 Pins 6 MO-203 Issue A Millimeters Min Inches Min Max Notes A 0.900 1.450 0.035 0.057 A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref - e1 1.9 Ref 0.0748 Ref - L 0.100 N a Recommended Solder Pad Layout Max 0.600 0.004 6 0º 0.023 6 10º 6 0º 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - /PUFT %JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*. 1BDLBHFDPOGPSNTUP&*"+4$ M %JNFOTJPOT%BOE&BSFFYDMVTJWFPGNPMEnBTIQSPUSVTJPOTPSHBUFCVSST 'PPUMFOUI-NFBTVSFEBUSFGFSFODFUPTFBUJOHQMBOF i-wJTUIFMFOHUIPGnBUGPPUTVSGBDFGPSTPMEFSJOHUPTVCTUSBUF P i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT $POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ FYBDU R O ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5 SP3050 Lead-Free/Green Series Lead-Free/Green SP3050 JEDEC SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Product Characteristics Part Numbering System SP 3050 – 04 H T G G= Green Silicon Protection Array T= Tape & Reel Series Package H: SOT23-6 Number of Channels Lead Plating .BUUF5JO Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material .PMEFE&QPYZ Flammability 6-7 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST Part Marking System 2. Dimensions include solder plating. L*4 L*4 Product Series L = SP3050 %JNFOTJPOTBSFFYDMVTJWFPGNPMEnBTINFUBMCVSS "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" Number of Channels #MPJTGBDJOHVQGPSNPMEBOEGBDJOHEPXOGPSUSJNGPSNJFSFWFSTFUSJNGPSN 1BDLBHFTVSGBDFNBUUFmOJTI7%* Assembly Site (Varies) Ordering Information Part Number Package Marking Min. Order Qty. 41)5( SOT23-6 - 3000 SP3050 Lead-Free/Green Series 6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection Embossed Carrier Tape & Reel Specification -- SOT23-6 NN5"1&"/%3&&ACCESS HOLE 1.5mm DIA. HOLE 14.4mm 4.0mm 2.0mm 1.75mm CL 8mm 13mm 4.0mm 180mm 60mm SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED PIN 1 GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. Lead-Free/Green SP3050 COVER TAPE ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 7 SP3050 Lead-Free/Green Series