SPA™ Silicon Protection Array Products ESD/Surge Protection Devices RoHS Pb GREEN SP1003 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±25kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20μs surge current (IEC61000-4-5) with very low clamping voltages. Pinout Features 1 t&4%*&$ ±25kV contact, ±30kV air t5JOZ40%QBDLBHF saves board space t&'5*&$" (5/50ns) t'JUTTPMEFSGPPUQSJOUPG industry standard 0402 (1005) devices t-JHIUOJOH*&$ 7A (8/20μs) t-PXMFBLBHFDVSSFOUPG 1μA (MAX) at 5V 2 Functional Block Diagram 1 t.PCJMFQIPOFT t%JHJUBMDBNFSBT t4NBSUQIPOFT t1PSUBCMFNFEJDBMEFWJDFT t1%"T t1PSUBCMFOBWJHBUJPO devices 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 23 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 Applications SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Absolute Maximum Ratings Value Units IPP Symbol Peak Pulse Current (tp Parameter 7.0 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Forward Voltage Drop Parameter VF IF = 10mA Reverse Voltage Drop VR IR=1mA Reverse Standoff Voltage VRWM Reverse Leakage Current Clamp Voltage @ MAX IPP1 ESD Withstand Voltage1 Diode Capacitance 1 Typ Max Units 0.8 1.2 V 7.0 8.0 V IR≤1μA 5.0 V ILEAK VR=5V 1 μA VC tp=8/20μs (IEC61000-4-5) VESD CD Min 6.0 12.5 V IEC61000-4-2 (Contact Discharge) ±25 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V 30 pF Note: Parameter is guaranteed by design and/or device characterization. 1 SP1003 Lead-Free/Green Series 24 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Capacitance vs. Reverse Bias Pulse Waveform 110% 40.0 100% 35.0 90% 80% 25.0 Capacitance (pF) 30.0 20.0 15.0 10.0 70% 60% 50% 40% 30% 20% 5.0 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0% 0.0 5.0 DC Bias (V) 5.0 10.0 15.0 20.0 25.0 30.0 Clamping Voltage vs. IPP 14.0 Clamp Voltage (VC) 12.0 10.0 8.0 6.0 4.0 2.0 1 2 3 4 5 6 Lead-Free/Green SP1003 0.0 7 Peak Pulse Current-IPP (A) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 25 SP1003 Lead-Free/Green Series SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Application Example Dx: SP1003-01DTG Discrete Diodes I/O port Controller Low-speed port Outside World B1 B2 B3 B4 (4) SP1003-01DTG Signal Ground Shield Ground Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) oTFDT Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow 1Co'SFFBTTFNCMZ 3°C/second max 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) oTFDPOET Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) oTFDPOET Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP1003 Lead-Free/Green Series 26 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Package Dimensions - SOD723 SOD723 D HE A b E Symbol Inches Min Max Min Max A 0.46 0.51 0.018 0.020 b 0.23 0.28 0.009 0.011 c 0.08 0.13 0.003 0.005 D 0.99 1.04 0.039 0.041 E 0.58 0.64 0.023 0.025 HE 1.37 1.47 0.054 0.058 L 0.15 0.25 0.006 0.010 c L Millimeters Recommended Solder Pad Layout 1.10 [0.043] 0.45 [0.018] Millimeters (Inches) Lead-Free/Green SP1003 0.50 [0.020] ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 27 SP1003 Lead-Free/Green Series SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Product Characteristics Part Numbering System SP 1003 01 D T G G= Green Silicon Protection Array T= Tape & Reel Series Package D: SOD723 Number of Channels Lead Plating 1SF1MBUFE'SBNF Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability 6-7 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" C 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1BDLBHFTVSGBDFNBUUFmOJTI7%* Pin 1 Indicator Product Series Ordering Information Part Number Package Marking Min. Order Qty. 41%5( SOD723 C 8000 Embossed Carrier Tape & Reel Specification – SOD723 Symbol PO D t Ø W E P2 1.65 1.85 0.064 0.072 3.55 0.135 0.139 D1 0.45 0.55 0.017 0.021 D 150 -- 0.06 -- PO 3.90 4.10 0.153 0.161 BO B1 40.0+/- 0.20 7.90 KO 1.57+/-0.01 0.311 0.322 PO 1.90 2.10 0.074 0.082 0.63 0.73 0.024 0.028 1.76 0.07 BO 28 8.20 AO 3&' 1.66 B1 SP1003 Lead-Free/Green Series Max 3.45 A1 AO A1 Min F W F P Inches Max E 10PO ØD1 Millimetres Min 3&' 3&' 0.07 3&' KO 0.54 0.64 0.021 0.025 t -- 0.21 -- 0.008 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.