SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection HF RoHS Pb GREEN SP1007 Lead-Free/Green Series Description The SP1007 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 1 2 t&4%*&$L7 contact, ±15kV air t-PXDBQBDJUBODFPGQ' (@ VR=2.5V) t&'5*&$" (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.1μA at 5V t-JHIUOJOH*&$ 2A (tP=8/20μs) t*OEVTUSJFTTNBMMFTU&4% footprint available (0201) Note: Drawing not to scale. Functional Block Diagram 2 t.PCJMFQIPOFT t.11.1 t4NBSUQIPOFT t$BNDPSEFST t1PSUBCMFOBWJHBUJPO devices t1%" t1PSUBCMFNFEJDBM t%JHJUBMDBNFSBT t1PJOUPGTBMFUFSNJOBMT Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 45 Revised: May 17, 2010 SP1007 Lead-Free/Green Series Lead-Free/Green SP1007 1 Applications SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection Absolute Maximum Ratings Symbol Parameter Value Units 2.0 A Operating Temperature -40 to 85 °C Storage Temperature -65 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Storage Temperature Range Units -65 to 150 °C .BYJNVN+VODUJPO5FNQFSBUVSF 150 °C .BYJNVN-FBE5FNQFSBUVSF4PMEFSJOHT 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage V38. Test Conditions Min Typ Max Units 6.0 V Breakdown Voltage VBR IR=1mA 8.5 9.5 V Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA IPP=1A, tpT'XE V IPP=2A, tpT'XE 12.2 V (VC2 - VC1) / (IPP2 - IPP1) 1.9 Ω Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD I/O to I/O Capacitance1 IEC61000-4-2 (Contact Discharge) ±8 kV IEC61000-4-2 (Air Discharge) ±15 kV CI/O-I/O Reverse Bias=0V 5 Reverse Bias=2.5V 6 Q' Q' NOTES: 1 Parameter is guaranteed by design and/or device characterization. SP1007 Lead-Free/Green Series 46 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection Capacitance vs. Reverse Bias Pulse Waveform 110% 6.0 100% 5.0 90% 80% Capacitance (pF) 4.0 70% 60% 3.0 50% 40% 2.0 30% 1.0 20% 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0% 0.0 5.0 5.0 10.0 15.0 20.0 25.0 30.0 Bias Voltage (V) Insertion Loss (S21) I/O to GND 5 Attenuation (dB) 0 -5 -10 -15 -20 -25 -30 -35 10 100 1000 10000 Lead-Free/Green SP1007 1 Frequency (MHz) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 47 Revised: May 17, 2010 SP1007 Lead-Free/Green Series SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection Application Example I/O Controller Keypads P1 P2 Outside World P3 IC P4 SP1007 (x4) GND Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow 1Co'SFFBTTFNCMZ ¡$TFDPOENBY ¡$TFDPOENBY - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) NJOVUFT.BY Do not exceed 260°C SP1007 Lead-Free/Green Series 48 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection Package Dimensions - 0201 Flip Chip 0201 Flipchip Symbol A B F C D Min Typ Max Min Typ Max A 0.595 0.620 0.645 0.0244 0.0254 B 0.295 0.0116 0.0126 C 0.245 0.275 0.0096 0.0108 0.0120 0.145 0.150 0.155 0.0057 0.0059 0.0061 E 0.245 0.250 0.255 0.0096 0.0098 0.0100 F 0.245 0.250 0.255 0.0096 0.0098 0.0100 G 0.005 0.010 0.015 0.0002 0.0004 0.0006 D Product Characteristics Part Numbering System SP 1007 – 01 W T G Silicon Protection Array Inches D G E Millimeters G= Green T= Tape & Reel Lead Plating Sn Lead Material Copper Lead Coplanarity 6 um (max) Subsitute Material Silicon Body Material Silicon Series Number of Channels Package W: 0201 Flipchip Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System %JNFOTJPOTBSFFYDMVTJWFPGNPMEnBTINFUBMCVSS 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1BDLBHFTVSGBDFNBUUFmOJTI7%* Ordering Information Part Number Package Marking Min. Order Qty. SP1007-01WTG 'MJQDIJQ tt 10000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 49 Revised: May 17, 2010 SP1007 Lead-Free/Green Series Lead-Free/Green SP1007 "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" SPA™ Silicon Protection Array Products 3.5pF Bi-Directional 0201 TVS Diode for ESD Protection Embossed Carrier Tape & Reel Specification – 0201 Flipchip P1 P0 D P2 E F W D1 Symbol Millimeters A0 B0 D ø 1.50 + 0.10 D1 ø 0.20 +/- 0.05 E 1.75+/-0.10 F K0 P0 2.00+/-0.05 P1 2.00+/-0.05 P2 4.00+/-0.10 W T T K0 A0 B0 Recommended Solder Pad Footprint 0.30 0.28 0.75 0.19 *Sizes in mm SP1007 Lead-Free/Green Series 50 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.