LITTELFUSE SP1010

SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
RoHS
Pb
GREEN
SP1010 Lead-Free/Green Series
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes
at the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protection highspeed signal pins.
Pinout
Features
• E
SD, IEC61000-4-2, ±8kV
contact, ±15kV air
I/O (1)
I/O (4)
GND
GND
• L
ightning, IEC61000-4-5,
1A (tp=8/20µs)
I/O (3)
• Low capacitance of 3.5pF
(TYP) per I/O
I/O (2)
uDFN-6
(1.25x1.0x0.5mm)
• EFT protection
IEC61000-4-4, 40A
(5/50ns)
• Low leakage current of
1µA (MAX) at 5V
Applications
5
4
• Notebook
• Portable medical device
• Netbook
• MP3/PMP
• Ultra mobile PC
• Digital camera
• Mobile phone
• Portable navigation
device
1
2
3
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
1
SP1010 Lead-Free/Green Series
Lead-Free/Green SP1010
Functional Block Diagram
6
• Tiny uDFN package
(1.25mm x 1.0mm x
0.5mm)
SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
1.0
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-60 to 150
°C
IPP
Peak Pulse Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
Storage Temperature Range
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VR
IR = 1mA
6.0
7.5
8.0
V
Reverse Standoff Voltage
VRWM
IR≤1µA
6
V
Reverse Leakage Current
ILEAK
VR = 5V
1
µA
ESD Withstand Voltage1
VESD
Reverse Voltage Drop
Diode Capacitance1
0.1
IEC61000-4-2 (Contact Discharge)
±8
kV
IEC61000-4-2 (Air Discharge)
±15
kV
CD
Reverse Bias = 0V
6
Reverse Bias = 2.5V
3.5
7
pF
pF
Notes:
1. Parameter is guaranteed by design and/or device characterization.
SP1010 Lead-Free/Green Series
2
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
Capacitance vs. Reverse Bias
Insertion Loss (S21) I/O to GND
5
7.0
0
-5
5.0
Attenuation (dB)
Capacitance (pF)
6.0
4.0
3.0
-10
-15
2.0
-20
1.0
-25
-30
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
10
5.0
100
1000
10000
Frequency (MHz)
DC Bias (V)
Application Example
Keyboard
Controller
Input
SP1010-04UTG
Shield
Ground
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Lead-Free/Green SP1010
Outside World
D1
D2
D3
D4
3
Signal
Ground
SP1010 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
Soldering Parameters
Pb – Free assembly
Reflow Condition
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Package Dimensions - uDFN-6 (1.25x1.0x0.5mm)
Bottom View
Top View
D
0.05 C
6 5 4
4 5 6
1 2 3
Symbol
Pin 1 chamfer
0.10 x 45’
3 2 1
B
A1
A
A3
Seating plane
C
Min
Max
Min
Max
0.55
0.018
0.022
A1
0.00
0.05
0.000
0.002
0.127 REF
b
0.15
0.25
0.006
0.010
1.20
1.30
0.047
0.051
D2
-
-
-
-
E
0.95
1.05
0.037
0.041
E2
-
-
-
-
L
0.10 M C A B
0.005 REF
D
0.4 REF
e
b
Inches
0.45
A3
Side View
0.05 C
Millimeters
A
0.05 C
L
E
Pin 1 Index Area
uDFN-6 (1.25x1.0x0.5mm)
℮
A
0.25
0.016 REF
0.35
0.010
0.014
0.05 M C
SP1010 Lead-Free/Green Series
4
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
Product Characteristics
Part Numbering System
SP 1010 – 04 U T G
G= Green
Silicon
Protection Array
T= Tape & Reel
Series
Package
U: uDFN-6
Number of
Channels
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Notes :
1. All dimensions are in millimeters
Part Marking System
2. Dimensions include solder plating.
H*4
3. Dimensions are exclusive of mold flash & metal burr.
Product Series
H = SP1010
H*4
4. All specifications comply to JEDEC SPEC MO-223 Issue A
Number of Channels
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Assembly Site
(Varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1010-04UTG
uDFN-6 (1.25x1.0x0.5mm)
H*4
3000
Embossed Carrier Tape & Reel Specification – uDFN-6 (1.25x1.0x0.5mm)
t
D
Min
Max
Min
Max
1.65
1.85
0.06
0.07
F
3.45
3.55
0.14
0.14
D1
0.50
0.65
0.02
0.03
P0
B0
F
W
10P0
D1
P0
Inches
E
D
E
P2
Millimeters
1.50 MIN
3.90
4.10
40.0 +/- 0.20
0.06 MIN
0.15
0.16
1.57 +/- 0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.09
1.19
0.04
0.05
B0
1.42
1.52
0.06
0.06
K0
0.71
0.81
0.03
0.03
t
0.25 TYP
0.01 TYP
K0
A0
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
5
SP1010 Lead-Free/Green Series
Lead-Free/Green SP1010
Symbol
SPA™ Silicon Protection Array Products
3.5pF Unidirectional TVS Array for ESD Protection
SP1010 Lead-Free/Green Series
6
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.