LTC6090/LTC6090-5 140V CMOS Rail-to-Rail Output, Picoamp Input Current Op Amp DESCRIPTION FEATURES Supply Range: ±4.75V to ±70V (140V) n 0.1Hz to 10Hz Noise: 3.5μV P-P n Input Bias Current: 50pA Maximum n Low Offset Voltage: 1.25mV Maximum n Low Offset Drift: ±5µV/°C Maximum n CMRR: 130dB Minimum n Rail-to-Rail Output Stage n Output Sink and Source: 50mA n12MHz Gain Bandwidth Product n21V/µs Slew Rate n11nV/√Hz Noise Density n Thermal Shutdown n Available in Thermally Enhanced SOIC-8E or TSSOP-16E Packages The LTC®6090/LTC6090-5 are high voltage, precision monolithic operational amplifiers. The LTC6090 is unity gain stable. The LTC6090-5 is stable in noise gain configurations of 5 or greater. Both amplifiers feature high open loop gain, low input referred offset voltage and noise, and pA input bias current and are ideal for high voltage, high impedance buffering and/or high gain configurations. n The amplifiers are internally protected against overtemperature conditions. A thermal warning output, TFLAG, goes active when the die temperature approaches 150°C. The output stage may be turned off with the output disable pin OD. By tying the OD pin to the thermal warning output (TFLAG), the part will disable the output stage when it is out of the safe operating area. These pins easily interface to any logic family. APPLICATIONS n n n n n Both amplifiers may be run from a single 140V or spit ±70V power supplies and are capable of driving up to 200pF of load capacitance. They are available in either an 8-lead SO or 16-lead TSSOP package with exposed pad for low thermal resistance. ATE Piezo Drivers Photodiode Amplifier High Voltage Regulators Optical Networking L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION High Voltage DAC Buffer Application 140VP-P Sine Wave Output 80 3V DIN 16 LTC2641 10k + 470pF LTC6090 VOUT = ±70V – VREF 2.5V 16.2k OUTPUT VOLTAGE (V) 60 70V 40 20 0 –20 –40 –60 –70V –80 453k 6090 TA01a 25µs/DIV 6090 TA01b 16.9k 10pF 6090fe For more information www.linear.com/LTC6090 1 LTC6090/LTC6090-5 ABSOLUTE MAXIMUM RATINGS (Note 1) Total Supply Voltage (V+ to V–)................................150V COM.................................................................... V– to V+ Input Voltage OD....................................................... V– to V+ + 0.3V +IN, –IN,................................... V– – 0.3V to V+ + 0.3V OD to COM................................................... –3V to 7V Input Current +IN, –IN............................................................ ±10mA TFLAG Output TFLAG.......................................V – – 0.3V to V+ + 0.3V TFLAG to COM............................................. –3V to 7V Output Current Continuous (Note 2).................................... 50mARMS Operating Junction Temperature Range (Note 3)....................................................–40°C to 125°C Specified Junction Temperature Range (Note 4) LTC6090C................................................. 0°C to 70°C LTC6090I..............................................–40°C to 85°C LTC6090H........................................... –40°C to 125°C Junction Temperature (Note 5).............................. 150°C Storage Temperature Range................... –65°C to 150°C Lead Temperature (Soldering, 10 sec).................... 300°C PIN CONFIGURATION TOP VIEW TOP VIEW COM 1 –IN 2 +IN 3 V– 9 V– 4 COM 1 16 OD GUARD 2 15 GUARD 14 V+ 8 OD GUARD 3 7 V+ –IN 4 6 OUT +IN 5 GUARD 6 11 GUARD GUARD 7 10 GUARD V– 8 9 5 TFLAG S8E PACKAGE 8-LEAD PLASTIC SO TJMAX = 150°C, θJC = 5°C/W EXPOSED PAD (PIN 9) IS V–, MUST BE SOLDERED TO PCB 17 V– 13 GUARD 12 OUT TFLAG FE PACKAGE 16-LEAD PLASTIC TSSOP TJMAX = 150°C, θJC = 10°C/W EXPOSED PAD (PIN 17) IS V–, MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION JUNCTION TEMPERATURE RANGE LTC6090CS8E#PBF LTC6090CS8E#TRPBF 6090 8-Lead Plastic SO 0°C to 70°C LTC6090IS8E#PBF LTC6090IS8E#TRPBF 6090 8-Lead Plastic SO –40°C to 85°C LTC6090HS8E#PBF LTC6090HS8E#TRPBF 6090 8-Lead Plastic SO –40°C to 125°C LTC6090CFE#PBF LTC6090CFE#TRPBF 6090FE 16-Lead Plastic TSSOP 0°C to 70°C LTC6090IFE#PBF LTC6090IFE#TRPBF 6090FE 16-Lead Plastic TSSOP –40°C to 85°C LTC6090HFE#PBF LTC6090HFE#TRPBF 6090FE 16-Lead Plastic TSSOP –40°C to 125°C 2 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION JUNCTION TEMPERATURE RANGE LTC6090CS8E-5#PBF LTC6090CS8E-5#TRPBF 60905 8-Lead Plastic SO 0°C to 70°C LTC6090IS8E-5#PBF LTC6090IS8E-5#TRPBF 60905 8-Lead Plastic SO –40°C to 85°C LTC6090HS8E-5#PBF LTC6090HS8E-5#TRPBF 60905 8-Lead Plastic SO –40°C to 125°C LTC6090CFE-5#PBF LTC6090CFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP 0°C to 70°C LTC6090IFE-5#PBF LTC6090IFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP –40°C to 85°C LTC6090HFE-5#PBF LTC6090HFE-5#TRPBF 6090FE-5 16-Lead Plastic TSSOP –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix. ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications and all typical values are at TJ = 25°C. Test conditions are V+ = 70V, V– = –70V, VCM = VOUT = 0V, VOD = Open unless otherwise noted. C-, I-SUFFIXES SYMBOL PARAMETER VOS CONDITIONS MIN Input Offset Voltage l ∆VOS /∆T Input Offset Voltage Drift TA = 25°C, ∆TJ = 70°C IB Input Bias Current (Note 6) Supply Voltage = ±70V Supply Voltage = ±15V Supply Voltage = ±15V IOS Input Offset Current (Note 6) Supply Voltage = ±15V –5 MAX ±330 ±330 ±1000 ±1250 ±3 5 3 0.3 l 0.5 l en H-SUFFIX TYP MIN –5 TYP MAX UNITS ±330 ±330 ±1000 ±1250 μV μV ±3 5 3 0.3 50 0.5 30 µV/°C 800 pA pA pA 120 pA pA Input Noise Voltage Density f = 1kHz f = 10kHz 14 11 14 11 Input Noise Voltage 0.1Hz to 10Hz 3.5 3.5 µVP-P 1 1 fA/√Hz in Input Noise Current Density VCM Input Common Mode Range Guaranteed by CMRR l V –+3V ±68 V+ –3V V –+3V ±68 nV/√Hz nV/√Hz V+ –3V V V CIN Common Mode Input Capacitance 9 9 pF CDIFF Differential Input Capacitance 5 5 pF CMRR Common Mode Rejection Ratio VCM = –67V to 67V PSRR VOUT AVOL Power Supply Rejection Ratio 130 126 >140 130 126 >140 l dB dB 112 106 >120 112 106 >120 l dB dB VS = ±4.75V to ±70V Output Voltage Swing High (VOH) No Load (Referred to V+) ISOURCE = 1mA ISOURCE = 10mA l l l 10 50 450 25 140 1000 10 50 450 25 140 1000 mV mV mV Output Voltage Swing Low (VOL) No Load (Referred to V –) ISINK = 1mA ISINK = 10mA l l l 10 40 250 25 80 600 10 40 250 25 80 600 mV mV mV Large-Signal Voltage Gain RL = 10k, VOUT from –60V to 60V l 1000 1000 >10000 1000 1000 >10000 V/mV V/mV 6090fe For more information www.linear.com/LTC6090 3 LTC6090/LTC6090-5 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications and all typical values are at TJ = 25°C. Test conditions are V+ = 70V, V– = –70V, VCM = VOUT = 0V, VOD = Open unless otherwise noted. C-, I-SUFFIXES SYMBOL PARAMETER ISC SR GBW CONDITIONS MIN TYP Output Short-Circuit Current (Source and Sink) Supply Voltage = ±70V Supply Voltage = ±15V l 50 Slew Rate AV = –4, RL = 10k LTC6090 LTC6090-5 l l 10 18 21 37 fTEST = 20kHz, RL = 10k LTC6090 LTC6090-5 l l 5.5 11 12 24 Gain-Bandwidth Product ΦM Phase Margin RL = 10k, CL = 50pF FPBW Full Power Bandwidth VO = 125VP–P LTC6090 LTC6090-5 tS Settling Time 0.1% ∆VOUT = 1V LTC6090, AV = 1V/V LTC6090-5, AV = 5V/V IS Supply Current No Load H-SUFFIX MAX 90 MIN 20 34 40 68 2.8 VS Supply Voltage Range Guaranteed by the PSRR Test l ODH ODL OD Pin Voltage, Referenced to COM Pin VIH VIL Amplifier DC Output Impedance, Disabled DC, OD = COM 9.5 9 16 21 37 V/μs V/μs 5 10 12 24 MHz MHz 60 Deg 40 68 kHz kHz 2 2.5 µs µs 18 32 3.9 4.3 140 l COM+1.8V l COM+0.65V 2.8 9.5 COM+1.8V >10 V– 3.9 4.3 mA mA 140 V COM+0.65V V V >10 V+ – 5 UNITS mA mA 2 2.5 l MAX 90 50 60 l l TYP V– MΩ V+ – 5 COMCM COM Pin Voltage Range l 17 21 25 17 21 25 V 500 665 850 500 665 850 kΩ COMV COM Pin Open Circuit Voltage l COMR COM Pin Resistance l TEMPF Die Temperature Where TFLAG Is Active TEMPHYS TFLAG Output Hysteresis ITFLAG TFLAG Pull-Down Current TFLAG Output Voltage = 0V Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC6090/LTC6090-5 is capable of producing peak output currents in excess of 50mA. Current density limitations within the IC require the continuous RMS current supplied by the output (sourcing or sinking) over the operating lifetime of the part be limited to under 50mA (Absolute Maximum). Proper heat sinking may be required to keep the junction temperature below the absolute maximum rating. Refer to Figure 7, the Power Dissipation section, and the Safe Operating Area section of the data sheet for more information. Note 3: The LTC6090C/LTC6090I are guaranteed functional over the operating junction temperature range –40°C to 85°C. The LTC6090H is guaranteed functional over the operating junction temperature range –40°C to 125°C. Specifying the junction temperature range as an operating condition is applicable for devices with potentially significant quiescent power dissipation. 4 l 70 V 145 145 °C 5 5 °C 200 330 70 200 330 µA Note 4: The LTC6090C is guaranteed to meet specified performance from 0°C to 70°C. The LTC6090C is designed, characterized, and expected to meet specified performance from –40°C to 85°C but is not tested or QA sampled at these temperatures. The LTC6090I is guaranteed to meet specified performance from –40°C to 85°C. The LTC6090H is guaranteed to meet specified performance from –40°C to 125°C. Note 5: This device includes over temperature protection that is intended to protect the device during momentary overload conditions. Operation above the specified maximum operating junction temperature is not recommended. Note 6: Input bias and offset current is production tested with ±15V supplies. See Typical Performance Characteristics curves of actual typical performance over full supply range. 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 TYPICAL PERFORMANCE CHARACTERISTICS Open Loop Gain and Phase vs Frequency CMRR vs Frequency 100 100 80 PHASE 60 60 40 40 20 20 –20 0.1 1 –40 10000 10 100 1000 FREQUENCY (kHz) LTC6090 60 0 0.1 1 10 100 FREQUENCY (kHz) 60 200 150 100 40 50 20 –500 0 500 VOS (µV) 0 1000 500 200 100 0 –100 4 300 200 0 –300 –400 –400 50 25 0 75 TEMPERATURE (°C) 100 125 6090 G07 –500 5 125°C 85°C 25°C –50°C –50 –25 0 25 50 INPUT COMMON MODE VOLTAGE (V) 75 6090 G06 Minimum Supply Voltage 100 –300 VS = ±70V –10 6090 G05 –200 –25 0 –20 –75 6 –100 –200 –500 –50 –2 0 2 TCVOS (µV/°C) TA = 25°C 5 SAMPLES V+ = – V – VCM = 0V 400 OFFSET VOLTAGE (µV) 300 –4 SPECIFIED COMMON MODE RANGE= ±67V 10 Offset Voltage vs Total Supply Voltage VS = ±70V VCM = 0V 5 SAMPLES 400 –6 6090 G04 Offset Voltage vs Temperature VOLTAGE OFFSET (µV) CHANGE IN OFFSET VOLTAGE (µV) 80 1000 20 VS = ±70V T = 25°C 300 A ∆TJ = 70°C VCM = 0V 250 NUMBER OF UNITS NUMBER OF UNITS 100 10 100 FREQUENCY (kHz) Change in Offset Voltage vs Input Common Mode Voltage 350 VS = ±70V 180 TA = 25°C V = 0V 160 CM 120 1 PSRR– 6090 G03 TCVOS Distribution 200 500 0 0.1 1000 LTC6090-5 LTC6090-5 LTC6090 LTC6090 6090 G02 VOS Distribution 0 –1000 60 20 6090 G01 140 PSRR+ 80 40 20 –20 LTC6090 LTC6090-5 100 30 80 105 130 55 TOTAL SUPPLY VOLTAGE (V) 6090 G08 100 CHANGE IN OFFSET VOLTAGE (µV) 0 LTC6090-5 40 0 14 AV = 1V/V 120 80 CMRR (dB) GAIN PSRR vs Frequency 140 VS = ±70V 100 PHASE (DEG) GAIN (dB) 80 120 PSRR (dB) 120 75 50 25 0 –25 –50 125°C 85°C 25°C –50°C –75 –100 5 6 7 9 8 TOTAL SUPPLY VOLTAGE (V) 10 6090 G09 6090fe For more information www.linear.com/LTC6090 5 LTC6090/LTC6090-5 TYPICAL PERFORMANCE CHARACTERISTICS Supply Current vs Total Supply Voltage 3.0 2.9 2.5 2.8 VS = ±70V 2.7 VS = ±4.75V 2.6 2.5 Output Disable Supply Current vs Total Supply Voltage 800 OUTPUT DISABLE CURRENT (µA) 3.0 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) Supply Current vs Temperature 2.0 1.5 1.0 0.5 2.4 –50 –25 50 25 75 0 TEMPERATURE (°C) 100 0 125 TA = 25°C 0 25 50 75 100 SUPPLY VOLTAGE (V) 125 6090 G10 10 10 15 150 100 50 10 100 1000 FREQUENCY (kHz) 100 1000 FREQUENCY (kHz) 10000 LTC6090-5 Small Signal Frequency Response vs Closed Loop Gain 30 GAIN (dB) GAIN (dB) GAIN (dB) 10 40 10 –10 10000 1 50 20 –5 6090 G16 6 5 –5 10000 40 0 100 1000 FREQUENCY (kHz) 10 6090 G15 0 10 RF = 40.2k RI = 10k CF = 2pF 0 30 1 LTC6090 LTC6090-5 6090 G14 15 –10 50 75 100 125 25 TOTAL SUPPLY VOLTAGE (V) Small Signal Frequency Response 50 5 0 6090 G12 LTC6090 Small Signal Frequency Response vs Closed Loop Gain RF = 40.2k RI = 10k 125°C 85°C 25°C –50°C 100 200 0 100 CF = 0pF CF = 1pF CF = 2pF 10 200 20 LTC6090-5 Small Signal Frequency Response vs Feedback Capacitance 20 300 250 6090 G13 25 400 0 150 GAIN (dB) INTEGRATED NOISE (µVRMS) VOLTAGE NOISE DENSITY (nV/√Hz) 100 0.1 1 FREQUENCY (kHz) 500 Integrated Noise vs Frequency 1000 0.010 600 6090 G11 Voltage Noise Density vs Frequency 1 0.001 700 –20 20 10 AV = 101V/V AV = 11V/V AV = 1V/V 1 10 100 1000 FREQUENCY (kHz) 101V/V 33V/V 11V/V 5V/V 0 10000 6090 G17 –10 1 10 100 1000 FREQUENCY (kHz) 10000 6090 G18 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 TYPICAL PERFORMANCE CHARACTERISTICS 1000 10 1 0.01 AV = 101V/V AV = 11V/V AV = 1V/V 1 10 1000 100 10 1 100 1000 10000 100000 FREQUENCY (kHz) 1 10 100 FREQUENCY (kHz) 60 DIRECTION OF THE CURRENT IS OUT OF THE PIN 50°C 25°C 0.1 –15 –10 –5 0 10 5 COMMON MODE VOLTAGE (V) 15 100°C 80°C DIRECTION OF THE CURRENT IS OUT OF THE PIN 50°C 25°C LTC6090-5 Large Signal Transient Response 80 AV = –10V/V VS = ±70V OUTPUT 60 40 20 0 INPUT –20 0 INPUT –20 –60 –60 –80 6090 G23 AV = –10V/V VS = ±70V RF = 100kΩ RI = 10kΩ CF = 2pF 20 –40 5µs/DIV OUTPUT 40 –40 –80 80 6090 G21 OUTPUT, INPUT (V) 85°C 1 80 VS = ±15V 100°C 10 1 LTC6090 Large Signal Transient Response OUTPUT, INPUT (V) INPUT BIAS CURRENT (|pA|) 100 10 125°C 6091 G20 Input Bias Current vs Common Mode Voltage and Temperature 125°C 100 VS = ±70V 5°C 0.1 20 40 60 –80 –60 –40 –20 0 COMMON MODE VOLTAGE (V) 1000 6090 G19 1000 10000 CL = 10pF INPUT BIAS CURRENT (|pA|) 100 OUTPUT IMPEDANCE (kΩ) OUTPUT IMPEDACNE (Ω) 1000 0.1 Input Bias Current vs Common Mode Voltage and Temperature Output Impedance vs Frequency with Output Disabled (OD = COM) Output Impedance vs Frequency 6090 G24 5µs/DIV 6090 G22 LTC6090 Falling Edge Settling Time Small Signal Transient Response AV = 1V/V LTC6090 Rising Edge Settling Time 6090 G16 500ns/DIV 6090 G26 INPUT STEP (0.5V/DIV) INPUT STEP (0.5V/DIV) 1µs/DIV INPUT OUTPUT STEP (20mV/DIV) OUTPUT 50mV/DIV OUTPUT STEP (20mV/DIV) OUTPUT INPUT 50mV/DIV AV = 1V/V AV = 1V/V OUTPUT INPUT 500ns/DIV 6090 G27 6090fe For more information www.linear.com/LTC6090 7 LTC6090/LTC6090-5 TYPICAL PERFORMANCE CHARACTERISTICS LTC6090-5 Rising Edge Settling Time LTC6090-5 Small Signal Transient Response LTC6090-5 Falling Edge Settling Time INPUT (100mV/DIV) INPUT (100mV/DIV) INPUT AV = 5V/V RF = 40.2kΩ RI = 10kΩ CF = 2pF OUTPUT 6090 G28 1µs/DIV OUTPUT (50mV/DIV) OUTPUT 100mV/DIV OUTPUT (50mV/DIV) INPUT 25mV/DIV INPUT OUTPUT AV = 5V/V RF = 40.2kΩ RI = 10kΩ CF = 2pF AV = 5V/V RF = 40.2kΩ RI = 10kΩ CF = 2pF 6090 G29 500ns/DIV 500ns/DIV 6090 G30 Output Disable (OD) Response Time OD-COM OUTPUT ENABLED 0.1Hz to 10Hz Voltage Noise 160 AV = –10V/V VIN = –0.5V AV = –10V/V VS = ±70V RF = 100kΩ RI = 10kΩ CF = 2pF 140 120 OUTPUT DISABLED VOUT (VP-P) 2V/DIV OD-COM = 0V Output Voltage Swing vs Frequency VOUT VOUT = 0V 100 OUTPUT NOISE 2µV/DIV 80 60 40 20 20µs/DIV 0 6090 G31 LTC6090 LTC6090-5 1 10 100 FREQUENCY (kHz) 1000 6090 G33 TIME (1s/DIV) 6090 G32 SUPPLY CURRENT (mA) 2.5 2.0 1.5 1.0 125°C 85°C 25°C –50°C 0.5 0 75 VS = ±70V VCOM = 0V 0.5 0.8 1.0 1.3 1.5 OD-COM (V) 1.8 2.0 OD INPUT CURRENT (µA) 3.0 OD Pin Input Current vs OD Pin Voltage Output Voltage Swing High (VOH) vs Load Current and Temperature 50 125°C 85°C 25°C –50°C 700 600 25 0 500 400 300 200 –25 100 –50 0 1 2 3 4 OD-COM (V) 5 7 6 6090 G35 6090 G34 8 800 125°C 85°C 25°C –50°C VS = ±70V VCOM = 0V VOH (mV) Supply Current vs OD Pin Voltage 0 0 2 4 6 ISOURCE (mA) 8 10 6090 G36 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 TYPICAL PERFORMANCE CHARACTERISTICS Output Voltage Swing Low (VOL) vs Load Current and Temperature LTC6090 Distortion vs Frequency –20 125°C 85°C 25°C –50°C 450 400 –40 DISTORTION (dBc) VOL (mV) 300 250 200 150 –50 –70 –90 –100 –110 2 4 6 ISOURCE (mA) 8 –120 10 2ND –80 50 0 2.5 –60 100 0 VS = ±70V AV = 10 VOUT = 10VP-P RL = 10k –30 350 Thermal Shutdown Hysteresis 3.0 SUPPLY CURRENT (mA) 500 3RD 2.0 1.5 1.0 0.5 10 0 162 164 166 168 170 172 174 176 178 JUNCTION TEMPERATURE (°C) 100 FREQUENCY (kHz) 6090 G38 6090 G39 6090 G37 Open Circuit Voltage of COM, OD, TFLAG CHANGE IN VOLTAGE OFFSET (µV) 80 PIN VOLTAGE (V) 40 OD COM TFLAG – V = 0V 60 40 20 0 0 20 40 60 80 100 120 TOTAL SUPPLY VOLTAGE (V) 140 6090 G40 40 VS = ±70V RLOAD = 10k TA = 25°C 10 SAMPLES 30 20 CHANGE IN VOLTAGE OFFSET (µV) 100 Open Loop Gain vs Load Resistance Open Loop Gain 10 0 –10 –20 –30 –40 –70 –50 –25 0 25 OUTPUT VOLTAGE (V) 50 75 6090 G41 RLOAD = 500k RLOAD = 10k RLOAD = 100k 30 20 10 0 –10 –20 –30 –40 –70 –50 –25 0 25 OUTPUT VOLTAGE (V) 50 75 6090 G42 6090fe For more information www.linear.com/LTC6090 9 LTC6090/LTC6090-5 PIN FUNCTIONS (S8E/FE) COM (Pin 1/Pin 1): COM Pin is used to interface OD and TFLAG pins to voltage control circuits. Tie this pin to the low voltage ground, or let it float. –IN (Pin 2/Pin 4): Inverting Input Pin. Input common mode range is V – + 3V to V + – 3V. Do not exceed absolute maximum voltage range. +IN (Pin 3/Pin 5): Noninverting Input Pin. Input common mode range is V – + 3V to V + – 3V. Do not exceed absolute maximum voltage range. V– (Pin 4, Exposed Pad Pin 9/Pin 8, Exposed Pad Pin 17): Negative Supply Pin. Connect to V– Only. To achieve low thermal resistance connect this pin to the V – power plane. The V – power plane connection removes heat from the device and should be electrically isolated from all other power planes. OUT (Pin 6/Pin 12): Output Pin. If this rail-to-rail output goes below V– , the ESD protection diode will forward bias. If OUT goes above V+, then output device diodes will forward bias. Avoid forward biasing the diodes on the OUT pin. Excessive current can cause damage. V+ (Pin 7/Pin 14): Positive Supply Pin. OD (Pin 8/Pin 16): Output Disable Pin. Active low input disables the output stage. If left open, an internal pull-up resistor enables the amplifier. Input voltage levels are referred to the COM pin. GUARD (NA/Pins 2, 3, 6, 7, 10, 11, 13, 15): Guard pins increase clearance and creepage between other pins. Pins 3 and 6 can be used to build guard rings around the inputs. TFLAG (Pins 5, 9/Pins 9, 17): Temperature Flag Pin. The TFLAG pin is an open drain output that sinks current when the die temperature exceeds 145°C. 10 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 BLOCK DIAGRAM V+ V+ 2M 2M 10k COM 10k OD 1.2V 2M – ESD + ESD V– V – V+ 125Ω –IN ESD V+ ESD +IN V– OUTPUT ENABLE DIFFERENTIAL DRIVE GENERATOR 125Ω OUT ESD V– TO COM PIN 6k 500Ω V– INPUT STAGE 6k TJ > 175°C DIE TEMPERATURE TJ > 145°C SENSOR TFLAG ESD V– V– 6090 BD 6090fe For more information www.linear.com/LTC6090 11 LTC6090/LTC6090-5 APPLICATIONS INFORMATION General The LTC6090 high voltage operational amplifier is designed in a Linear Technology proprietary process enabling a railto-rail output stage with a 140V supply while maintaining precision, low offset, and low noise. Power Supply The LTC6090 works off single or split supplies. Split supplies can be balanced or unbalanced. For example, two ±70V supplies can be used, or a 100V and –40V supply can be used. For single supply applications place a high quality surface mount ceramic 0.1µF bypass capacitor between the supply pins close to the part. For dual supply applications use two high quality surface mount ceramic capacitors between V+ to ground, and V– to ground located close to the part. When using split supplies, supply sequencing does not cause problems. Input Protection As shown in the block diagram, the LTC6090 has a comprehensive protection network to prevent damage to the input devices. The current limiting resistors and back to back diodes are to keep the inputs from being driven apart. The voltage-current relationship combines exponential and resistive until the voltage difference between the pins reach 12V. At that point the Zeners turn on. Additional current into the pins will snap back the input differential voltage to 9V. In the event of an ESD strike between an input and V–, the voltage clamps and ESD device fire providing a current path to V– protecting the input devices. The input pin protection is designed to protect against momentary ESD events. A repetitive large fast input swing (>5.5V and <20ns rise time) will cause repeated stress on the MOSFET input devices. When in such an application, anti-parallel diodes (1N4148) should be connected between the inputs to limit the swing. rise to 50V, causing 10mA to flow through the feedback resistor. The power dissipated in the output stage will create thermal feedback to the input stage potentially causing shifts in offset voltage. A better choice is a 50k feedback resistor reducing the current in the feedback resistor to 1mA. Interfacing to Low Voltage Circuits The COM pin is provided to set a common signal ground for communication to a microprocessor or other low voltage logic circuit. The COM pin should be tied to the low voltage ground as shown in Figure 1. If left floating, the internal resistive voltage divider will cause the COM pin to rise 30% above mid-supply. The COM, OD, and TFLAG pins are protected from overvoltage by internal Zener diodes and current limiting resistors. Extra care should be taken to observe the absolute maximum voltage limits between (OD and COM) and between (TFLAG and COM). Voltage limits between these pins must remain between –3V and 7V. LTC6090 2M 10k OD TO LOW VOLTAGE CONTROL V+ 2M 10k COM TIE TO LOW VOLTAGE GROUND 2M LOW VOLTAGE SUPPLY V– 6k 500Ω 200k TO LOW VOLTAGE CONTROL Feedback Resistor Selection TFLAG 6k V– To get the most accuracy, the feedback resistor should be chosen carefully. Consider an amplifier with AV = –50 and a 5k feedback resistor. A 1V input will cause the output to 12 V+ 6090 F01 Figure 1. Low Voltage Interface 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 APPLICATIONS INFORMATION When coming out of shutdown the LTC6090 bias circuits and input stage are already powered up leaving only the output stage to turn on and drive to the proper output voltage. Figures 2 and 3 show the part starting up and coming out of shutdown, respectively. V+ OUT 10V/DIV Thermal Shutdown OD 2V/DIV The TFLAG pin is an open drain output pin that sinks 200µA (typical) when the die temperature exceeds 145°C. The temperature sensor has 5°C of hysteresis requiring the part to cool to 140°C before disabling the TFLAG pin. Extra care should be taken to observe the absolute maximum voltage limits between (OD and COM) and between (TFLAG and COM). Voltage limits between these pins must remain between –3V and 7V. OUT 2V/DIV Tying the the TFLAG pin to the OD pin will automatically shut down the output stage as shown in Figure 4. This will ensure the junction temperature does not exceed 150°C. 1ms/DIV 6090 F02 Figure 2. Starting Up 2.5ms/DIV 6090 F03 Figure 3. LTC6090 Output Disable Function Output Disable The OD pin is an active low disable with an internal 2MΩ resistor that will pull up the OD pin enabling the output stage if left open. The OD pin voltage is limited by an internal Zener diode. When the OD pin is brought low to within 0.65V of the COM pin, the output stage is disabled, leaving the bias and input circuits enabled. This results in 580μA (typical) standby current through the device. The OD pin can be directly connected to the low voltage logic or an open drain NMOS device as shown in Figure 1. For simplest shutdown operation, float the COM pin, and tie the OD pin to the TFLAG pin. This will float the low voltage control pins, and the overtemperature circuit will safely shutdown the output stage if the die temperature reaches 145°C. Extra care should be taken to observe the absolute maximum voltage limits between (OD and COM) and between (TFLAG and COM). Voltage limits between these pins must remain between –3V and 7V. For safety, an independent second overtemperature threshold shuts down the output stage if the internal die temperature rises to 175°C. There is hysteresis in the thermal shutdown circuit requiring the die temperature to cool 7°C. Once the device has cooled sufficiently, the output stage will enable. Degradation can occur or reliability may be affected when the junction temperature of the device exceeds 150°C. LTC6090 V+ 2M 10k OD TFLAG OPTIONAL (CAN BE LEFT FLOATING) 6k COM V– 6090 F04 Figure 4. Automatic Thermal Output Disable Using the TFLAG Pin 6090fe For more information www.linear.com/LTC6090 13 LTC6090/LTC6090-5 APPLICATIONS INFORMATION Board Layout GUARD RING The LTC6090 is a precision low offset high gain amplifier that requires good analog PCB layout techniques to maintain high performance. Start with a ground plane that is star connected. Pull back the ground plane from any high voltage vias. Critical signals such as the inputs should have short and narrow PCB traces to reduce stray capacitance which also improves stability. Use high quality surface mount ceramic capacitors to bypass the supply(s). In addition to the typical layout issues encountered with a precision operational amplifier, there are the issues of high voltage and high power. Important consideration for high voltage traces are spacing, humidity and dust. High voltage electric fields between adjacent conductors attract dust. Moisture is absorbed by the dust and can contribute to board leakage and electrical breakdown. C2 R2 – R1 + LTC6090 6090 F05a Figure 5a. Circuit Diagram Showing Guard Ring OUT It is important to clean the PCB after soldering down the part. Solder flux will accumulate dust and become a leakage hazard. It is recommended to clean the PCB with a solvent, or simply use soap and water to remove residue. Baking the PCB will remove left over moisture. Depending on the application, a special low leakage board material may be considered. The TSSOP package has guard pins for applications that require a guard ring. An example schematic diagram and PCB layout is shown in Figures 5a and 5b, respectively, of a circuit using a guard ring to protect the –IN pin. The guard ring completely encloses the high impedance node –IN. To simplify the PCB layout avoid using vias on this node. In addition, the solder mask should be pulled back along the guard ring exposing the metal. To help the spacing between nodes, one of the extra pins on the TSSOP package is used to route the guard ring behind the –IN pin. The PCB should be thoroughly cleaned after soldering to ensure there is no solder paste between the exposed pad (Pin 17) and the guard ring. 14 +IN R2 –IN R1 C2 6090 F05b Figure 5b. TSSOP Package PCB Layout with Guard Ring 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 APPLICATIONS INFORMATION Power Dissipation With a supply voltage of 140V it doesn’t take much current to consume a lot of power. Consider that 10mA at 140V consumes 1.4W of power and needs to be dissipated in a small plastic SO package. To aid in power dissipation both LTC6090 packages have exposed pads for low thermal resistance. The amount of metal connected to the exposed pad will lower the θJA of a package. An optimal amount of PCB metal connected to the SO package will lower the junction to ambient thermal resistance down to 33°C/W. If minimal metal is used, the θJA could more than double (see Table 1). If the exposed pad has no metal beneath it, θJA could be as high 120°C/W. It’s recommended that the exposed pad have as much PCB metal connected to it as reasonably available. The more PCB metal connected to the exposed pad, the lower the thermal resistance. Use multiple vias from the exposed pad to the V– supply plane. The exposed pad is electrically connected to the V– pin. In addition, a heat sink may be necessary if operating near maximum junction temperature. See Table 1 for guidance on how thermal resistance changes as a function of metal area connected to the exposed pad. The LTC6090 is specified to source and sink 10mA at 140V. If the total supply voltage is dropped across the device, 1.4W of power will need to be dissipated. If the quiescent power is included (140V • 2.8mA = 0.4W), the total power dissipated is 1.8W. The internal die temperature will rise 59° using an optimal layout in a SO package. A sub-optimal layout could more than double the amount of temperature increase due to power dissipation. Table 1. Thermal Resistance as PCB Area of Exposed Pad Varies EXAMPLE A TOP LAYER A EXAMPLE B TOP LAYER B EXAMPLE C TOP LAYER C EXAMPLE D TOP LAYER D BOTTOM LAYER A BOTTOM LAYER B BOTTOM LAYER C BOTTOM LAYER D θJA = 50°C/W θJC = 5°C/W θCA = 45°C/W θJA = 57°C/W θJC = 5°C/W θCA = 52°C/W MINIMUM BOTTOM LAYER B MINIMUM BOTTOM LAYER C θJA = 57°C/W θJC = 5°C/W θCA = 52°C/W θJA = 58°C/W θJC = 5°C/W θCA = 53°C/W θJA = 43°C/W θJC = 5°C/W θCA = 38°C/W MINIMUM BOTTOM LAYER A θJA = 54°C/W θJC = 5°C/W θCA = 49°C/W θJA = 72°C/W θJC = 5°C/W θCA = 67°C/W 6090fe For more information www.linear.com/LTC6090 15 LTC6090/LTC6090-5 APPLICATIONS INFORMATION In order to avoid damaging the device, the absolute maximum junction temperature should not be exceeded (TJMAX = 150°C). Junction temperature is determined using the expression: TJ = PD • θJA + TA where PD is the power dissipated in the package, θJA is the package thermal resistance from ambient to junction and TA is the ambient temperature. For example, if the part has a 140V supply voltage with 2.8mA of quiescent current and the output is 20V above the negative rail sourcing 10mA, the total power dissipated in the device is (120V • 10mA) + (140V • 2.8mA) = 1.6W. Under these conditions the ambient temperature should not exceed: TA = TJMAX – (PD • θJA) = 150°C – (1.6W • 33°C/W) = 97°C. and any additional heat sinking. The six SOA curves in Figure 6 show the direct effect of θJA on SOA. Stability with Large Resistor Values A large feedback resistor along with the intrinsic input capacitance will create an additional pole that affects stability and causes peaking in the closed loop response. To mitigate the peaking a small feedback capacitor placed around the feedback resistor, as shown in Figure 7, will reduce the peaking and overshoot. Figure 8 shows the closed loop response with various feedback capacitors. Additionally stray capacitance on the input pins should be kept to a minimum. With pA input current, the PCB traces should be routed as short and narrow as possible. CF Safe Operating Area The safe operating area, or SOA, illustrates the voltage, current, and temperature conditions where the device can be reliably operated. Shown below in Figure 6 is the SOA for the LTC6090. The SOA takes into account ambient temperature and the power dissipated by the device. This includes the product of the load current and difference between the supply and output voltage, and the quiescent current and supply voltage. The LTC6090 is safe when operated within the boundaries shown in Figure 6. Thermal resistance junction to case, θJC, is rated at a constant 5°C/W. Thermal resistance junction to ambient, θJA, is dependent on board layout 100 – 10k PARASITIC INPUT CAPACITANCE + LTC6090 6090 F07 Figure 7. LTC6090 with Feedback Capacitance to Reduce Peaking 25 CF = 0pF CF = 2pF CF = 4pF 20 GAIN (dB) CURRENT DENSITY LIMITED TA = 25°C LOAD CURRENT (mA) 100k 15 JUNCTION TEMPERATURE 10 LIMITED 1 TA = 90°C θJA = 33°C/W θJA = 60°C/W θJA = 100°C/W θJA = 33°C/W θJA = 60°C/W θJA = 100°C/W 1 10 1 10 100 FREQUENCY (kHz) 1000 6090 F08 10 100 1000 SUPPLY VOLTAGE – LOAD VOLTAGE (V) Figure 8. Closed Loop Response with Various Feedback Capacitors 6090 F06 Figure 6. Safe Operating Area 16 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 APPLICATIONS INFORMATION The LTC6090 includes a slew enhancement circuit which boosts the slew rate to 21V/μs making the part capable of slewing rail-to-rail across the 140V output range in less than 7μs. To optimize the slew rate and minimize settling, stray capacitance should be kept to a minimum. A feedback capacitor reduces overshoot and nonlinearities associated with the slew enhancement circuit. The size of the feedback capacitor should be tailored to the specific board, supply voltage and load conditions. Slewing is a nonlinear behavior and will affect distortion. The relationship between slew rate and full power bandwidth is given in the relationship below. SR = VO • ω Where VO is the peak output voltage and ω is frequency in radians. The fidelity of a large sine wave output is limited by the slew rate. The graph in Figure 9 shows distortion versus frequency for several output levels. TOTAL HARMONIC DISTORTION + NOISE (%) Slew Enhancement 10 VS = ±70V AV = 5 RL = 10k CF = 30pF 1 0.1 VOUT = 100VP-P 0.01 0.001 VOUT = 50VP-P VOUT = 10VP-P 10 100 1000 10000 FREQUENCY (Hz) 6090 F09 Figure 9. Distortion vs Frequency for Large Output Swings SELECT CH1 10k + OD COM LTC6090 – 10k Multiplexer Application Several LTC6090s may be arranged to act as a high voltage analog multiplexer as shown in Figure 10. When using this arrangement, it is possible for the output to affect the source on the disabled amplifier’s noninverting input. The inverting and noninverting inputs are clamped through resistors and back to back diodes. There is a path for current to flow from the multiplexer output through the disabled amplifier’s feedback resistor, and through the inputs to the noninverting input’s source. For example, if the enabled amplifier has a –70V output, and the disabled amplifier has a 5V input, there is 75V across the two resistors and the input pins. To keep this current below 1mA the combined resistance of the RIN and feedback resistor needs to be about 75k. 100000 100k CH2 10k MUX OUT + OD COM LTC6090 – 10k 100k 6090 F10 Figure 10. Multiplexer Application The output impedance of the disabled amplifier is greater than 10MΩ at DC. The AC output impedance is shown in the Typical Performance Characteristics section. 6090fe For more information www.linear.com/LTC6090 17 LTC6090/LTC6090-5 TYPICAL APPLICATIONS Gain of 20 Amplifier with a 40mA Protected Output Driver Gain of 10 with Protected Output Current Doubler 200k 1% 40.2k 70V 47pF 2 VIN 2k 3 40.2k – 7 4 2k – BAV99 5 8 TF LTC6090 OD + 70V 22.1k 1% CZT5551 9 1k 6 604Ω 1k 1 + VIN 12.1Ω ±70V AT ±20mA VOUT –70V BAV99 70V CZT5401 –70V 100Ω 1% TF LTC6090 OD 200k – 100Ω 1% TF LTC6090 OD 6090 TA02 6090 TA03 + –70V 12V to ±70V Isolated Flyback Converter for Amplifier Supply 750311692 CRM1U-06M 1:1:5 VIN 12V 2.2µF 1M • BZX100A VIN BAV20W EN/UVLO 562k RFB 0.47µF 100V • + 100k LTC6090 RREF LT3511 • 10k TC – CRM1U-06M 0.47µF 100V VOUT2– SW VC 70V VOUT1+ GND BIAS 24.9k –70V 4.7µF 2.2nF 6090 TA04 9V to ±65V Isolated Flyback Converter for Amplifier Supply 750311692 1:1:5 VIN 9V 100k 1 2 22k 3 LT8300 EN/UVLO VIN GND RFB SW 130k 5 4 4 3 4.7µF 8 • 65V CMMR1U-2 6 • 1µF 130V CMHZ5266B + LTC6090 7 • – CMMR1U-2 5 1µF 100V 6090 TA05 18 –65V 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 TYPICAL APPLICATIONS Audio Power Amplifier 50V 1N4148 40.2Ω 1nF 1N4148 100pF CZT5401 1k 33.2k IXTH50N20 100pF VTOP 7 2 1k 3 1nF 5 LTC6090 + 4 9 100pF 8 1 2.49k 6 1N4148 LT1166 VIN 1k 100k ILIM+ 0.1Ω 1µF 1µH VOUT 1µF 1N4148 0.1Ω ILIM– OUT 22nF 10Ω 20k 1k SENSE– 100k VBOTTOM 10k* 499Ω 499Ω 33.2k CZT5551 1nF 1N4148 IXTH24P20 100pF 1N4148 39.2Ω –50V 6090 TA06a * USE SEVERAL SERIES RESISTORS TO REDUCE DISTORTION (i.e. 5 × 2kΩ). Total Harmonic Distortion Plus Noise Analyzer Passband 10Hz to 80kHz TOTAL HARMONIC DISTORTION PLUS NOISE (%) IN – SENSE+ 0.100 0.010 4Ω AT 100W 0.001 8Ω AT 50W 0 10 100 1000 10000 FREQUENCY (Hz) 100000 6090 TA06b 6090fe For more information www.linear.com/LTC6090 19 LTC6090/LTC6090-5 TYPICAL APPLICATIONS High Current Pulse Amplifier 75pF 10k 70V 7 2 499Ω IN 3 10k – + 9 2SK1057 IHSM-3825 1µH 8 LTC6090 4 499Ω 1k 5 6 1 499Ω 100Ω –70V OUT 2SJ161 6090 TA07 60V Step Response Into 10Ω 40 30 VOLTS 20 10 0 –10 –20 5µs/DIV 20 6090 TA07b 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 TYPICAL APPLICATIONS Simple 100W Audio Amplifier 50pF 2k 2k 2k 2k 2k 50V 100k 100Ω 2SK1057 100nF 7 2 499Ω 3 10k 5 4 499Ω 9 6.8k 8 LTC6090 + 6 IHSM-3825 1µH 1k 10k OUT BIAS 1 1k 6.8k 2SJ161 100nF 100Ω 2SJ161 100k –50V 6090 TA08a SET QUIESCENT SUPPLY CURRENT AT ABOUT 200mA WITH BIAS ADJUSTMENT. SET QUIESCENT CURRENT TO 100mA IF PARALLEL MOSFETs ARE NOT USED (FOR 8Ω OR HIGHER). Total Harmonic Distortion Plus Noise vs Frequency TOTAL HARMONIC DISTORTION PLUS NOISE (%) IN – 2SK1057 1 0.1 4Ω AT 100W 0.01 8Ω AT 50W 0.001 0.0001 100 1k FREQUENCY (Hz) 10k 6090 TA08b 6090fe For more information www.linear.com/LTC6090 21 LTC6090/LTC6090-5 TYPICAL APPLICATIONS Wide Common Mode Range 10x Gain Instrumentation Amplifier Typically <1mV Input-Referred Error 70V 7 3 +IN 2 + 5 8 LTC6090 – 4 9 6 22pF 10k* 1 100k 22pF 1 LT5400-2 100k 2 7 8 7 3 100k –70V 205k 70V 7 3 –IN 70V 2 + 4 3 100k 5 9 22pF 8 6 100k 10k* 6 2 5 4 LTC6090 – 24.9k 100k 9 + 5 8 LTC6090 – 4 9 6 1 49.9Ω OUT –3dB at 45kHz 22pF LTC6090 TA09 1 –70V * THESE RESISTORS CAN BE 0Ω IF INPUT SIGNAL SOURCE IMPEDANCES ARE <20MΩ. –70V 90 CMRR (dB) 80 70 60 50 40 1 10 CM FREQUENCY (kHz) 100 6090 TA09b 22 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC6090#packaging for the most recent package drawings. FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K) Exposed Pad Variation BA 4.90 – 5.10* (.193 – .201) 2.74 (.108) 2.74 (.108) 16 1514 13 12 1110 6.60 ±0.10 4.50 ±0.10 9 2.74 (.108) 2.74 6.40 (.108) (.252) BSC SEE NOTE 4 0.45 ±0.05 1.05 ±0.10 0.65 BSC 1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.25 REF 0° – 8° 0.65 (.0256) BSC 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE 1.10 (.0433) MAX 0.195 – 0.30 (.0077 – .0118) TYP 0.05 – 0.15 (.002 – .006) FE16 (BA) TSSOP REV K 0913 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 6090fe For more information www.linear.com/LTC6090 23 LTC6090/LTC6090-5 PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC6090#packaging for the most recent package drawings. S8E Package 8-Lead Plastic SOIC (Narrow .150 Inch) Exposed Pad (Reference LTC DWG # 05-08-1857 Rev C) .050 (1.27) BSC .189 – .197 (4.801 – 5.004) NOTE 3 .045 ±.005 (1.143 ±0.127) 8 .089 .160 ±.005 (2.26) (4.06 ±0.127) REF .245 (6.22) MIN .150 – .157 .080 – .099 (2.032 – 2.530) (3.810 – 3.988) NOTE 3 .228 – .244 (5.791 – 6.197) 1 .030 ±.005 (0.76 ±0.127) TYP .005 (0.13) MAX 7 5 6 .118 (2.99) REF 3 2 .118 – .139 (2.997 – 3.550) 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° (0.254 – 0.508) .008 – .010 (0.203 – 0.254) .053 – .069 (1.346 – 1.752) 0°– 8° TYP .016 – .050 (0.406 – 1.270) .014 – .019 (0.355 – 0.483) TYP NOTE: 1. DIMENSIONS IN INCHES (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010" (0.254mm) 24 4. STANDARD LEAD STANDOFF IS 4mils TO 10mils (DATE CODE BEFORE 542) 5. LOWER LEAD STANDOFF IS 0mils TO 5mils (DATE CODE AFTER 542) 4 5 .004 – .010 0.0 – 0.005 (0.101 – 0.254) (0.0 – 0.130) .050 (1.270) BSC S8E 1015 REV C 6090fe For more information www.linear.com/LTC6090 LTC6090/LTC6090-5 REVISION HISTORY REV DATE DESCRIPTION A 11/12 Added ESD Statement. PAGE NUMBER 2 B 9/13 Corrected schematics 16, 17, 18 C 6/14 Added LTC6090-5, Improved specs. D 5/15 Removed ESD statement to reflect improved ESD performance. Changed internal TFLAG circuit resistor values. Updated Thermal Shutdown description. Corrected application circuit resistor value. E 11/15 Corrected resistor values All 2 11, 12 13 19, 20, 21 20, 21 6090fe Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representaFor more information www.linear.com/LTC6090 tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 25 LTC6090/LTC6090-5 TYPICAL APPLICATION Extended Dynamic Range 1MΩ Transimpedance Photodiode Amplifier 0.3pF 10M 1% IPD 125V 2 3 PHOTODIODE SFH213 – + 7 8 LTC6090 1 5 200k 1% 100mW 4 –3V VOUT 6 22.1k 1% –3V VOUT = IPD • 1M OUTPUT NOISE = 21µVRMS (1kHz – 40kHz) OUTPUT OFFSET = 150µV MAXIMUM BANDWIDTH = 40kHz (–3dB) OUTPUT SWING = 0V TO 12V 6090 TA10 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT1990 ±250V Input Range G = 1, 10, Micropower, Difference Amplifier Pin Selectable Gain of 1 or 10 LT1991 Precision, 100µA Gain Selectable Amplifier Pin Configurable as a Difference Amplifier, Inverting and Noninverting Amplifier Quad Matched Resistor Network Excellent Matching Specifications Over the Entire Temperature Range Amplifiers Matched Resistors LT5400 Digital to Analog Converters LTC2641/LTC2642 16-Bit VOUT DACs in 3mm × 3mm DFN LTC2756 Serial 18-Bit SoftSpan IOUT DAC Guaranteed Monotonic Over Temperature 18-Bit Settling Time: 2.1µs Maximum 18-Bit INL Error: ±1 LSB Over Temperature Flyback Controllers LT3511 Monolithic High Voltage Isolated Flyback Converter 4.5V to 100V Input Voltage Range, No Opto-Coupler Required LT8300 100VIN Micropower Isolated Flyback Converter with 150V/260mA Switch 26 Linear Technology Corporation 6V to 100V Input Voltage Range. VOUT Set with a Single External Resistor 1630 McCarthy Blvd., Milpitas, CA 95035-7417 For more information www.linear.com/LTC6090 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC6090 6090fe LT 1115 REV E • PRINTED IN USA LINEAR TECHNOLOGY CORPORATION 2012