LITTELFUSE SP3002

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF
RoHS
Pb
GREEN
SP3002 Lead-Free/Green Series
Description
The SP3002 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 4
GND
VCC
I/O 2
I/O 3
I/O 1
1
NC
2
I/O 2
3
Gnd
6
I/O 4
5
V CC
4
I/O 3
Functional Block Diagram
I/O2
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t&4%QSPUFDUJPOPG
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
t4NBMMQBDLBHJOHPQUJPOT
saves board space
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
uDFN-6
(1.6x1.6x0.5mm)
SC70-6 and SOT23-6
t-PXDBQBDJUBODFPG
0.85 pF (TYP) per I/O
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 4.5A
(8/20μs)
Applications
I/O4
VCC
t$PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
I/O1
GND
I/O3
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
45
Revised: February 9, 2010
SP3002 Lead-Free/Green Series
Lead-Free/Green SP3002
I/O 1
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
4.5
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-50 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
Storage Temperature Range
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1μA
6.0
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
VC
ESD Withstand Voltage1
Diode Capacitance1
1
Diode Capacitance
VESD
C*0(/%
Min
Typ
IPP=1A, tp=8/20μs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20μs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1.0
pF
CI/O-I/O
Reverse Bias=0V
0.5
pF
/PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO
SP3002 Lead-Free/Green Series
46
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
0.50
-20
1.E+06
1.E+07
1.E+08
1.E+09
0.0
1.E+10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
Capacitance vs. Frequency
2E-12
1.8E-12
1.6E-12
Capacitance [F]
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
1.E+07
1.E+08
Lead-Free/Green SP3002
0
1.E+06
1.E+09
Frequency [Hz]
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
47
Revised: February 9, 2010
SP3002 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Application Example
+5V
D2+
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
Clk-
Gnd
ASIC HDMI/DVI drivers can also be protected with the
SP300x-04, the +VCC pins on the SP300x-04 can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +VCC of the SP300x-04 can be
nPBUFEPS/$
HDMI or DVI application example for the Littelfuse
SP300x-04 protection devices. A single 4 channel
SP300x-04 device can be used to protect four of the data
lines in a HDMI/DVI interface. Two (2) SP300x-04 devices
provide protection for the main data lines. Low voltage
Soldering Parameters
Reflow Condition
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP3002 Lead-Free/Green Series
48
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SC70-6
e
e
6
5
Package
SC70-6
Pins
6
4
E
JEDEC
HE
MO-203 Issue A
Millimeters
1
2
3
B
D
A2 A
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
A1
C
Inches
Solder Pad Layout
e
L
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions - SOT23-6
Package
SOT23-6
Pins
6
JEDEC
MO-203 Issue A
Millimeters
Inches
Notes
Min
Max
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 Ref
e1
1.9 Ref
0.0748 Ref
L
0.100
N
a
Recommended Solder Pad Layout
Max
0.600
0.004
10º
0º
6
0º
0.023
6
4,5
6
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
/PUFT
%JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*.
2. Package conforms to EIAJ SC-74 (1992).
M
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
P
i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT
$POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ
exact.
R
O
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
49
Revised: February 9, 2010
SP3002 Lead-Free/Green Series
Lead-Free/Green SP3002
Min
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - uDFN (1.6x1.6x0.5mm)
Bottom View
Top View
D
5
Millimeters
0.05 C
L
6
uDFN (1.6x1.6x0.5mm)
D2
A
4
4
6
5
2
Max
Min
Max
0.45
0.55
0.018
0.022
A1
0.00
0.05
0.000
A3
E2
1
Min
A
0.05 C
E
Pin 1 Index Area
3
2
3
B
1
A3
0.002
0.005 Ref
b
0.20
0.30
0.008
0.012
1.50
1.70
0.060
0.067
D2
1.05
1.30
0.042
0.052
E
1.50
1.70
0.060
0.067
E2
0.40
0.65
0.016
Side View
A1
0.127 Ref
D
Pin 1 chamfer
0.10 x 45’
0.05 C
Inches
Symbol
e
A
Seating plane
L
0.50 Ref
0.25
0.026
0.020 Ref
0.40
0.010
0.016
C
b
0.10 M C A B
0.05 M C
SP3002 Lead-Free/Green Series
50
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Product Characteristics
Part Numbering System
SP3002-04XTG
Silicon
Protection
Array
Series
Number of Channels
G= Green
T= Tape & Reel
Package
H = SOT23-6
J = SC70-6
U = uDFN-6
-04 = 4 channel
Lead Plating
4$405.BUUF5JO
V%'/1SF1MBUFE'SBNF
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
/PUFT
1. All dimensions are in millimeters
Part Marking System
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
E X4
EX4
Product Series
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Number of Channels
6. Package surface matte finish VDI 11-13.
E = SP3002 series
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3002-04HTG
SOT23-6
EX4
3000
SP3002-04JTG
SC70-6
EX4
3000
SP3002-04UTG
V%'/YYNN
EX4
3000
Symbol
Min
Max
Min
Max
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
40.0+/- 0.20
W
7.70
8.10
1.574+/-0.008
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
t
©2010 Littelfuse, Inc.
Inches
E
10P0
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Millimetres
51
Revised: February 9, 2010
0.27 Max
0.010 Max
SP3002 Lead-Free/Green Series
Lead-Free/Green SP3002
Embossed Carrier Tape & Reel Specification - SC70-6
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Embossed Carrier Tape & Reel Specification -- SOT23-6
NN5"1&"/%3&&ACCESS HOLE
4.0mm
1.5mm
DIA. HOLE
14.4mm
2.0mm
1.75mm
CL
8mm
13mm
4.0mm
60mm
180mm
SOT-23 (8mm POCKET PITCH)
8.4mm
USER DIRECTION OF FEED
PIN 1
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
COVER TAPE
Symbol
t
W
B0
Max
1.65
1.85
0.06
0.07
3.55
0.14
0.14
D1
1.00
1.25
0.04
P0
F
Min
3.45
.*/
D
P0
Inches
Max
F
10P0
D1
Millimetres
Min
E
E
P2
D
Embossed Carrier Tape & Reel Specification -- uDFN-6 (1.6x1.6x0.5mm)
3.90
0.05
.*/
4.10
40.0+/- 0.20
0.15
0.16
1.57+/-0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.78
1.88
0.07
0.07
B0
1.78
1.88
0.07
0.07
K0
0.84
0.94
0.03
0.04
A0
0.25 TYP
0.01 TYP
K0
t
SP3002 Lead-Free/Green Series
52
Revised: February 9, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.