SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array HF RoHS Pb GREEN SP3002 Lead-Free/Green Series Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 4 GND VCC I/O 2 I/O 3 I/O 1 1 NC 2 I/O 2 3 Gnd 6 I/O 4 5 V CC 4 I/O 3 Functional Block Diagram I/O2 t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t&4%QSPUFDUJPOPG ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) t4NBMMQBDLBHJOHPQUJPOT saves board space t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) uDFN-6 (1.6x1.6x0.5mm) SC70-6 and SOT23-6 t-PXDBQBDJUBODFPG 0.85 pF (TYP) per I/O t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 4.5A (8/20μs) Applications I/O4 VCC t$PNQVUFS1FSJQIFSBMT t/FUXPSL)BSEXBSF1PSUT t.PCJMF1IPOFT t5FTU&RVJQNFOU t1%"T t.FEJDBM&RVJQNFOU t%JHJUBM$BNFSBT I/O1 GND I/O3 -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 45 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 I/O 1 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol Parameter Value Units 4.5 A Operating Temperature -40 to 85 °C Storage Temperature -50 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1μA 6.0 V Reverse Leakage Current ILEAK VR=5V 0.5 μA Clamp Voltage1 VC ESD Withstand Voltage1 Diode Capacitance1 1 Diode Capacitance VESD C*0(/% Min Typ IPP=1A, tp=8/20μs, Fwd 9.5 11.0 V IPP=2A, tp=8/20μs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1.0 pF CI/O-I/O Reverse Bias=0V 0.5 pF /PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO SP3002 Lead-Free/Green Series 46 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 0.50 -20 1.E+06 1.E+07 1.E+08 1.E+09 0.0 1.E+10 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Frequency [Hz] Capacitance vs. Frequency 2E-12 1.8E-12 1.6E-12 Capacitance [F] 1.4E-12 1.2E-12 1E-12 8E-13 6E-13 4E-13 2E-13 1.E+07 1.E+08 Lead-Free/Green SP3002 0 1.E+06 1.E+09 Frequency [Hz] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 47 Revised: February 9, 2010 SP3002 Lead-Free/Green Series SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- Clk- Gnd ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be nPBUFEPS/$ HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP3002 Lead-Free/Green Series 48 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SC70-6 e e 6 5 Package SC70-6 Pins 6 4 E JEDEC HE MO-203 Issue A Millimeters 1 2 3 B D A2 A Min Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 A1 C Inches Solder Pad Layout e L 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions - SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Notes Min Max A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 Ref e1 1.9 Ref 0.0748 Ref L 0.100 N a Recommended Solder Pad Layout Max 0.600 0.004 10º 0º 6 0º 0.023 6 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - /PUFT %JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*. 2. Package conforms to EIAJ SC-74 (1992). M 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. P i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT $POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ exact. R O ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 49 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 Min SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - uDFN (1.6x1.6x0.5mm) Bottom View Top View D 5 Millimeters 0.05 C L 6 uDFN (1.6x1.6x0.5mm) D2 A 4 4 6 5 2 Max Min Max 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 A3 E2 1 Min A 0.05 C E Pin 1 Index Area 3 2 3 B 1 A3 0.002 0.005 Ref b 0.20 0.30 0.008 0.012 1.50 1.70 0.060 0.067 D2 1.05 1.30 0.042 0.052 E 1.50 1.70 0.060 0.067 E2 0.40 0.65 0.016 Side View A1 0.127 Ref D Pin 1 chamfer 0.10 x 45’ 0.05 C Inches Symbol e A Seating plane L 0.50 Ref 0.25 0.026 0.020 Ref 0.40 0.010 0.016 C b 0.10 M C A B 0.05 M C SP3002 Lead-Free/Green Series 50 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Product Characteristics Part Numbering System SP3002-04XTG Silicon Protection Array Series Number of Channels G= Green T= Tape & Reel Package H = SOT23-6 J = SC70-6 U = uDFN-6 -04 = 4 channel Lead Plating 4$405.BUUF5JO V%'/1SF1MBUFE'SBNF Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. E X4 EX4 Product Series 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Channels 6. Package surface matte finish VDI 11-13. E = SP3002 series Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP3002-04HTG SOT23-6 EX4 3000 SP3002-04JTG SC70-6 EX4 3000 SP3002-04UTG V%'/YYNN EX4 3000 Symbol Min Max Min Max 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0+/- 0.20 W 7.70 8.10 1.574+/-0.008 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t ©2010 Littelfuse, Inc. Inches E 10P0 Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Millimetres 51 Revised: February 9, 2010 0.27 Max 0.010 Max SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 Embossed Carrier Tape & Reel Specification - SC70-6 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification -- SOT23-6 NN5"1&"/%3&&ACCESS HOLE 4.0mm 1.5mm DIA. HOLE 14.4mm 2.0mm 1.75mm CL 8mm 13mm 4.0mm 60mm 180mm SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED PIN 1 GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. COVER TAPE Symbol t W B0 Max 1.65 1.85 0.06 0.07 3.55 0.14 0.14 D1 1.00 1.25 0.04 P0 F Min 3.45 .*/ D P0 Inches Max F 10P0 D1 Millimetres Min E E P2 D Embossed Carrier Tape & Reel Specification -- uDFN-6 (1.6x1.6x0.5mm) 3.90 0.05 .*/ 4.10 40.0+/- 0.20 0.15 0.16 1.57+/-0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 0.04 A0 0.25 TYP 0.01 TYP K0 t SP3002 Lead-Free/Green Series 52 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.