SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection HF RoHS Pb GREEN SP1005 Lead-Free/Green Series Description The SP1005 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 1 2 t&4%*&$ ±30kV contact, ±30kV air t-PXDBQBDJUBODFPGQ' (@ VR=0V) t&'5*&$" (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.1μA at 5V t-JHIUOJOH*&$ 10A (tP=8/20μs) t*OEVTUSJFTTNBMMFTU&4% footprint available (0201) Note: Drawing not to scale. Functional Block Diagram 2 t.PCJMFQIPOFT t.11.1 t4NBSUQIPOFT t$BNDPSEFST t1PSUBCMFOBWJHBUJPO devices t1%" t1PSUBCMFNFEJDBM t%JHJUBMDBNFSBT t1PJOUPGTBMFUFSNJOBMT Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 39 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 1 Applications SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Absolute Maximum Ratings Symbol Parameter Value Units 10.0 A Operating Temperature -40 to 85 °C Storage Temperature -65 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Storage Temperature Range Units -65 to 150 °C .BYJNVN+VODUJPO5FNQFSBUVSF 150 °C .BYJNVN-FBE5FNQFSBUVSF4PMEFSJOHT 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage V38. Voltage Drop Leakage Current 1 Clamp Voltage Min Typ Max Units 6.0 V VD IR=1mA 8.5 9.5 V ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA IPP=1A, tpT'XE 9.3 V IPP=2A, tpT'XE 10.0 V IPP=10A, tPçT'XE 15.6 V (VC2 - VC1) / (IPP2 - IPP1) 0.7 Ω VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 Test Conditions IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV CD Reverse Bias=0V 30 Q' Reverse Bias=2.5V 23 Q' NOTES: 1 Parameter is guaranteed by design and/or device characterization. SP1005 Lead-Free/Green Series 40 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Capacitance vs. Reverse Bias Pulse Waveform 110% 40.0 100% 35.0 90% 30.0 Capacitance (pF) 80% 25.0 70% 20.0 60% 50% 15.0 40% 10.0 30% 20% 5.0 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0% 0.0 5.0 5.0 10.0 15.0 20.0 25.0 30.0 Bias Voltage (V) Insertion Loss (S21) I/O to GND 18.0 5 16.0 0 14.0 -5 Attenuation (dB) Clamp Voltage (VC) Clamping Voltage vs. IPP 12.0 10.0 8.0 6.0 -10 -15 -20 -25 4.0 -30 2.0 -35 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 1 10.0 Peak Pulse Current-IPP (A) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 10 100 1000 10000 Frequency (MHz) 41 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 0.0 1.0 SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Application Example Keypads Outside World I/O Controller P1 P2 P3 P4 IC SP1005 (x4) GND Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow 1Co'SFFBTTFNCMZ 3°C/second max 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) NJOVUFT.BY Do not exceed 260°C SP1005 Lead-Free/Green Series 42 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Package Dimensions - 0201 Flipchip 0201 Flipchip Symbol A B F C E Min Typ Max Min Typ Max A 0.595 0.620 0.645 0.0234 0.0244 0.0254 B 0.295 0.320 0.345 0.0116 0.0126 0.0136 C 0.245 0.275 0.305 0.0096 0.0108 0.0120 0.145 0.150 0.155 0.0057 0.0059 0.0061 E 0.245 0.250 0.255 0.0096 0.0098 0.0100 F 0.245 0.250 0.255 0.0096 0.0098 0.0100 G 0.005 0.010 0.015 0.0002 0.0004 0.0006 D Product Characteristics Part Numbering System SP 1005 – 01 W T G Silicon Protection Array Inches D G D Millimeters G= Green T= Tape & Reel Lead Plating Sn Lead Material Copper Lead Coplanarity 6 um (max) Subsitute Material Silicon Body Material Silicon Series Number of Channels Package W: 0201 Flipchip Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 3. Dimensions are exclusive of mold flash & metal burr. 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. SP1005-01WTG 'MJQDIJQ t 10000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 43 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Embossed Carrier Tape & Reel Specification – 0201 Flipchip P1 P0 D P2 E F W Symbol Millimeters A0 0.41+/-0.03 B0 0.70+/-0.03 D ø 1.50 + 0.10 D1 ø 0.20 +/- 0.05 E 1.75+/-0.10 F 3.50+/-0.05 K0 0.38+/-0.03 P0 2.00+/-0.05 P1 2.00+/-0.05 P2 4.00+/-0.10 W 8.00 + 0.30 -0.10 T 0.23+/-0.02 D1 T K0 A0 B0 Recommended Solder Pad Footprint 0.30 0.28 0.75 0.19 *Sizes in mm SP1005 Lead-Free/Green Series 44 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.