Data Sheet

XS
ON
7
PUSB3FR6
ESD protection for ultra high-speed interfaces
Rev. 1 — 25 February 2015
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed and
Hi-Speed USB combination, SD-memory card 3.0 and thunderbolt interfaces against
ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures for ultra high-speed
signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1)
Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode structure offering ultra low line
capacitance of only 0.35 pF. These diodes utilize a snap-back structure in order to provide
protection to downstream components from ESD voltages up to 15 kV contact exceeding
IEC 61000-4-2, level 4.
1.2 Features and benefits
 System-level ESD protection for USB 2.0 and USB 3.1 combination, SD-memory card
and thunderbolt interfaces
 Supports SuperSpeed USB 3.1 at 10 Gbps
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 15 kV exceeding IEC 61000-4-2, level 4
 Matched 0.5 mm trace spacing
 Line capacitance of only 0.35 pF for each channel
 Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
 Portable and wearable devices
 Smartphones and tablet PCs
 TVs and monitors
 DVD recorders and players
 Notebooks, main board graphic cards and ports
 Set-top boxes and game consoles
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
Simplified outline
1
CH1
channel 1 ESD protection
2
GND
ground
3
CH2
channel 2 ESD protection
4
CH3
channel 3 ESD protection
5
CH4
channel 4 ESD protection
Graphic symbol
1
3
4
5
6
7
1
6
CH5
channel 5 ESD protection
7
CH6
channel 6 ESD protection
7
2
2
6
3
5
4
=
Transparent top view
aaa-016877
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
PUSB3FR6
DFN2111-7
plastic extremely thin small outline package;
SOT1358-1
no leads; 7 terminals; body 1.1  2.1  0.5 mm
Version
4. Marking
Table 3.
Marking codes
Type number
Marking code
PUSB3FR6
FR
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
Product data sheet
Min
Max
Unit
0.5
+3.3
V
contact discharge
15
+15
kV
air discharge
15
+15
kV
7
7
A
IEC 61000-4-2, level 4
tp = 8/20 s
[1]
IPPM
rated peak pulse current
Tamb
ambient temperature
40
+85
C
Tstg
storage temperature
55
+125
C
[1]
PUSB3FR6
electrostatic discharge
voltage
Conditions
All pins to ground.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
6. Characteristics
Table 5.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBR
breakdown voltage
II = 1 mA
6
-
-
V
ILR
reverse leakage current per channel; VI = 3 V
-
1
100
nA
VF
forward voltage
-
0.7
-
V
-
0.35
0.40
pF
positive transient
-
0.29
-

negative transient
-
0.29
-

Cline
dynamic resistance
rdyn
Vsbck
VCL
PUSB3FR6
Product data sheet
line capacitance
snapback voltage
clamping voltage
II = 1 mA
f = 1 MHz; VI = 1.5 V
[1]
TLP
[3]
II = 1 A; TLP 100/10 ns
-
1.6
-
V
IPP = 5 A; positive transient
[2]
-
3
-
V
IPP = 5 A;
negative transient
[2]
-
3
-
V
[1]
This parameter is guaranteed by design.
[2]
According to IEC 61000-4-5 (8/20 s current waveform).
[3]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-016878
5
aaa-016880
1.2
Sdd21
(dB)
a
0
0.8
-5
-10
0.4
-15
-20
107
108
109
0.0
1010
0
2
4
6
VI (V)
f (Hz)
differential mode
C line
a = --------------------------------C line  V = 0 V 
I
Fig 1.
Insertion loss; typical values
Fig 2.
Relative capacitance as a function of input
voltage; typical values
aaa-016881
-10
Sdd21
(dB)
-30
-50
-70
107
108
109
1010
f (Hz)
normalized to 100 
Fig 3.
Crosstalk; typical values
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-016882
Data rate: 10 Gbit/s
Vertical scale: 325 mV/div
Horizontal scale: 16.7 ps/div
Fig 4.
USB 3.1 eye diagram, Printed-Circuit Board (PCB) with PUSB3FR6
aaa-016883
Data rate: 10 Gbit/s
Vertical scale: 325 mV/div
Horizontal scale: 16.7 ps/div
Fig 5.
PUSB3FR6
Product data sheet
USB 3.1 eye diagram, PCB without PUSB3FR6 (reference)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-016884
25
IPP
(A)
aaa-016885
0
IPP
(A)
20
-5
15
-10
10
-15
5
-20
0
0
5
10
15
20
-25
-25
25
-20
-15
-10
-5
VCL (V)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 6.
tp = 100 ns; Transmission Line Pulse (TLP)
Dynamic resistance with positive clamping;
typical values
Fig 7.
Dynamic resistance with negative clamping;
typical values
aaa-016886
25
IPP
(A)
aaa-016887
0
IPP
(A)
20
-5
15
-10
10
-15
5
-20
0
0
5
10
15
20
-25
-25
25
-20
-15
-10
VCL (V)
-5
0
VCL (V)
tp = 5 ns; Very-Fast TLP (VF-TLP)
Fig 8.
0
VCL (V)
tp = 5 ns; Very-Fast TLP (VF-TLP)
Dynamic resistance with positive clamping;
typical values
Fig 9.
Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snapback behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-016890
8
aaa-016891
0
IPP
(A)
IPP
(A)
6
-2
4
-4
2
-6
0
-8
0
2
4
6
8
-8
-6
-4
-2
VCL (V)
0
VCL (V)
IEC 61000-4-5; tp = 8/20 s; positive pulse
IEC 61000-4-5; tp = 8/20 s; negative pulse
Fig 10. Dynamic resistance with positive clamping;
typical values
Fig 11. Dynamic resistance with negative clamping;
typical values
7. Package outline
0.5
max
1.2
1.0
0.1
0.05 max
1
7
2.20
2.05
0.5
1.0
1.5
5
4
0.127
Dimensions in mm
0.5
0.3
0.2
min
0.25
0.15
14-05-07
Fig 12. Package outline DFN2111-7 (SOT1358-1)
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
8. Soldering
Footprint information for reflow soldering of DFN2111-7 (SOT1358-1) package
SOT1358-1
1.56
0.2
0.63 (7x)
0.5
1.7
2.3
0.5
0.2
0.3
0.3 (7x)
0.2 (7x)
0.53 (7x)
0.3
1.36
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-04-24
14-05-07
sot1358-1_fr
Fig 13. Reflow soldering footprint DFN2111-7 (SOT1358-1)
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
9. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PUSB3FR6 v.1
20150225
Product data sheet
-
-
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
9 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PUSB3FR6
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PUSB3FR6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
11 of 12
PUSB3FR6
NXP Semiconductors
ESD protection for ultra high-speed interfaces
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 February 2015
Document identifier: PUSB3FR6