Data Sheet

IP4358CX6
Quad channel low capacitance high performance ESD
protection
Rev. 1 — 18 October 2010
Product data sheet
1. Product profile
1.1 General description
The IP4358CX6 is a quad channel low capacitance ElectroStatic Discharge (ESD)
protection device, providing protection to downstream components from ESD voltages as
high as ±15 kV contact discharge and > ±15 kV air discharge according the
IEC 61000-4-2 model, far exceeding standard level 4.
The device is optimized for protection of high speed interfaces such as Universal Serial
Bus (USB) 2.0, High Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI)
and other interfaces requiring very low capacitance ESD protection.
All four ESD protection channels share common ground connections but are electrically
separated, preventing current back drive into the adjacent channel. The IP4358CX6 is
fabricated using monolithic silicon technology in a single Wafer-Level Chip-Scale Package
(WLCSP). These features make the IP4358CX6 ideal for use in applications requiring
component miniaturization such as mobile phone handsets and other portable electronic
devices.
1.2 Features and benefits
„
„
„
„
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
4 ultra-low input capacity rail-to-rail ESD protection diodes with C(I/O-GND) = 1.3 pF
Rdyn = 0.45 Ω
Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air
discharge, far exceeding IEC 61000-4-2 level 4
„ 2 × 3 solder ball WLCSP with 0.4 mm pitch
1.3 Applications
„ High-speed interface ESD protection such as USB 2.0, HDMI, DVI etc.
„ Interfaces with special requirements on low capacitive ESD protection
„ Interfaces requiring separation of the positive clamping voltage/current path
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
2. Pinning information
Table 1.
Pinning
Pin
Description
A1 and A2
ESD protection
B1 and B2
ground
C1 and C2
ESD protection
Simplified outline
Graphic symbol
bump A1
index area
1
2
A1
C1
A2
C2
A
B1
B
B2
008aaa250
C
008aaa249
transparent top view,
solder balls facing down
3. Ordering information
Table 2.
Ordering information
Type number
IP4358CX6
IP4358CX6
Product data sheet
Package
Name
Description
Version
WLCSP6
wafer level chip-size package; 6 bumps (2 × 3)
IP4358CX6
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Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
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IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min Max
Unit
VI
input voltage
pins A1, A2, C1 and C2 to ground
(B1, B2)
−0.5 +5.5
V
VESD
electrostatic discharge
voltage
pins A1, A2, C1 and C2 to ground
(B1, B2)
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−20
+20
kV
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
−55
+150 °C
Treflow(peak) peak reflow temperature 10 s maximum
-
260
°C
Tamb
−35
+85
°C
IEC 61000-4-2 level 4; pins A1,
A2, C1 and C2 to ground (B1, B2)
Tstg
[1]
storage temperature
ambient temperature
Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
5. Characteristics
Table 4.
Electrical characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
C(I/O-GND)
input/output to ground
capacitance
pins A1, A2, C1 and C2 to
ground (B1, B2); VI = 3.3 V;
f = 1 MHz
Min
Typ Max
Unit
-
1.3
1.5
pF
ILR
reverse leakage current pins A1, A2, C1 and C2 to
ground (B1, B2); VI = 3.3 V
-
-
100
nA
VBRzd
Zener diode breakdown Itest = 1 mA
voltage
6
-
9
V
VF
forward voltage
-
0.7
-
V
Rdyn
dynamic resistance
positive discharge
-
0.45 -
Ω
negative discharge
-
0.45 -
Ω
[1]
IP4358CX6
Product data sheet
[1]
Itest = 1 A; IEC 61000-4-5
Guaranteed by design.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
3 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
6. Application information
6.1 Insertion loss
The IP4358CX6 is designed as an ESD protection device for high speed interfaces such
as USB 2.0, DVI and HDMI high speed data lines etc. The insertion loss measurement
configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the
IP4358CX6 is shown in Figure 1.
The insertion loss of IP4358CX6 is shown in Figure 2.
IN
OUT
DUT
50 Ω
50 Ω
TEST BOARD
Vgen
001aai755
Fig 1.
Frequency response measurement configuration
001aam469
5
s21
(dB)
0
−5
−10
−15
−20
−25
−30
10−1
1
10
102
103
104
f (MHz)
Pin A1 to ground.
Fig 2.
IP4358CX6
Product data sheet
Measured insertion loss magnitude
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Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
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IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
6.2 Crosstalk
The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of
the IP4358CX6 is shown in Figure 3.
The crosstalk measurement results of IP4358CX6 are shown in Figure 4.
IN_1
50 Ω
OUT_2
DUT
IN_2
50 Ω
OUT_1
TEST BOARD
50 Ω
50 Ω
Vgen
001aai756
Fig 3.
Crosstalk measurement configuration
001aam470
20
αct
(dB)
−20
(1)
(2)
(3)
(4)
−60
−100
10−1
1
10
102
103
104
f (MHz)
(1) Pin A1 to pin A2.
(2) Pin A1 to pin C2.
(3) Pin C1 to pin A2.
(4) Pin C1 to pin C2.
Fig 4.
IP4358CX6
Product data sheet
Measured crosstalk between different channels
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
5 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
7. Package outline
WLCSP6: wafer level chip-size package; 6 bumps (2 x 3)
D
bump A1
index area
A2
E
A
A1
detail X
e
b
C
e
e1
B
A
1
2
European
projection
X
wlcsp6_2x3_po
Fig 5.
Table 5.
Package outline IP4358CX6 (WLCSP6)
Dimensions of IP4358CX6 for Figure 5
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
1.11
1.16
1.21
mm
e
-
0.4
-
mm
e1
-
0.8
-
mm
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
6 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
8. Design and assembly recommendations
8.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to Table 6 for the recommended PCB design parameters.
Table 6.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
250 μm
Micro-via diameter
100 μm (0.004 inch)
Solder mask aperture diameter
325 μm
Copper thickness
20 μm to 40 μm
Copper finish
AuNi or OSP
PCB material
FR4
8.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
290 μm
Solder screen thickness
100 μm (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
Solder to flux ratio
50 : 50
Solder reflow profile
see Figure 6
T
(°C)
Treflow(peak)
250
230
cooling rate
217
preheat
t1
t2
t3
t4
t (s)
t5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6.
IP4358CX6
Product data sheet
Pb-free solder reflow profile
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
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IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
Table 8.
Characteristics
Symbol
Parameter
Conditions
Treflow(peak)
peak reflow temperature
t1
time 1
t2
time 2
t3
Min Typ Max Unit
230 -
260
°C
soak time
60
-
180
s
time during T ≥ 250 °C
-
-
30
s
time 3
time during T ≥ 230 °C
10
-
50
s
t4
time 4
time during T > 217 °C
30
-
150
s
t5
time 5
dT/dt
rate of change of temperature
-
-
540
s
cooling rate
-
-
−6
°C/s
preheat
2.5
-
4.0
°C/s
9. Abbreviations
Table 9.
Abbreviations
Acronym
Description
DUT
Device Under Test
DVI
Digital Visual Interface
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
HDMI
High Definition Multimedia Interface
NSMD
Non-Solder Mask Defined
NWA
NetWork Analyzer
OSP
Organic Solderability Preservative
PCB
Printed-Circuit Board
RoHS
Restriction of Hazardous Substances
USB
Universal Serial Bus
WLCSP
Wafer-Level Chip-Scale Package
10. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4358CX6 v.1
20101018
Product data sheet
-
-
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
8 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
9 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
© NXP B.V. 2010. All rights reserved.
10 of 11
IP4358CX6
NXP Semiconductors
Quad channel low capacitance ESD protection
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
6.2
7
8
8.1
8.2
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Design and assembly recommendations . . . . 7
PCB design guidelines . . . . . . . . . . . . . . . . . . . 7
PCB assembly guidelines for Pb-free soldering 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 October 2010
Document identifier: IP4358CX6