MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE B SCALE 1:1 B E2 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. CHAMFER OPTIONAL 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.005 PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AT DATUM H. 5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN DIMENSIONS E, L1, D1 AND E1. 6. OPTIONAL MOLD FEATURE A A E DATE 08 OCT 2013 L1 c2 NOTE 3 A D1 L1 D H DETAIL C E1 0.10 L2 e 2X TOP VIEW b 0.10 B A B SEATING PLANE M A c NOTE 6 M VIEW A−A SIDE VIEW M B A M H GAUGE PLANE L3 A1 L M DETAIL C DIM A A1 b c c2 D D1 E E1 e H L L1 L2 L3 M INCHES MIN MAX 0.160 0.190 0.000 0.010 0.020 0.039 0.012 0.029 0.045 0.065 0.330 0.380 0.260 −−−− 0.380 0.420 0.245 −−−− 0.100 BSC 0.575 0.625 0.070 0.110 −−−− 0.066 −−−− 0.070 0.010 BSC 0° 8° MILLIMETERS MIN MAX 4.06 4.83 0.00 0.25 0.51 0.99 0.30 0.74 1.14 1.65 8.38 9.65 6.60 −−−− 9.65 10.67 6.22 −−−− 2.54 BSC 14.60 15.88 1.78 2.79 −−−− 1.68 −−−− 1.78 0.25 BSC 0° 8° GENERIC MARKING DIAGRAMS* VIEW A−A OPTIONAL CONSTRUCTIONS RECOMMENDED SOLDERING FOOTPRINT* 0.436 XX XXXXXXXXX AWLYWWG XXXXXXXXG AYWW AYWW XXXXXXXXG AKA XXXXXX XXYMW IC Standard Rectifier SSG 0.366 0.653 2X 0.169 2X 0.063 0.100 PITCH DIMENSIONS: INCHES *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON56370E ON SEMICONDUCTOR STANDARD http://onsemi.com D2PAK−3 (TO−263, 3−LEAD) 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 XXXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week W = Week Code (SSG) M = Month Code (SSG) G = Pb−Free Package AKA = Polarity Indicator *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON56370E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE. 04 APR 2011 A CORRECTED PITCH ON SOLDER FOOTPRINT TO BE FROM CENTER LINE TO LEAD. REQ. BY D. TRUHITTE. 25 JUL 2011 B ADDED GENERIC MARKING DIAGRAM FOR SSG. REQ. BY I. CAMBALIZA. 08 OCT 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. B Case Outline Number: 418AJ