Data Sheet

GTL2014
4-bit LVTTL to GTL transceiver
Rev. 3 — 14 June 2012
Product data sheet
1. General description
The GTL2014 is a 4-bit translating transceiver designed for 3.3 V LVTTL system interface
with a GTL−/GTL/GTL+ bus, where GTL−/GTL/GTL+ refers to the reference voltage of the
GTL bus and the input/output voltage thresholds associated with it.
The direction pin allows the part to function as either a GTL to LVTTL sampling receiver or
as a LVTTL to GTL interface.
The GTL2014 LVTTL inputs (only) are tolerant up to 5.5 V allowing direct access to TTL or
5 V CMOS inputs. The LVTTL outputs are not 5.5 V tolerant.
The GTL2014 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used
in higher voltage open-drain output applications.
GTL2014 is pin-to-pin backward compatible to the GTL2005 (labels for A port and B port
are interchanged). GTL2014’s Vref tracks down to 0.5 V for low voltage CPU, propagation
delays are slightly longer, while GTL2005’s Vref linearity degrades below 0.8 V and has
shorter propagation delay.
fast tPD
GTL2005
GTL2014
slow tPD
GTL−
GTL
GTL+
002aab378
Fig 1.
GTL2005/GTL2014 positioning
2. Features and benefits
 Operates as a 4-bit GTL−/GTL/GTL+ sampling receiver or as a LVTTL to
GTL−/GTL/GTL+ driver
 3.0 V to 3.6 V operation with 5 V tolerant LVTTL input
 GTL input and output 3.6 V tolerant
 Vref adjustable from 0.5 V to VCC/2
 Partial power-down permitted
 ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-CC101
GTL2014
NXP Semiconductors
4-bit LVTTL to GTL transceiver
 Latch-up protection exceeds 500 mA per JESD78
 Package offered: TSSOP14
3. Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPLH
LOW to HIGH propagation delay
An-to-Bn; CL = 50 pF; VCC = 3.3 V
-
2.8
-
ns
tPHL
HIGH to LOW propagation delay
An-to-Bn; CL = 50 pF; VCC = 3.3 V
-
3.4
-
ns
tPLH
LOW to HIGH propagation delay
Bn-to-An; CL = 50 pF; VCC = 3.3 V
-
5.2
-
ns
tPHL
HIGH to LOW propagation delay
Bn-to-An; CL = 50 pF; VCC = 3.3 V
-
4.9
-
ns
Ci
input capacitance
control inputs; VI = 3.0 V or 0 V
-
2
2.5
pF
Cio
input/output capacitance
A port; VO = 3.0 V or 0 V
-
4.6
6
pF
B port; VO = VTT or 0 V
-
3.4
4.3
pF
4. Ordering information
Table 2.
Ordering information
Type number
GTL2014PW
Package
Name
Description
Version
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
Standard packing quantities and other packaging data are available at
www.nxp.com/packages/.
4.1 Ordering options
Table 3.
GTL2014
Product data sheet
Ordering options
Type number
Topside mark
Temperature range
GTL2014PW
GTL2014
Tamb = −40 °C to +85 °C
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Rev. 3 — 14 June 2012
© NXP B.V. 2012. All rights reserved.
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NXP Semiconductors
4-bit LVTTL to GTL transceiver
5. Functional diagram
GTL2014
B0
A0
B1
A1
B2
A2
B3
A3
002aab139
VREF
Fig 2.
GTL2014
Product data sheet
DIR
Logic diagram for GTL2014
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4-bit LVTTL to GTL transceiver
6. Pinning information
6.1 Pinning
DIR
1
14 VCC
B0
2
13 A0
B1
3
VREF
4
B2
5
10 A2
B3
6
9
A3
GND
7
8
GND
12 A1
GTL2014PW
11 GND
002aab138
Fig 3.
Pin configuration for TSSOP14
6.2 Pin description
Table 4.
GTL2014
Product data sheet
Pin description
Symbol
Pin
Description
DIR
1
direction control input (LVTTL)
B0
2
data inputs/outputs (GTL)
B1
3
B2
5
B3
6
A0
13
A1
12
A2
10
A3
9
VREF
4
GTL reference voltage
GND
7, 8, 11
ground (0 V)
VCC
14
positive supply voltage
data inputs/outputs (LVTTL)
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NXP Semiconductors
4-bit LVTTL to GTL transceiver
7. Functional description
Refer to Figure 2 “Logic diagram for GTL2014”.
7.1 Function table
Table 5.
Function table
H = HIGH voltage level; L = LOW voltage level.
Input
Input/output
DIR
A (LVTTL)
B (GTL)
H
input
Bn = An
L
An = Bn
input
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
input voltage
VI
Conditions
Min
Max
Unit
−0.5
+4.6
V
VI < 0 V
-
−50
mA
A port
−0.5[2]
+7.0
V
B port
−0.5[2]
+4.6
V
-
−50
mA
A port
−0.5[2]
+7.0
V
B port
−0.5[2]
+4.6
V
A port
-
32
mA
B port
-
80
mA
-
−32
mA
−60
+150
°C
IOK
output clamping current
A port; VO < 0 V
VO
output voltage
output in OFF or HIGH state
LOW-level output current
IOL
IOH
HIGH-level output current
Tstg
storage temperature
[1]
current into any output in the LOW state
current into any output in the HIGH state;
A port
[3]
Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under Section 9 “Recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
[2]
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[3]
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
GTL2014
Product data sheet
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© NXP B.V. 2012. All rights reserved.
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NXP Semiconductors
4-bit LVTTL to GTL transceiver
9. Recommended operating conditions
Table 7.
Operating conditions [1]
Symbol
Parameter
VCC
supply voltage
termination
VTT
Conditions
voltage[2]
reference voltage
Vref
input voltage
VI
GTL−
HIGH-level input voltage
LOW-level input voltage
VIL
Typ
Max
Unit
3.0
-
3.6
V
0.85
0.9
0.95
V
GTL
1.14
1.2
1.26
V
GTL+
1.35
1.5
1.65
V
overall
0.5
2⁄ V
3 TT
VCC/2
V
GTL−
0.5
0.6
0.63
V
GTL
0.76
0.8
0.84
V
GTL+
0.87
1.0
1.10
V
B port
0
VTT
3.6
V
0
3.3
5.5[3]
V
except B port
VIH
Min
B port
Vref + 0.050
-
-
V
except B port
2
-
-
V
B port
-
-
Vref − 0.050
V
except B port
-
-
0.8
V
IOH
HIGH-level output current
A port
-
-
−16
mA
IOL
LOW-level output current
B port
-
-
40
mA
A port
-
-
16
mA
operating in free-air
−40
-
+85
°C
Tamb
ambient temperature
[1]
Unused inputs must be held HIGH or LOW to prevent them from floating.
[2]
VTT maximum of 3.6 V with resistor sized so IOL maximum is not exceeded.
[3]
A0, A1, A2, A3 VI(max) is 3.6 V if configured as outputs (DIR = L).
GTL2014
Product data sheet
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4-bit LVTTL to GTL transceiver
10. Static characteristics
Table 8.
Static characteristics
Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = −40 °C to +85 °C
Symbol
VOH
VOL
Typ[1]
Max
Unit
A port; VCC = 3.0 V to 3.6 V; IOH = −100 μA
[2]
VCC − 0.2
-
-
V
A port; VCC = 3.0 V; IOH = −16 mA
[2]
2.0
-
-
V
B port; VCC = 3.0 V; IOL = 40 mA
[2]
-
0.23
0.4
V
A port; VCC = 3.0 V; IOL = 8 mA
[2]
-
0.28
0.4
V
A port; VCC = 3.0 V; IOL = 12 mA
[2]
-
0.40
0.55
V
A port; VCC = 3.0 V; IOL = 16 mA
[2]
Conditions
HIGH-level output
voltage
LOW-level output
voltage
input current
II
Min
Parameter
-
0.55
0.8
V
control inputs; VCC = 3.6 V;
VI = VCC or GND
-
-
±1
μA
B port; VCC = 3.6 V; VI = VTT or GND
-
-
±1
μA
A port; VCC = 0 V or 3.6 V; VI = 5.5 V
-
-
10
μA
A port; VCC = 3.6 V; VI = VCC
-
-
±1
μA
A port; VCC = 3.6 V; VI = 0 V
-
-
−5
μA
IOZ
OFF-state output
current
A port; VCC = 0 V; VI or VO = 0 V to 3.6 V
-
-
±100
μA
ICC
quiescent supply
current
A port; VCC = 3.6 V; VI = VCC or GND;
IO = 0 mA
-
4
10
mA
B port; VCC = 3.6 V; VI = VTT or GND;
IO = 0 mA
-
4
10
mA
ΔICC[3]
additional quiescent
current (per input)
A port or control inputs; VCC = 3.6 V;
VI = VCC − 0.6 V
-
-
500
μA
Ci
input capacitance
control inputs; VI = 3.0 V or 0 V
-
2
2.5
pF
Cio
input/output
capacitance
A port; VO = 3.0 V or 0 V
-
4.6
6
pF
B port; VO = VTT or 0 V
-
3.4
4.3
pF
[1]
All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[3]
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
GTL2014
Product data sheet
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© NXP B.V. 2012. All rights reserved.
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4-bit LVTTL to GTL transceiver
002aab144
1200
Vth+
and
Vth−
(mV)
1000
Vth+
Vth−
Vref
800
002aab145
1200
Vth+
and
Vth−
(mV)
1000
Vth+
Vth−
Vref
800
600
600
400
0.5
0.6
0.7
0.8
0.9
400
0.5
1.0
Vref (V)
a. VCC = 3.0 V; Tamb = −40 °C
0.6
0.7
0.8
0.9
1.0
Vref (V)
b. VCC = 3.3 V; Tamb = 25 °C
002aab146
1200
Vth+
and
Vth−
(mV)
1000
Vth+
Vth−
Vref
800
600
400
0.5
0.6
0.7
0.8
0.9
1.0
Vref (V)
c. VCC = 3.6 V; Tamb = 85 °C
Vref is equal to the reference voltage on the GTL bus.
Vth+ is the GTL input high threshold, which is typically equal to Vref + 50 mV.
Vth− is the GTL input low threshold, which is typically equal to Vref − 50 mV.
Fig 4.
GTL Vth+ and Vth− versus Vref
GTL2014
Product data sheet
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4-bit LVTTL to GTL transceiver
11. Dynamic characteristics
Table 9.
Dynamic characteristics
VCC = 3.3 V ± 0.3 V
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
GTL−; Vref = 0.6 V; VTT = 0.9 V
tPLH
LOW to HIGH propagation delay
An to Bn; see Figure 5
-
2.8
5
ns
tPHL
HIGH to LOW propagation delay
An to Bn; see Figure 5
-
3.3
7
ns
tPLH
LOW to HIGH propagation delay
Bn to An; see Figure 6
-
5.3
8
ns
tPHL
HIGH to LOW propagation delay
Bn to An; see Figure 6
-
5.2
8
ns
An to Bn; see Figure 5
-
2.8
5
ns
GTL; Vref = 0.8 V; VTT = 1.2 V
tPLH
LOW to HIGH propagation delay
tPHL
HIGH to LOW propagation delay
An to Bn; see Figure 5
-
3.4
7
ns
tPLH
LOW to HIGH propagation delay
Bn to An; see Figure 6
-
5.2
8
ns
tPHL
HIGH to LOW propagation delay
Bn to An; see Figure 6
-
4.9
7
ns
An to Bn; see Figure 5
-
2.8
5
ns
GTL+; Vref = 1.0 V; VTT = 1.5 V
tPLH
LOW to HIGH propagation delay
tPHL
HIGH to LOW propagation delay
An to Bn; see Figure 5
-
3.4
7
ns
tPLH
LOW to HIGH propagation delay
Bn to An; see Figure 6
-
5.1
8
ns
tPHL
HIGH to LOW propagation delay
Bn to An; see Figure 6
-
4.7
7
ns
[1]
All typical values are at VCC = 3.3 V and Tamb = 25 °C.
GTL2014
Product data sheet
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11.1 Waveforms
VM = 1.5 V at VCC ≥ 3.0 V; VM = VCC/2 at VCC ≤ 2.7 V for A ports and control pins;
VM = Vref for B ports.
3.0 V
input
1.5 V
1.5 V
0V
tPLH
tp
tPHL
VOH
3.0 V
VM
output
VM
Vref
Vref
VOL
0V
002aab141
002aab140
VM = 1.5 V for A port and Vref for B port
B port to A port
a. Pulse duration
Fig 5.
b. Propagation delay times
Voltage waveforms
VTT
input
Vref
Vref
1/ V
3 TT
tPLH
tPHL
VOH
output
1.5 V
1.5 V
VOL
002aab142
PRR ≤ 10 MHz; Z0 = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns
Fig 6.
GTL2014
Product data sheet
Propagation delay, Bn to An
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12. Test information
VCC
PULSE
GENERATOR
VI
VO
DUT
RL
500 Ω
CL
50 pF
RT
002aab006
Fig 7.
Load circuitry for switching times
VTT
VCC
PULSE
GENERATOR
25 Ω
VO
VI
DUT
CL
30 pF
RT
002aab143
Fig 8.
Load circuit for B outputs
RL — Load resistor
CL — Load capacitance; includes jig and probe capacitance
RT — Termination resistance; should be equal to output impedance of pulse generators.
GTL2014
Product data sheet
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4-bit LVTTL to GTL transceiver
13. Package outline
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
Fig 9.
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Package outline SOT402-1 (TSSOP14)
GTL2014
Product data sheet
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4-bit LVTTL to GTL transceiver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
GTL2014
Product data sheet
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14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
GTL2014
Product data sheet
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4-bit LVTTL to GTL transceiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 12.
GTL2014
Product data sheet
Abbreviations
Acronym
Description
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
ESD
ElectroStatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
LVTTL
Low Voltage Transistor-Transistor Logic
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
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16. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
GTL2014 v.3
20120614
Product data sheet
-
GTL2014 v.2
Modifications:
•
Section 1 “General description”, first paragraph, first sentence: added phrase “where
GTL−/GTL/GTL+ refers to the reference voltage of the GTL bus and the input/output voltage
thresholds associated with it”
•
Added (new) Figure 4 “GTL Vth+ and Vth- versus Vref”
GTL2014 v.2
20120306
Product data sheet
-
GTL2014 v.1
GTL2014 v.1
(9397 750 13534)
20050519
Product data sheet
-
-
GTL2014
Product data sheet
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Rev. 3 — 14 June 2012
© NXP B.V. 2012. All rights reserved.
16 of 19
GTL2014
NXP Semiconductors
4-bit LVTTL to GTL transceiver
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
GTL2014
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 June 2012
© NXP B.V. 2012. All rights reserved.
17 of 19
GTL2014
NXP Semiconductors
4-bit LVTTL to GTL transceiver
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
GTL2014
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 June 2012
© NXP B.V. 2012. All rights reserved.
18 of 19
GTL2014
NXP Semiconductors
4-bit LVTTL to GTL transceiver
19. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
8
9
10
11
11.1
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering of SMD packages . . . . . . . . . . . . . . 13
Introduction to soldering . . . . . . . . . . . . . . . . . 13
Wave and reflow soldering . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 June 2012
Document identifier: GTL2014