L www.vishay.com Vishay Sfernice SMD Wraparound Ultra Low Value Thin Film Resistors FEATURES • NiCr + Ta2O5 resistive layer • Pre-soldered or gold terminations • No inductance for high frequency applications Available • Alumina substrates for high power handling capability Available • Resistance range: 0.1 to 9.99 • TCR down to 50 ppm/°C Available • Power rating: Up to 2 W at + 70 °C • Withstand AEC-Q200 humidity test With extremely low resistance and high power capabilities, these ultra low value resistors are available with solderable or weldable terminations. • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details. STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RESISTANCE RANGE RATED POWER P70 °C W LIMITING ELEMENT VOLTAGE V TOLERANCE ±% TEMPERATURE COEFFICIENT ± ppm/°C L0603 0603 0.1 to 9.99 0.125 50 1, 2, 3, 5, 10 50, 100, 200, 300 L0805 0805 0.1 to 9.99 0.2 50 1, 2, 3, 5, 10 50, 100, 200, 300 L1206 1206 0.1 to 9.99 0.33 50 1, 2, 3, 5, 10 50, 100, 200, 300 L1505 1505 0.1 to 9.99 0.5 50 1, 2, 3, 5, 10 50, 100, 200, 300 L2010 2010 0.1 to 9.99 1.0 50 1, 2, 3, 5, 10 50, 100, 200, 300 50 1, 2, 3, 5, 10 50, 100, 200, 300 L2512 2512 0.1 to 9.99 2.0 (1) Note (1) With special assembly care CLIMATIC SPECIFICATIONS TOLERANCE AND TCR VS. OHMIC VALUE Operating temperature range TIGHTEST BEST OHMIC VALUE TOLERANCE TCR RANGE in (%) (ppm/°C) - 55 °C; + 155 °C TERMINATIONS 0R1 < 0R25 1 300 N or B MECHANICAL SPECIFICATIONS 0R25 < 0R5 1 200 N or B Substrate Alumina 0R5 < 2R5 1 100 N or B NiCr + Ta2O5 2R5 < 9R99 1 50 N or B Silicone 0R1 < 0R25 5 300 G 0R25 < 0R5 5 200 G 0R < 1R 5 100 G 1R < 2R5 3 100 G 2R5 to 9R99 3 50 G Technology Coating Terminations Solderable B type: SnPb over nickel barrier N type: SnAg over nickel barrier G type: Gold over nickel barrier Note • Refer to Application Note “Guidelines for Vishay Sfernice Resistive and Inductive Components” (document number: 52029) for recommended reflow profile. Profile #3 applies. Revision: 04-Sep-14 Document Number: 53018 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 L www.vishay.com Vishay Sfernice DIMENSIONS in millimeters (inches) A B C D E A B C D/E ± 0.152 (± 0.006) ± 0.127 (± 0.005) ± 0.127 (+ 0.005) ± 0.127 (± 0.005) 0603 1.52 (0.060) 0.85 (0.033) 0805 1.91 (0.075) 1.27 (0.050) CASE SIZE 1206 3.06 (0.120) 1.60 (0.063) 1505 3.81 (0.150) 1.32 (0.052) 2010 5.08 (0.200) 2.54 (0.100) 2512 6.30 (0.248) 3.30 (0.129) 0.38 (0.015) 0.5 (0.020) 0.40 (0.016) 0.48 (0.019) SUGGESTED LAND PATTERN in millimeters (inches) (to IPC-7351A) Gmin. Xmax. Zmax. CASE SIZE Zmax. Gmin. Xmax. 0603 2.37 (0.093) 0.35 (0.014) 0.98 (0.039) 0805 2.76 (0.109) 0.74 (0.029) 1.40 (0.055) 1206 3.91 (0.154) 1.85 (0.073) 1.73 (0.068) 1505 4.66 (0.183) 2.44 (0.096) 1.45 (0.057) 2010 5.93 (0.233) 3.71 (0.146) 2.67 (0.105) 2512 7.15 (0.281) 4.93 (0.194) 3.43 (0.135) Option: Enlarged Terminations: 0063 For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat sinks (see application note: “Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA Arrays, CHP Thick Film)”: www.vishay.com/doc?53048). For enlarged terminations: Please consult Vishay Sfernice. Option: AEC-Q200 withstanding Please order option 0058. Revision: 04-Sep-14 Document Number: 53018 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 L www.vishay.com Vishay Sfernice Rated Power (%) POWER DERATING CURVE PACKAGING Several types of packaging are proposed: waffle-pack and tape and reel 100 NUMBER OF PIECES PER PACKAGE 80 SIZE MOQ 60 WAFFLE PACK 2" × 2" 0603 40 0 1206 1505 0 20 40 60 70 80 100 120 140 155 Ambient Temperature in °C MIN. 140 100 TAPE WIDTH MAX. 5000 100 0805 20 TAPE AND REEL 100 4000 8 mm 60 2010 2512 2000 50 PACKAGING RULES Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get “not stacked up” waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult Vishay/Sfernice for specific ordering code. Tape and Reel Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered is between the MOQ and the maximum reel capacity, only one reel is provided. When several reels are needed for ordered quantity within MOQ and maximum reel capacity: Please consult Vishay Sfernice for specific ordering code. PERFORMANCE VALUES AND DRIFT TESTS Thermal shock Short time overload Low temperature operation Resistance to solder heat Moisture resistance High temperature Load life Revision: 04-Sep-14 CONDITIONS MIL-R-55342 REQUIREMENTS TYPICAL PERFORMANCES MIL-R-55342 C MIL-STD-702, method 107 ± 0.25 % ± 0.02 % MIL-R-55342 C PARA 3.10.4.7.5 ± 0.10 % ± 0.01 % MIL-R-55342 C PARA 3.9 and 4.7.4 ± 0.25 % ± 0.01 % MIL-R-55342 C PARA 3.12, 4.7.7, 4.7.1.2 ± 0.25 % ± 0.04 % MIL-R-55342 C PARA 3.13 and 4.7.8 MIL-STD-202, method 106 ± 0.40 % ± 0.01 % AEC-Q200 85 °C/85 % RH/0.1 Pn 1000 h - Max. < 0.5 % + 0.05 MIL-R-55342 C PARA 3.11 and 4.7.6 ± 0.20 % ± 0.075 % MIL-R-55342 C 2000 h Pn at 70 °C MIL-STD-202, method 108 ± 0.50 % ± 0.15 % Document Number: 53018 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 L www.vishay.com Vishay Sfernice GLOBAL PART NUMBER INFORMATION New Global Part Numbering: L0805K1R00FBT0099 L 0 GLOBAL MODEL L 8 0 5 K 1 R 0 0 F B T 0 0 9 9 SIZE TCR VALUE TOLERANCE TERMINATION PACKAGING OPTION 0603 0805 1206 1505 2010 2512 H = ± 50 ppm K = ± 100 ppm L = ± 200 ppm M = ± 300 ppm R designated decimal point For values under 1R if 3 significant digits: Rxxx if 2 significant digits: xRxx F=±1% G=±2% H=±3% J=±5% K = ± 10 % B: SnPb over nickel barrier N: SnAg over nickel barrier G: Gold over nickel barrier For more information see Codification of Packaging table Leave blank if no option B: Lead bearing version N and G: Lead (Pb)-free/ RoHS version Historical Part Number example: L 0805 K 1R00 1 % B T R0099 L 0805 K 1R00 1% B T R0099 MODEL SIZE TCR VALUE TOLERANCE TERMINATION PACKAGING OPTION CODIFICATION OF PACKAGING CODE 18 PACKAGING WAFFLE PACK W 100 min., 1 mult WA 100 min., 100 mult (available only in size 1206) PLASTIC TAPE (Standard for all sizes.) T 100 min., 1 mult TA 100 min., 100 mult TB 250 min., 250 mult TC 500 min., 500 mult TD 1000 min., 1000 mult TE 2500min., 2500 mult TF Full tape (quantity depending on size of chips) PAPER TAPE (Available for 0603, 0805, and 1206. Please consult Vishay Sfernice for other sizes.) PT 100 min., 1 mult PA 100 min., 100 mult PB 250 min., 250 mult PC 500 min., 500 mult PD 1000 min., 1000 mult PE 2500min., 2500 mult PF Full tape (quantity depending on size of chips) Revision: 04-Sep-14 Document Number: 53018 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000