L Datasheet

L
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Vishay Sfernice
SMD Wraparound Ultra Low Value Thin Film Resistors
FEATURES
• NiCr + Ta2O5 resistive layer
• Pre-soldered or gold terminations
• No inductance for high frequency applications
Available
• Alumina substrates for high power handling
capability
Available
• Resistance range: 0.1  to 9.99 
• TCR down to 50 ppm/°C
Available
• Power rating: Up to 2 W at + 70 °C
• Withstand AEC-Q200 humidity test
With extremely low resistance and high power capabilities,
these ultra low value resistors are available with solderable
or weldable terminations.
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are
RoHS-compliant and/or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information/tables in this datasheet for details.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE RANGE

RATED POWER
P70 °C
W
LIMITING ELEMENT
VOLTAGE
V
TOLERANCE
±%
TEMPERATURE
COEFFICIENT
± ppm/°C
L0603
0603
0.1 to 9.99
0.125
50
1, 2, 3, 5, 10
50, 100, 200, 300
L0805
0805
0.1 to 9.99
0.2
50
1, 2, 3, 5, 10
50, 100, 200, 300
L1206
1206
0.1 to 9.99
0.33
50
1, 2, 3, 5, 10
50, 100, 200, 300
L1505
1505
0.1 to 9.99
0.5
50
1, 2, 3, 5, 10
50, 100, 200, 300
L2010
2010
0.1 to 9.99
1.0
50
1, 2, 3, 5, 10
50, 100, 200, 300
50
1, 2, 3, 5, 10
50, 100, 200, 300
L2512
2512
0.1 to 9.99
2.0
(1)
Note
(1) With special assembly care
CLIMATIC SPECIFICATIONS
TOLERANCE AND TCR VS. OHMIC VALUE
Operating temperature
range
TIGHTEST
BEST
OHMIC VALUE
TOLERANCE
TCR
RANGE in 
(%)
(ppm/°C)
- 55 °C; + 155 °C
TERMINATIONS
0R1 < 0R25
1
300
N or B
MECHANICAL SPECIFICATIONS
0R25 < 0R5
1
200
N or B
Substrate
Alumina
0R5 < 2R5
1
100
N or B
NiCr + Ta2O5
2R5 < 9R99
1
50
N or B
Silicone
0R1 < 0R25
5
300
G
0R25 < 0R5
5
200
G
0R < 1R
5
100
G
1R < 2R5
3
100
G
2R5 to 9R99
3
50
G
Technology
Coating
Terminations
Solderable
B type: SnPb over nickel barrier
N type: SnAg over nickel barrier
G type: Gold over nickel barrier
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
Resistive and Inductive Components” (document number:
52029) for recommended reflow profile. Profile #3 applies.
Revision: 04-Sep-14
Document Number: 53018
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay Sfernice
DIMENSIONS in millimeters (inches)
A
B
C
D
E
A
B
C
D/E
± 0.152 (± 0.006)
± 0.127 (± 0.005)
± 0.127 (+ 0.005)
± 0.127 (± 0.005)
0603
1.52 (0.060)
0.85 (0.033)
0805
1.91 (0.075)
1.27 (0.050)
CASE SIZE
1206
3.06 (0.120)
1.60 (0.063)
1505
3.81 (0.150)
1.32 (0.052)
2010
5.08 (0.200)
2.54 (0.100)
2512
6.30 (0.248)
3.30 (0.129)
0.38 (0.015)
0.5 (0.020)
0.40 (0.016)
0.48 (0.019)
SUGGESTED LAND PATTERN in millimeters (inches) (to IPC-7351A)
Gmin.
Xmax.
Zmax.
CASE SIZE
Zmax.
Gmin.
Xmax.
0603
2.37 (0.093)
0.35 (0.014)
0.98 (0.039)
0805
2.76 (0.109)
0.74 (0.029)
1.40 (0.055)
1206
3.91 (0.154)
1.85 (0.073)
1.73 (0.068)
1505
4.66 (0.183)
2.44 (0.096)
1.45 (0.057)
2010
5.93 (0.233)
3.71 (0.146)
2.67 (0.105)
2512
7.15 (0.281)
4.93 (0.194)
3.43 (0.135)

Option: Enlarged Terminations: 0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: “Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film)”: www.vishay.com/doc?53048).
For enlarged terminations: Please consult Vishay Sfernice.
Option: AEC-Q200 withstanding
Please order option 0058.
Revision: 04-Sep-14
Document Number: 53018
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
L
www.vishay.com
Vishay Sfernice
Rated Power (%)
POWER DERATING CURVE
PACKAGING
Several types of packaging are proposed: waffle-pack and
tape and reel
100
NUMBER OF PIECES
PER PACKAGE
80
SIZE
MOQ
60
WAFFLE PACK
2" × 2"
0603
40
0
1206
1505
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
MIN.
140
100
TAPE
WIDTH
MAX.
5000
100
0805
20
TAPE AND REEL
100
4000
8 mm
60
2010
2512
2000
50
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay/Sfernice for specific ordering
code.
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code.
PERFORMANCE
VALUES AND DRIFT
TESTS
Thermal shock
Short time overload
Low temperature operation
Resistance to solder heat
Moisture resistance
High temperature
Load life
Revision: 04-Sep-14
CONDITIONS
MIL-R-55342
REQUIREMENTS
TYPICAL
PERFORMANCES
MIL-R-55342 C
MIL-STD-702, method 107
± 0.25 %
± 0.02 %
MIL-R-55342 C
PARA 3.10.4.7.5
± 0.10 %
± 0.01 %
MIL-R-55342 C
PARA 3.9 and 4.7.4
± 0.25 %
± 0.01 %
MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2
± 0.25 %
± 0.04 %
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202, method 106
± 0.40 %
± 0.01 %
AEC-Q200
85 °C/85 % RH/0.1 Pn
1000 h
-
Max. < 0.5 % + 0.05 
MIL-R-55342 C
PARA 3.11 and 4.7.6
± 0.20 %
± 0.075 %
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202, method 108
± 0.50 %
± 0.15 %
Document Number: 53018
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
L
www.vishay.com
Vishay Sfernice
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: L0805K1R00FBT0099
L
0
GLOBAL
MODEL
L
8
0
5
K
1
R
0
0
F
B
T
0
0
9
9
SIZE
TCR
VALUE
TOLERANCE
TERMINATION
PACKAGING
OPTION
0603
0805
1206
1505
2010
2512
H = ± 50 ppm
K = ± 100 ppm
L = ± 200 ppm
M = ± 300 ppm
R designated
decimal point
For values under 1R
if 3 significant digits:
Rxxx
if 2 significant digits:
xRxx
F=±1%
G=±2%
H=±3%
J=±5%
K = ± 10 %
B: SnPb over
nickel barrier
N: SnAg over
nickel barrier
G: Gold over
nickel barrier
For more
information see
Codification of
Packaging
table
Leave
blank if
no
option
B: Lead bearing version
N and G: Lead (Pb)-free/
RoHS version
Historical Part Number example: L 0805 K 1R00 1 % B T R0099
L
0805
K
1R00
1%
B
T
R0099
MODEL
SIZE
TCR
VALUE
TOLERANCE
TERMINATION
PACKAGING
OPTION
CODIFICATION OF PACKAGING
CODE 18
PACKAGING
WAFFLE PACK
W
100 min., 1 mult
WA
100 min., 100 mult (available only in size 1206)
PLASTIC TAPE (Standard for all sizes.)
T
100 min., 1 mult
TA
100 min., 100 mult
TB
250 min., 250 mult
TC
500 min., 500 mult
TD
1000 min., 1000 mult
TE
2500min., 2500 mult
TF
Full tape (quantity depending on size of chips)
PAPER TAPE (Available for 0603, 0805, and 1206. Please consult Vishay Sfernice for other sizes.)
PT
100 min., 1 mult
PA
100 min., 100 mult
PB
250 min., 250 mult
PC
500 min., 500 mult
PD
1000 min., 1000 mult
PE
2500min., 2500 mult
PF
Full tape (quantity depending on size of chips)
Revision: 04-Sep-14
Document Number: 53018
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000