TNPS .... ESCC Datasheet

TNPS .... ESCC
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Vishay Draloric
Hi-Rel Thin Film Chip Resistors
FEATURES
• High-reliability product
• ESA approved to ESCC 4001/029
• Advanced thin film technology
• SnPb termination plating, minimum 6 % Pb
APPLICATIONS
• Aerospace
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment
where a mature technology and proven reliability are of
utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems.
• Avionics
• Military
METRIC SIZE
IMPERIAL
Approval of the TNPS .... ESCC products is granted by the
European Space Components Coordination and registered
in the ESCC Qualified Parts List, REP005.
METRIC
0603
0805
1206
RR1608M
RR2012M
RR3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
TNPS0603 .... ESCC
TNPS0805 .... ESCC
RR1608M
RR2012M
RR3216M
10.0 Ω to 221 kΩ
10.0 Ω to 422 kΩ
10.0 Ω to 1.00 MΩ
Resistance tolerance
TNPS1206 .... ESCC
± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K
Rated dissipation P70
0.1 W
0.125 W
0.25 W
Operating voltage, Umax. ACRMS or DC
75 V
150 V
200 V
Permissible film temperature, ϑF max.
125 °C
Operating temperature range
-55 °C to 125 °C
Max. resistance change at P70, |ΔR| max., after:
≤ (0.05 % R + 10 mΩ)
1000 h
≤ (0.1 % R + 20 mΩ)
2000 h
Permissible voltage against ambient (insulation)
100 V
Storage temperature range
200 V
300 V
-55 °C to +125 °C
Note
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION
TCR
± 50 ppm/K
± 25 ppm/K
± 15 ppm/K
RESISTANCE RANGE
TOLERANCE
TNPS0603 .... ESCC
TNPS0805 .... ESCC
±1%
10.0 Ω to 221 kΩ
10.0 Ω to 422 kΩ
TNPS1206 .... ESCC
10.0 Ω to 1.00 MΩ
± 0.5 %
10.0 Ω to 221 kΩ
10.0 Ω to 422 kΩ
10.0 Ω to 1.00 MΩ
± 0.1 %
10.0 Ω to 221 kΩ
10.0 Ω to 422 kΩ
10.0 Ω to 1.00 MΩ
± 0.1 %
10.0 Ω to 221 kΩ
10.0 Ω to 422 kΩ
10.0 Ω to 1.00 MΩ
Notes
• The indicated combinations of TCR, tolerance and resistance range are a subset of those combinations approved to ESCC 4001/029
• According to ESCC 4001/029, resistance values are to be selected from the E96 series only
Revision: 09-Sep-13
Document Number: 28789
1
For technical questions, contact: [email protected]
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PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: TNPS08057502DEBX00
T
N
P
S
0
8
0
5
7
5
0
2
D
E
B
TYPE AND SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
TNPS0603
TNPS0805
TNPS1206
3 digit value
1 digit multiplier
F=±1%
D = ± 0.5 %
B = ± 0.1 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
BX
LX
X
0
0
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
PRODUCT DESCRIPTION: TNPS0805 25 75K0 0.5 % BX ESCC 4001/029
TNPS0805
25
75K0
0.5 %
BX
ESCC 4001/029
TYPE AND SIZE
TCR
RESISTANCE
TOLERANCE
PACKAGING
SPECIFICATION
TNPS0603
TNPS0805
TNPS1206
± 50 ppm/K
± 25 ppm/K
± 15 ppm/K
33R2 = 33.2 Ω
75K0 = 75.0 kΩ
±1%
± 0.5 %
± 0.1 %
BX
LX
ESCC 4001/029
Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
ESCC 4001/022 COMPONENT NUMBER AND ELECTRICAL CHARACTERISTICS
Example of the component number and electrical characteristics for a resistor: TNPS0805 25 75K0 0.5 % ESCC 4001/029
400102902 7502D2
The elements used in the component number have the following meaning:
4001029
02
Detail specification number, ESCC 4001/029
Type variant, used for indentification of chip size:
01 ...... 0603
02 ...... 0805
03 ...... 1206
The elements used in the electrical characteristics number have the following meaning:
7502
D
2
Revision: 09-Sep-13
Resistance acc. IEC 60062, four-character code system
Tolerance on rated resistance acc. IEC 60062
Temperature coefficient of resistance:
3 ......... ± 50 ppm/K
2 ......... ± 25 ppm/K
1 ......... ± 15 ppm/K
Document Number: 28789
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PACKAGING
TYPE
CODE
TNPS0603
TNPS0805
TNPS1206
QUANTITY (1)
PACKAGING STYLE
WIDTH
PITCH
100 to 499
500 to 3000
Antistatic blister tape
acc. IEC 60286-3 (2)
type II
8 mm
2 mm
1 to 100
Matrix tray (3)
-
4.2 mm x 4.2 mm
BX
LX
PACK. DIMENSIONS
Box
Reel Ø 180 mm
55 mm x 51 mm x 11 mm
Notes
(1) Minimum order quantity is 100 pieces, except for samples for lot validation testing
(2) Leader is extended to 500 mm cover tape, including 200 mm carrier tape with empty compartments
(3) Matrix tray (waffle tray) packaging, code LX, is available only for samples for lot validation testing
DIMENSIONS
L
T2
W
H
T1
DIMENSIONS AND MASS
TYPE
L
(mm)
W
(mm)
T1, T2
(mm)
H
(mm)
MASS
(mg)
TNPS0603
1.60 ± 0.10
0.85 ± 0.10
0.45 ± 0.10
0.30 ± 0.20
≤2
TNPS0805
2.00 ± 0.15
1.25 ± 0.15
0.45 ± 0.10
0.40 ± 0.20
≤5
TNPS1206
3.20 ± 0.15
1.60 ± 0.15
0.55 ± 0.10
0.50 ± 0.25
≤ 10
Note
• Alphanumeric coding of the resistance value is applied, using the four-character code of IEC 60062 (1), where the character R is used instead
of the decimal point for values below 100 Ω.
PATTERN STYLES FOR CHIP RESISTORS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
REFLOW SOLDERING
TYPE
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
TNPS0603
0.55
1.05
1.10
2.65
0.90
0.70
0.95
2.30
TNPS0805
0.80
1.20
1.55
3.20
1.10
0.85
1.40
2.80
TNPS1206
1.40
1.50
1.90
4.40
1.80
1.15
1.75
4.10
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, however, they will be found adequate for most general
applications.
Revision: 09-Sep-13
Document Number: 28789
3
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DESCRIPTION
SCREENING TESTS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic substrate (Al2O3) and conditioned to achieve
the desired temperature coefficient. Specially designed
inner contacts are deposited on both sides. A special laser
is used to achieve the target value by smoothly fine trimming
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical, and climatic
protection. The terminations receive a final SnPb plating,
controlled for a minimum lead content of 6 %. The
resistance value is stamped on the coating with a
four-character code system according to IEC 60062 (1). The
result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual chip resistors. Only accepted products are placed
into a special matrix case packaging or into antistatic blister
tape in accordance with IEC 60286-3 (1).
These products are subjected to a screening test according
to the ruling of the generic specification ESCC 4001 and the
detail specification ESCC 4001/029.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow, or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters, and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. Solderability is specified for
2 years after production. The permitted storage time is
20 years.
APPROVALS
The resistors are approved to ESCC 4001/029. Conformity
is indicated by the ESCC Qualified Components logo on
the package label. Approval is granted by the European
Space Components Coordination and registered in the
ESCC Qualified Parts List, REP005.
The production is succeeded by production test sequences
for resistance, plating properties, solderability, and
dimensions. This sequence is followed by screening tests
for overload, non-linearity, temperature coefficient,
resistance at room temperature, and a visual inspection. A
Certificate of Conformity provides summary information by
reporting the numbers of rejects for each test or inspection.
LOT VALIDATION TESTS
Execution of Lot Validation Tests according to the ruling of
ESCC 4001 is available as a separate order item. This is to
be combined with the dedicated order line for the required
amount of samples, using packaging code “LX”.
The applicable scope of the Lot Validation Tests, graduated
to Group 1, Group 2, and Group 3 is illustrated further below
with the number of samples required for each level.
Deliverable item to the Lot Validation Tests is the test report
together with the used samples, shipped in waffle tray
package.
Waffle Tray
The detail specification ESCC 4001/029 has been
established after successful completion of an Evaluation
Test Programme according to ESCC 2264000.
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 09-Sep-13
Document Number: 28789
4
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Power Dissipation P
FUNCTIONAL PERFORMANCE
TNPS1206
TNPS0805
TNPS0603
0.3
W
0.2
0.1
0
- 50
0
50
125 °C 150
100
70
Ambient Temperature ϑamb
Current Noise A1
Derating
1
TNPS1206
TNPS0805
TNPS0603
µV/V
0.1
0.01
100
1K
10K
Ω
100K
In accordance with IEC 60195
1M
Resistance Value R
Non-Linearity A 3
Current Noise - A1
120
dB
100
80
60
TNPS1206
TNPS0805
TNPS0603
40
10
100
1K
10K
In accordance with IEC/TR 60440
100K
Ω
1M
Resistance Value R
Non-linearity - A3
Revision: 09-Sep-13
Document Number: 28789
5
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TNPS .... ESCC
Pulse Voltage U1.2/50
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TNPS1206
TNPS0805
TNPS0603
1K
V
100
10
10
100
1K
10K
100K
Ω
1M
Resistance Value R
Pulse load rating in accordance with IEC 60115-1, 4.27; 1.2 μs/50 μs; 5 pulses at 12 s intervals; for permissible resistance change 0.5 %
Pulse Voltage U10/700
1.2/50 Pulse
TNPS1206
TNPS0805
TNPS0603
1K
V
100
10
10
100
1K
10K
100K
Ω
1M
Resistance Value R
Pulse load rating in accordance with IEC 60115-1, 4.27; 10 μs/700 μs; 10 pulses at 1 min intervals; for permissible resistance change 0.5 %
|Z |/R
10/700 Pulse
2
Inductive, ϕ > 0
10 Ω
24.9 Ω
TNPS0603
49.9 Ω
100 Ω
226 Ω
1
499 Ω
1 kΩ
Capacitive, ϕ < 0
0.5
0.1
0.3
0.5
1.0
GHz
3.0
Frequency f
RF-Behaviour
Revision: 09-Sep-13
Document Number: 28789
6
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|Z |/R
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10 Ω
Inductive, ϕ > 0
TNPS0805
20 Ω
47.5 Ω
100 Ω
1
221 Ω
499 Ω
Capacitive, ϕ < 0
0.5
0.1
1 kΩ
0.3
0.5
GHz
1.0
3.0
Frequency f
|Z |/R
RF-Behaviour
2
10 Ω
Inductive, ϕ > 0
22.1 Ω
TNPS1206
49.9 Ω
100 Ω
1
226 Ω
499 Ω
Capacitive, ϕ < 0
0.5
0.1
1 kΩ
0.3
0.5
1.0
GHz
3.0
Frequency f
RF-Behaviour
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
Unless otherwise specified
atmospheric conditions apply:
ESCC 4001, generic specification, issue 3 (2010)
Temperature: 15 °C to 35 °C
ESCC 4001/029, detail specification, issue 2 (2010)
Relative humidity: 45 % to 75 %
The components are approved within the ESCC system. For
the full test schedule refer to the documents listed above.
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
The tests are carried out in accordance with the stated
specifications.
Revision: 09-Sep-13
the
following
standard
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60115-1, 4.31, unless
otherwise specified.
Document Number: 28789
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TEST PROCEDURES AND REQUIREMENTS
ESCC 4001
PARAGRAPH
ESCC 4001/029
PARAGRAPH
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
TNPS0603
10.0 Ω to 221 kΩ
TNPS0805
10.0 Ω to 422 kΩ
TNPS1206
10.0 Ω to 1.00 MΩ
PRODUCTION CONTROL (CHART F2)
8.3.2
2.5.1
Resistance
(22 ± 3) °C
± 1 % R; ± 0.5 % R; ± 0.1 % R
(ESCC 23500)
Plating
- Thickness
- Pb contents
X-ray fluorescence analysis
SnPb layer ≥ 3 μm
≥ 6 % Pb
4.5
1.8.2
8.14
(IEC 60068-2-20, Ta)
Solderability
8.6
1.6
Dimension check
Solder bath method;
SnPb40; non-activated flux;
(235 ± 5) °C;
(2 ± 0.5) s
-
Good tinning (≥ 95 % covered);
No visible damage;
± (0.02 % R + 10 mΩ)
-
SCREENING TESTS (CHART F3)
U =
2.1.1.1
1.5
8.1
(IEC/TR 60440)
2.5.1
Overload
8.3.3
2.5.2
8.3.2
2.5.1
Non-linearity
(3rd harmonic attenuation)
Resistance at high
and low temperature
Resistance
-
External visual inspection
-
8.6
k x P 70 x R
1 ms
Style
0603
0805
1206
k
30
32
32
-
± (0.05 % R + 10 mΩ)
A3 ≥ A3 min.
according to diagram non-linearity
-(55 ± 3) °C
(125 ± 3) °C
(22 ± 3) °C
-
-
-55 °C; 30 min;
125 °C; 30 min;
10 cycles
± (0.1 % R + 10 mΩ)
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K
± 1 % R; ± 0.5 % R; ± 0.1 % R
QUALIFICATION AND PERIODIC TESTS (CHART F4)
(IEC 60068-2-14, Na);
1.5
8.8
Rapid change of
temperature
Robustness of
terminations:
8.11.2
(IEC 60115-1, 4.32)
Adhesion
(shear test)
5 N; 10 s
No visible damage
± (0.05 % R + 10 mΩ)
2.3
Bend strength of
the end face plating
(substrate bending test)
Depth 2 mm; 5 s; 10 times
No visible damage
± (0.05 % R + 10 mΩ)
8.12
(IEC 60068-2-20, Tb)
2.4
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C;
(10 ± 1) s
No visible damage
± (0.02 % R + 10 mΩ)
8.10
8.10.2
1.5
(IEC 60068-2-2, Ba)
Climatic sequence:
Dry heat
8.10.3
(IEC 60068-2-30, Db)
Damp heat, cyclic
8.10.4
(IEC 60068-2-1, Aa)
Cold
8.10.5
(IEC 60068-2-13, M)
Low air pressure
2 kPa; (25 ± 10) °C; 1 h;
U = P 70 x R ≤ U max.
8.10.6
(IEC 60068-2-30, Db)
Damp heat, cyclic
55 °C; ≥ 90 % RH;
24 h; 5 cycles
8.10.7
-
DC load
(IEC 60115-1, 4.6.1.4)
Insulation resistance
8.11.2.1
8.3.1.2.2
Revision: 09-Sep-13
125 °C; 16 h
55 °C; ≥ 90 % RH;
24 h; 1 cycle
-55 °C; 1 h off; 0.75 h on
U=
± (0.1 % R + 20 mΩ)
Rins ≥ 1 GΩ
P 70 x R ≤ U max. ;
1 min
Test jig for flat chips
U = 100 V; 1 min
Rins ≥ 1 GΩ
Document Number: 28789
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TEST PROCEDURES AND REQUIREMENTS
ESCC 4001
PARAGRAPH
ESCC 4001/029
PARAGRAPH
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
10.0 Ω to 221 kΩ
TNPS0603
8.3.1.3.2
(IEC 60115-1, 4.7)
1.5
Voltage proof
TNPS0805
10.0 Ω to 422 kΩ
TNPS1206
10.0 Ω to 1.00 MΩ
Test jig for flat chips
URMS = 1.4 x Uins RMS;
f = (50 ± 10) Hz; 5 s
No breakdown;
no flashover
U=
2.7
1.5
8.13
8.14
Endurance at
operating life
(IEC 60068-2-20, Ta)
8.15
(ESCC 24800)
P 70 x R ≤ U max. ;
70 °C; 1000 h;
1.5 h on; 0.5 h off
70 °C; 1000 h
70 °C; 2000 h
± (0.05 % R + 10 mΩ)
± (0.1 % R + 20 mΩ)
Rins ≥ 1 GΩ
Solderability
Solder bath method;
SnPb40;
non-activated flux
(235 ± 5) °C; (2 ± 0.5) s
Good tinning (≥ 95 % covered);
no visible damage;
± (0.02 % R + 10 mΩ)
Permanence
of marking
a) Ethyl alcohol
b) Isopropyl alcohol
25 °C; 3 x 1 min
hard toothbrush;
3 x 10 strokes
Marking legible;
no visible damage
LOT VALIDATION TESTS
Execution of Lot Validation Tests is available as a separate order item. Deliverable item to the Lot Validation Tests is the test
report together with the used samples. The samples need to be ordered as a separate item.
SCOPE OF LOT VALIDATION TESTS
GROUP 1
ENVIRONMENTAL AND MECHANICAL
48 samples
Robustness of terminations: Shear (adhesion)
ESCC 4001, 8.11.2.1
Robustness of terminations: Substrate bending
ESCC 4001, 8.11.2.2
Resistance to soldering heat
ESCC 4001, 8.12
(6 samples)
Climatic sequence
ESCC 4001, 8.10
(12 samples)
GROUP 2
ENDURANCE
Endurance at operating life, 2000 h
GROUP 3
Revision: 09-Sep-13
(6 samples)
36 samples
ESCC 4001, 8.13
ELECTRICAL AND ASSEMBLY
21 samples
Insulation resistance
ESCC 4001, 8.3.1.2.2 (15 samples)
Voltage proof
ESCC 4001, 8.3.1.3.2
Solderability
ESCC 4001, 8.14
Permanence of marking
ESCC 4001, 8.15
(6 samples)
Document Number: 28789
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PART NUMBER AND PRODUCT DESCRIPTION FOR LOT VALIDATION TESTS
PART NUMBER: LOTCHG-LV1-4001029
L
O
T
C
H
G
-
L
V
1
-
4
0
0
1
0
2
PREFIX
LOT VALIDATION TEST
SPECIFICATION
LOTCHG
LV1 = LVT Group 1
LV2 = LVT Group 2
LV3 = LVT Group 3
ESCC 4001/029
TNPS
ESCC 4001/029
LVT1
MODEL
SPECIFICATION
LOT VALIDATION TEST
TNPS
ESCC 4001/029
LVT1 = LVT Group 1
LVT2 = LVT Group 2
LVT3 = LVT Group 3
9
PRODUCT DESCRIPTION: TNPS ESCC 4001/029 LVT1
Note
• Execution of Lot Validation Tests can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
ORDER TEXT EXAMPLE
An order of a Lot Validation Tests shall be combined with a dedicated order line for the required amount of samples, using packaging code
“LX”, see the example below:
POS
QTY
ITEM
0030
950
TNPS0805 25 75K0 0.5 % BX ESCC 4001/029
400102902 7502D2
{Quantity for consumption}
0031
36
TNPS0805 25 75K0 0.5 % LX ESCC 4001/029
400102902 7502D2
{Quantity for LVT samples}
0032
1
TNPS ESCC 4001/029 LVT2
{Lot Validation Test, Group 2}
...
...
Revision: 09-Sep-13
Document Number: 28789
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000