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Datasheet
Wireless Power Consortium / Qi Compliant series
Wireless Power Transmitter IC
BD57020MWV
General Description
Key Specifications




BD57020MWV is an integrated IC for the wireless power
transmitter. This device is composed of inverters for the
coil drive, controller for the communication of the Qi
compliant and demodulating circuit, GPIO, TCXO buffer,
and I2C interface.
BD57020MWV works as a controller in the wireless
power transmitter based on the Qi compliant by using it
with a general-purpose microcomputer.
BD57020MWV is applied to Qi ver.1.2 (Low Power and
Medium Power).
Input Power Supply Voltage Range: 4.2 V to 5.3 V
Input Adapter Voltage Range:
4.6 V to 20 V
Drive Frequency Range:
110kHz to 205kHz
-20°C to +85°C
Operating Temperature Range:
Package
UQFN040V5050
5.00mm x 5.00mm x 1.00mm
Features






WPC / Qi ver.1.2 (Low Power and Medium Power)
support.
Half Bridge / Full Bridge inverter
Foreign object detection
GPIO 4CH
I2C bus interface
5.0mm x 5.0mm UQFN package 40 pin
Applications
WPC compliant devices
 PC
 Cradle for charge stand
Typical Application Circuit
3.3V
CS
+
ADPIN
19V
ADDR 32
2 LDO33B
3 LDO33A
VDD
5
TCXOEN
6
TCXOIN
7
TCXOOUT
PGND 27
CS
LDO
Data
Qi packet
Controller
Voltage
&
Current
Sensing
HSIDE2 25
Transmitter(TX)
SW2 24
Receiver(RX)
BOOT2 23
Figure 2. Product position in wireless
power supply system
COIL_IN
20 AGND
19 RESETB
18 INTB
17 SDA
16 SCL
15 FSKIN
14 CLKSET
13 CLKIN
GPIO3
12 VDDIO
TEST 22
11
MONI1
Demodulator
Voltage
&
Current
Sensing
Rectification
Mod
LSIDE2 26
BD57020MWV
GPIO1
10 GPIO2
NN
Full Bridge
MCU
SW1 30
LSIDE1 28
8 GPIO0
9
MOSFET
Driver
HSIDE1 29
3.3V
4
BOOT1 31
VIN 34
OVPOUT 33
VIN 35
MONI0 36
ADPI 38
MONI1 37
40
ADPV 39
OVPIN
REFGND
1
3.3V
BD57015GWL
Power
BD57020MWV
21
ADPIN
I2C IF
ADC
ML610Q772
Figure 1. Typical application circuit
〇Product structure : Silicon monolithic integrated circuit
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Load
BD57020MWV
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VIN, ADPV, ADPI, SW1, SW2 voltage
VIN_H1
-0.3 to 24.0
V
BOOT1, BOOT2 voltage
VIN_H2
-0.3 to 31.0
V
HSIDE1, HSIDE2 voltage
VOUT_H
-0.3 to 31.0
V
OVPIN, VDDIO, CLKIN, CLKSET, FSKIN,
SCL, RESETB, TEST, ADDR voltage
VIN_L1
-0.3 to 7.0
V
VDD, TCXOIN voltage
VIN_L2
-0.3 to 4.5
V
COIL_IN voltage
VIN_L3
-4.5 to 7.0
V
LDO33A, LDO33B , INTB, LSIDE1, LSIDE2,
OVPOUT, MONI0, MONI1 voltage
VOUT_L1
-0.3 to 7.0
V
TCXOEN, TCXOOUT voltage
VOUT_L2
-0.3 to 4.5
V
SDA voltage
VINOUT_L1
-0.3 to7.0
V
GPIO0, GPIO1, GPIO2, GPIO3 voltage
VINOUT_L2
-0.3 to 4.5
V
Note 1
Power dissipation
Pd
3.26 (
)
W
Operating ambient temperature range
Ta
-20 to +85
°C
Tstg
-55 to +150
°C
Storage temperature range
(Note 1) Derate by 26 mW/°C when operating above Ta=25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board with front and back layer heat radiation
copper foil 4.5 mm x 4.5 mm, second and third layer heat radiation copper foil 74.2 mm x 74.2 mm).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -20°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
VIN terminal input voltage range
VIN
4.2
5.0
5.3
V
VDD terminal input voltage range
VDD
3.1
3.3
3.5
V
VDDIO
3.1
3.3
3.5
V
Adapter input voltage range
VADPV
4.6
-
20
V
TCXO terminal input frequency range
FTCXO
32
-
52
MHz
VDDIO terminal voltage range
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BD57020MWV
Electrical Characteristics (Unless otherwise specified VIN=5V VDD=3.3V Ta=25°C)
Parameter
Symbol
Min
Limit
Typ
Max
Unit
Conditions
Whole Chip
Operating circuit current 1
ICC1
-
2.0
3.0
mA
TCXOIN=0kHz
Operating circuit current 2
ICC2
-
15.0
23.0
mA
TCXOIN=32MHz
VOCP
125
160
195
mV
RS=100mΩ
VIN Over voltage lockout
VOVLO_VIN
6.1
6.4
6.7
V
VIN: 5.0 → 8.0V
Hysteresis on OVLO
VOVLO_HYS
140
200
260
mV
VIN: 8.0 → 5.0V
VIN Under voltage lockout
VUVLO_VIN
3.3
3.6
3.9
V
VIN: 5.0 → 0V
Protection block
(the IC outside)
External OCP operating voltage
Protective circuit (the IC inside)
Hysteresis on UVLO
VUVLO_HYS
140
200
260
mV
VIN: 0 → 5.0V
VDD UVLO detection voltage
VUVLOD_VDD
2.25
2.50
2.75
V
VDD: 3.3 → 0V
VDD UVLO release voltage
VUVLOR_VDD
2.55
2.80
3.05
V
VDD: 0 → 3.3V
VDDIO UVLO detection voltage
VUVLOD_VDDIO
2.25
2.50
2.75
V
VDDIO: 3.3 → 0V
VDDIO UVLO release voltage
VUVLOD_VDDIO
2.55
2.80
3.05
V
VDDIO: 0 → 3.3V
Internal OCP operating current
IOCP
-
0.48
0.65
A
LDO33A output voltage
VLDO33A
3.2
3.3
3.4
V
LDO33A maximum output current
ILDO33A
-
-
30
mA
LDO33B output voltage
VLDO33B
3.2
3.3
3.4
mV
LDO33B maximum output current
ILDO33B
-
-
30
mA
LDO33A block
Isource=10mA
LDO33B block
Isource=10mA
Demodulating circuit block
COIL_IN leak current 1
ILEAKCOILIN1
-
-
50
µA
VCOIL_IN=3.3V
COIL_IN leak current 2
ILEAKCOILIN2
-150
-
-
µA
VCOIL_IN=-3.3V
TCXOIN input current
ITCXOIN
-
0
1.0
µA
VDD=VTCXOIN=4.5V
Input frequency range
FTCXOIN
-
-
MHz
TCXOEN L level output voltage
VOHTXCOEN
-
-
52
VDD
x 0.2
V
Isink=1.0mA
TCXOEN H level output voltage
VOLTXCOEN
-
-
V
Isource=1.0mA
TCXOOUT output impedance
ZOTCXOOUT
VDD
x 0.8
-
1.0
-
kΩ
Drive frequency
FDRIVE
110
-
205
kHz
Minimum Duty Ratio
Dutymin
-
25
-
%
TDead
-
200
-
ns
RSOURCE
-
1.0
-
Ω
RSINK
-
0.8
-
Ω
GPIO L level input voltage
VOLGPIO
-
-
VDD
x 0.3
V
GPIO H level input voltage
VOHGPIO
-
-
V
GPIO pull-down resistor
GPIO pull-up resister
GPIO L level output voltage
TCXO_BUFF block
Inverter block
Dead Time
Source resistance
Sink resistance
TCXOIN=32MHz
GPIO block
GPIO H level output voltage
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RPDGPIO
VDD
x 0.7
-
100
RPUGPIO
-
100
VILGPIO
-
-
VIHGPIO
VDD
x 0.8
-
3/35
kΩ
VDD
x 0.2
kΩ
V
Isink=1.0mA
-
V
Isource=1.0mA
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BD57020MWV
Parameter
Symbol
Min
Limit
Typ
Unit
Max
Conditions
FSKIN terminal
FSKIN L level input voltage
VILFSKIN
-
-
VDDIO
x 0.3
V
FSKIN H level input voltage
VIHFSKIN
VDDIO
x 0.7
-
-
V
CLKIN L level input voltage
VILCLKIN
-
-
VDDIO
x 0.3
V
CLKIN H level input voltage
VIHCLKIN
VDDIO
x 0.7
-
-
V
ADDR L level input voltage
VILADDR
-
-
VDDIO
x 0.3
V
ADDR H level input voltage
VIHADDR
VDDIO
x 0.7
-
-
V
VLINTB
-
380
500
mV
Isink=5.0mA
ILEAKINTB
-
-
2.0
µA
VINTB=7.0V
RESETB L level input voltage
VILRSTB
-
-
VDD
x 0.3
V
RESETB H level input voltage
VIHRSTB
RESETB pull-up resister
RPDRSTB
CLKIN terminal
ADDR terminal
INTB terminal
Open Drain ability on INTB
INTB leak current
RESETB terminal
VDD
x 0.7
-
-
-
V
100
-
kΩ
I2C interface
SCL, SDA L level input voltage
VILI2C
-
-
0.50
V
SCL, SDA H level input voltage
VIHI2C
1.50
-
-
V
SCL, SDA L level input current
IILI2C
-1.0
-
-
µA
SCL, SDA H level input current
IIHI2C
-
-
1.0
µA
VOLI2C
-
-
400
mV
SDA L level output voltage
Isink=3.0mA
Pin Configuration
1
38
37
36
35
34
33
32
31
ADPI
MONI0
VIN
VIN
OVPOUT
ADDR
BOOT1
39
ADPV
MONI1
40
REFGND
(TOP VIEW)
OVPIN
SW1
30
2
LDO33B
HSIDE1
29
3
LDO33A
LSIDE1
28
4
VDD
PGND
27
5
TCXOEN
LSIDE2
26
6
TCXOIN
HSIDE2
25
7
TCXOOUT
SW2
24
BOOT2
23
INTB
RESETB
AGND
19
20
SDA
17
18
SCL
FSKIN
15
16
CLKSET
11
CLKIN
21
14
22
COIL_IN
13
TEST
GPIO2
VDDIO
GPIO1
10
GPIO3
GPIO0
9
12
8
Figure 3. Pin Configuration
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BD57020MWV
Pin Description
Pin No.
Pin Name
Function
I/O
1
OVPIN
5.0V input, connected to OVPOUT.
I
2
LDO33B
3.3V LDO output.
O
3
LDO33A
3.3V LDO output.
O
4
VDD
3.3V supply.
I
5
TCXOEN
Connected to External oscillator. Control signal output.
O
6
TCXOIN
Connected to External oscillator.
I
7
TCXOOUT
O
8
GPIO0
Connected to External oscillator.
General-purpose input and output terminal.
I/O
9
GPIO1
General-purpose input and output terminal.
I/O
10
GPIO2
General-purpose input and output terminal.
I/O
I/O
11
GPIO3
General-purpose input and output terminal.
12
VDDIO
3.3V supply.
I
13
CLKIN
Clock input terminal, leave this pin open.
I
14
CLKSET
Test terminal, leave this pin open.
I
15
FSKIN
FSK control signal input.
I
16
SCL
I2C clock input
I
17
SDA
I2C Data input and output.
I/O
18
INTB
Interrupt detection output.
O
19
RESETB
Control logic reset
I/O
20
AGND
21
COIL_IN
22
TEST
23
BOOT2
Analog ground.
I
Coil current / voltage input.
I
Test terminal, connected to GND.
I
Connected to Boot strap capacitor.
I
24
SW2
Connected to the source of high side FET and the drain of low side FET.
I
25
HSIDE2
Connected to the gate of high side FET.
O
26
LSIDE2
Connected to the gate of low side FET.
O
27
PGND
Power ground.
I
28
LSIDE1
Connected to the gate of low side FET.
O
29
HSIDE1
Connected to the gate of high side FET.
O
30
SW1
Connected to the source of high side FET and the drain of low side FET.
I
31
BOOT1
Connected to Boot strap capacitor.
I
32
ADDR
Slave Address change.
I
33
OVPOUT
5.0V output, connected to OVPIN.
O
34
VIN
5.0V Input power supply
I
35
VIN
5.0V Input power supply
I
36
MONI0
Coil current value output.
O
37
MONI1
Input voltage value output.
O
38
ADPI
Sense transmitter Input current.
I
39
ADPV
Sense transmitter Input voltage.
I
40
REFGND
Reference ground.
I
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BD57020MWV
UVLO
MONI1
ADPI
ADPV
OVPOUT
VIN
REFGND
Block Diagram
OVP
BOOT1
OVPIN
POWER_SENSE
HSIDE1
DRIVER
LDO
LDO33B
SW1
VDD
LSIDE1
BOOT2
LDO
LDO33A
HSIDE2
TSD
DRIVER
VDD
VDD
CONTROL
Logic
OSC
SW2
LSIDE2
VDD
TCXOEN
PGND
TCXO Buff
TCXOIN
TCXOOUT
DEMOD
VDD
MONI0
GPIO0
GPIO1
GPIO2
COIL_IN
GPIO
IO
AGND
ADDR
RESETB
SDA
INTB
SCL
FSKIN
CLKIN
CLKSET
VDDIO
GPIO3
Figure 4. Block diagram
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BD57020MWV
Description of Blocks
1. Pre-driver block
Transmitter (Tx) includes inverter circuits to input AC electricity into both ends of the primary coil and to produce the
electromotive force on the secondary side by electromagnetic induction. BD57020MWV includes two pre-driver blocks to
support Half Bridge inverter and Full Bridge inverter configurations. For the Half Bridge inverter configuration, it is
necessary to set the pre-driver 1 (PWM0 signal). For the Full Bridge inverter configuration, it is necessary to set the
pre-driver 1 and pre-driver 2 (PWM1 signal). The output power control modes are the frequency control, the duty control
and the phase control. The pre-driver block prevents a through current by monitoring the on/off timing of low side FET and
high side FET.
For high efficiency, the bootstrap drive system which sets the H side-L side to Nch FET is adopted. It is necessary to put a
capacitor (0.1 – 0.47 µF) between the BOOT1 (BOOT2) terminal and the SW1 (SW2) terminal to maintain the voltage
potential between these pins. Install a ceramic capacitor as close to these pins as possible.
2. Digital Ping
Tx inputs AC electricity into the primary coil and by electromagnetic induction develops an electromotive force on the
secondary coil which starts the Receiver (Rx). This phase is called Digital Ping. Tx keeps transmitting power as long as it
receives Digital Ping from the Rx. Tx controls the transmission power based on a packet including the power incoming
information from Rx. The following registers are used to configure Digital Ping.
(1) PWM0PRD: Setting register for the period of PWM0 signal
This register is used to set the period of PWM0 signal. The PWM0 signal sets the period of the pulse to be output from
pre-driver 1 with a count level. The relation between the period of PWM0 signal and source clock is determined by the
following formula:
 SourceCloc k 
  1
PWM 0 PRD  round 
 TargetClock 
“round” means rounding off to the nearest whole number
For example, if source clock=32MHz and target clock=100kHz, PWM0PRD register is set to the following value:
 32000 
PWM 0 PRD  round 
  1  319  0x013F
 100 
Name
PWM0
PRDL
PWM0
PRDH
Address
0x20
0x21
b7
b6
b5
b4
b3
b2
b1
b0
PWM0
PRD7
PWM0
PRD15
PWM0
PRD6
PWM0
PRD14
PWM0
PRD5
PWM0
PRD13
PWM0
PRD4
PWM0
PRD12
PWM0
PRD3
PWM0
PRD11
PWM0
PRD2
PWM0
PRD10
PWM0
PRD1
PWM0
PRD9
PWM0
PRD0
PWM0
PRD8
Initial
Value
R/W
0x00
R/W
0x00
R/W
After PWM0DTYH (0x23) is written, this register is updated with the new data.
(2) PWM0DTY: Setting register for the duty of PWM0 signal
This register is used to set the duty of PWM0 signal. PWM0 signal is the output signal at pre-driver 1. The duty of PWM0
signal is set with the count number of the source clock. After this register has been written, when the counter number of
PWM0 signal becomes 0, the data of PWM0PRD register and PWM0DTY register are updated with the new data. The
relation between the duty of PWM0 signal and source clock is determined by the following formula:

 Duty 
PWM 0 DTY  int PWM 0 PRD  1 

 100 

“int” means rounding down to the nearest whole number
For example, if source clock= 32MHz and target clock=100kHz with duty=50%, PWM0DTY register is set to the following
value:

 50 
PWM 0 DTY  int 320  1  
  160  0x00A0
 100 

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Duty is defines as the ratio between the amount of time when the output is high in one period to the whole period of
PWM0 signal. The enable range of PWM0DTY register is from 0x0001 to (PWM0PRD-1). PWM0 will not be generated if
the PWM0DTY register is set to a value greater than or equal to the value in PWM0PRD register.
Name
PWM0
DTYL
PWM0
DTYH
Address
0x22
0x23
b7
b6
b5
b4
b3
b2
b1
b0
PWM0
DTY7
PWM0
DTY15
PWM0
DTY6
PWM0
DTY14
PWM0
DTY5
PWM0
DTY13
PWM0
DTY4
PWM0
DTY12
PWM0
DTY3
PWM0
DTY11
PWM0
DTY2
PWM0
DTY10
PWM0
DTY1
PWM0
DTY9
PWM0
DTY0
PWM0
DTY8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(3) PWM1PHS: Setting register for the phase difference between PWM1 signal and PWM0 signal
This register is used to set the phase difference between PWM1 signal and PWM0 signal with the count number of the
source clock. PWM1 signal is a signal with the same period and duty as PWM0 signal. After PWM0DTYH register (0x23)
is written and the counter number of PWM0PRD register becomes 0, the data of this register is updated with the new
data. The enable range of this register is from 0x0001 to (PWM0PRD). PWM1 signal will not be generated if the
PWM1PHS register is set to a value greater than or equal to the value in PWM0PRD register. It is also necessary to write
0x23 in PWM0DTYH register after this register has been written.
Name
PWM1
PHSL
PWM1
PHSH
AddRess
0x24
0x25
b7
b6
b5
b4
b3
b2
b1
b0
PWM1
PHS7
PWM1
PHS15
PWM1
PHS6
PWM1
PHS14
PWM1
PHS5
PWM1
PHS13
PWM1
PHS4
PWM1
PHS12
PWM1
PHS3
PWM1
PHS11
PWM1
PHS2
PWM1
PHS10
PWM1
PHS1
PWM1
PHS9
PWM1
PHS0
PWM1
PHS8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(4) PWM0GEN: Setting register for the dead time of PWM0 signal
This register is used to set the dead time of PWM0 signal. The relation between the dead time and the source clock is
defined by the following formula:
DeadTime 
2
SourceCloc k
For example, if source clock=32MHz, Dead Time is the smallest value and it is 62.5nsec.
Additionally, please set this register to the following value.
Full Bridge inverter: PWMGEN0= 0x49
Half Bridge inverter: PWMGEN0= 0x10
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
PWMGEN0
0x30
P0DLY
D1
P0DLY
D0
P0DLY
C2
P0DLY
C1
P0DLY
C0
P0DLY
B2
P0DLY
B1
P0DLY
B0
0x92
R/W
(5) PWM1GEN: Setting register for the dead time of PWM1 signal
This register is used to set the dead time of PWM1 signal. The relation between the dead time and source clock is
determined by the following formula:
DeadTime 
2
SourceCloc k
For example, if source clock=32MHz, Dead Time is the smallest value and it is 62.5nsec.
Additionally, please set this register to the following value.
Full Bridge inverter: PWMGEN1= 0x49
Half Bridge inverter: PWMGEN1= 0x10
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
PWMGEN1
0x31
P1DLY
D1
P1DLY
D0
P1DLY
C2
P1DLY
C1
P1DLY
C0
P1DLY
B2
P1DLY
B1
P1DLY
B0
0x92
R/W
(6) PWRCTRL: Setting register for the operation mode
This register is used to set the operation mode and the base clock for the internal movement. By setting the power mode
bit (PWMD0, PWMD1), the operation mode is changed. The operation mode is Digital Ping when PWMD=0x0.
Meanwhile, the operation mode is Analog Ping, which is also the low power consumption mode, when PWMD=0x1. On
the other hand, the operation is Stop Mode when PWMD=0x3. During Stop Mode, all blocks are stopped.
BD57020MWV uses the input clock signal from TCXOIN terminal for source clock of the internal movement.
Please set this register with TCXSEL = 1, and connect TCXO with frequency between 32 to 52MHz to TCXOIN terminal.
When TCXSEL = 1 and TCXEN = 1, TCXOEN terminal becomes high output but when TCXSEL = 1 and TCXEN = 0,
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TCXOEN terminal becomes low output. Please set this register with OSCSEL= 1 to use an internal oscillator clock for
measuring Analog Ping internal period.
・[7:6]
・[5:4]
・[3]
・[2]
・[1]
・[0]
Name
PWRCTRL
Reserved
PWMD0, PWMD1: Setting bit for operation mode
(0x0: Digital Ping mode
0x1: Analog Ping mode
Reserved
OSCSEL: Control bit for using internal oscillator
(0x1: Enable
0x0: Disable)
TCXEN: Control bit for using external TCXO
(0x1: Enable
0x0: Disable)
TCXSEL: Selection bit for using external TCXO
(0x1: Enable
0x0: Disable)
Address
0x0F
0x2: Reserved
0x3:Stop mode)
b7
b6
b5
b4
b3
b2
b1
b0
-* 1
-* 1
PWMD1
PWMD0
-* 1
OSCSEL
TCXEN
TCXSEL
Initial
Value
0x07
R/W
R/W
*1 prohibition against writing
(7) PDCTRL: Control register for the pre-driver output
This register is used to enable pre-driver 1 and pre-driver 2. Pre-driver 1 drives HSIDE1 terminal and LSIDE1 terminal
while pre-driver 2 drives HSIDE2 terminal and LSIDE2 terminal. When PDEN=1, the pulse is produced at HSIDE1
terminal and LSIDE1 terminal. When PDEN=0, the pulse is stopped. When PWM1EN=1, the pulse is produced at
HSIDE2 terminal and LSIDE2 terminal. When PWM1EN=0, the pulse is stopped.
Refer to 3. FSK (Frequency Shift Keying) for the explanation of PSWEN and PS256.
・[7:5]
Reserved
・[4]
PWM1EN: Control bit for pre-driver 2
(0x1: Enable
0x0: Disable)
・[3]
Reserved
・[2]
PS256: Change the PWM output to every 256 cycles
・[1]
PSWEN: Control of the PWM change function
・[0]
PDEN: Control bit for pre-driver 1
(0x1: Enable
0x0: Disable)
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
PDCTRL0
0x12
-* 1
-* 1
-* 1
PWM1
EN
-* 1
PS256
PSWEN
PDEN
0x00
R/W
*1 prohibition against writing
3. FSK (Frequency Shit Keying)
BD57020MWV transmits a packet to Rx using Frequency Shift Keying (FSK) to establish communication with Rx. When Tx
transmits a packet using FSK, Tx changes the frequency of the PWM0 signal by pre-driver 1 into the drive frequency (fd)
and the modulation frequency (fmod) every 256 periods. That drive frequency is the frequency of the PWM0 signal which
set in 2.(1).That FSK modulation frequency is the frequency of the PWM0 signal which set in 3. The setting of FSK sets the
following registers.
(1) PWMXPRD: Setting register for the period of the PWM0 signal at FSK
This register is used to set the period of PWM0 signal when PSWEN=1 (PDCTRL0: 0x12) and FSKIN terminal = high.
The relation between the period of PWM0 signal and source clock is determined by the formula below, and it is
expressed in the same formula as PWM0PRD.
 SourceClock 
  1
PWMXPRD  round 
 TargetClock 
“round” means rounding off to the nearest whole number
Name
PWMX
PRDL
PWMX
PRDH
Address
0x26
0x27
b7
b6
b5
b4
b3
b2
b1
b0
PWMX
PRD7
PWMX
PRD15
PWMX
PRD6
PWMX
PRD14
PWMX
PRD5
PWMX
PRD13
PWMX
PRD4
PWMX
PRD12
PWMX
PRD3
PWMX
PRD11
PWMX
PRD2
PWMX
PRD10
PWMX
PRD1
PWMX
PRD9
PWMX
PRD0
PWMX
PRD8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(2) PWMXDTY: Setting register for the duty of the PWM0 signal at FSK
This register is used to set the duty of PWM0 signal when PSWEN=1 (PDCTRL0: 0x12) and FSKIN terminal = high. The
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relation between the duty of PWM0 signal and source clock is determined by the formula below, and it is expressed in a
same formula as PWM0DTY.

 Duty 
PWMXDTY  int PWMXPRD  1 

 100 

“int” means rounding down to the nearest whole number
Name
PWMX
DTYL
PWMX
DTYH
Address
0x28
0x29
b7
b6
b5
b4
b3
b2
b1
b0
PWMX
DTY7
PWMX
DTY15
PWMX
DTY6
PWMX
DTY14
PWMX
DTY5
PWMX
DTY13
PWMX
DTY4
PWMX
DTY12
PWMX
DTY3
PWMX
DTY11
PWMX
DTY2
PWMX
DTY10
PWMX
DTY1
PWMX
DTY9
PWMX
DTY0
PWMX
DTY8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(3) PDCTRL: Control register for pre-driver output
This register is used to change the frequency of PWM0 signal by setting PSWEN and PS256. When PSWEN=1, the
frequency and duty of PWM0 signal are changed by input signal of FSKIN terminal.
・When PSWEN = 0, the data of PWM0 signal is updated to the data of PWM0PRD and PWM0DTY.
・When of PSWEN = 1 and FSKIN terminal = Low, the data of PWM0 signal is updated to the data of PWM0PRD
register and PWM0DTY register.
・When of PSWEN = 1 and FSKIN terminal = High, the data of PWM0 signal is updated to the data of PWMXPRD
register and PWMXDTY register.
When PS256 is 1, the period and the duty of PWM0 are changed by input signal of FSKIN terminal every 256 cycles.
After having taken in a change of external terminal FSKIN, during 256 cycles of the output frequency, the next change
isn’t taken. Furthermore, an interrupt occurs every 256 cycles of the output frequency when PXIEN bit of register
INTENB (0x04) is 1. Whenever an interrupt occurs, the output frequency from a pre-driver is changed by changing input
of external terminal FSKIN every 256 cycles.
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
PDCTRL0
0x12
-* 1
-* 1
-* 1
PWM1
EN
-* 1
PS256
PSWEN
PDEN
0x00
R/W
*1 prohibition against writing
4. Analog Ping
BD57020MWV outputs pulse signal from primary coil to detect if Rx was put on the interface of the Tx. The presence of Rx
is confirmed if BD57020MWV detects a change in the coil current or voltage. When the change of the coil current or voltage
reaches the threshold value of the Analog Ping detection, the state shifts to Digital Ping. Additionally, BD57020MWV will
generate an interrupt after Analog Ping executes a set number of times. In Analog Ping, it is necessary to drive a primary
coil near the resonant frequency. The setting of the frequency is performed right before an output of Analog Ping, like Digital
Ping. Set the following registers to configure Analog Ping.
(1) APGCTRL: Control register for Analog Ping
This register is used to set the start and stop of Analog Ping and the expected value of Rx detection by Analog Ping.
BD57020MWV starts Analog Ping when APEN=1 is set. The period and duty of PWM0 should be set before APEN is set
to 1. BD57020MWV stops Analog Ping when APEN=0 is set. When the state of the COIL_IN terminal is matched with the
expected value of this register, BD57020MWV detects Rx. When APEN is 1, BD57020MWV becomes the stand-by state,
the circuit electric current decreases.BD57020MWV will execute Analog ping until any of the two conditions is met: 1.)
Analog Ping finishes the set number of repeated execution without detecting any Rx. 2.) Rx is detected wherein it
generates an interrupt and stops Analog Ping. The expected value of Analog Ping is configured as follows:
・[7]
APEN: Control bit for Analog Ping
(0x1: Enable
0x0:Disable)
・[6:2]
Reserved
・[1:0]
APEX0, APEX1: Expected value of Analog ping
(0x1: Detect the Rx
0x0: Not detect the Rx
0x2, 0x3: Reserved)
Name
APGCTRL
Address
0x16
b7
b6
b5
b4
b3
b2
b1
b0
APEN
*1
*1
*1
*1
*1
APEX1
APEX0
-
-
-
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(2)APGSTT: Analog Ping status register
This register shows status of Analog Ping.
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・[7]
・[6:4]
・[3:0]
Name
APGSTT
Reserved
APSTA2, APSTA1, APSTA0: Analog Ping status
(0x0: Stop
0x1: Under the standby set in APGIVT
0x3: Under the power output set in APGIDUR
0x5: Under the measurement set in APGMSR
0x6: A state of the input accorded with a value of the APEX.
BD57020MWV generates an interrupt and stop.
0x7: The number of Analog Ping execution times reached the set number.
BD57020MWV generates an interrupt and stop.
Others: Reserved)
Reserved
Address
0x17
b7
*1
-
b6
APSTA2
b5
APSTA1
b4
b3
b2
b1
b0
APSTA0
*1
*1
*1
*1
-
-
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(3) APGITVL: Setting register for the interval time of Analog Ping
This register is used to set the interval time of Analog Ping. If The Analog Ping detection interval is set short, time from
Rx establishment on Tx to Tx starting power feeding is short. However, the power consumption of Tx increases The
Analog Ping detection interval is set by interval with internal oscillation clock (typ.100kHz). The relation between the
interval time and input clock is determined by the following formula:
APGITV  IntervalTime  InputClock   1
For example, if Input Clock=100kHz and time of Interval Time=500 msec, the value of APGITV register is set to the
following value:
APGITV  500 100  1  49999  0xC34F
Name
Address
APGITVL
0x18
APGITVH
0x19
b7
b6
b5
b4
b3
b2
b1
b0
APG
ITV7
APG
ITV15
APG
ITV6
APG
ITV14
APG
ITV5
APG
ITV13
APG
ITV4
APG
ITV12
APG
ITV3
APG
ITV11
APG
ITV2
APG
ITV10
APG
ITV1
APG
ITV9
APG
ITV0
APG
ITV8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(4) APGDUR: Setting register for the duration time of Analog Ping
This register is used to set the duration time of Analog Ping. Duration time is defined as the time frame wherein
BD57020MWV produces the pulse output and drives the primary coil. The input clock from TCXOIN terminal is a source
clock. The relation between the duration time and source clock is determined by the following formula:

 1 
APGDUR  int DurationTime  SourceCloc k  
  1
 1000 

“int” means rounding down to the nearest whole number
For example, if the time of duration is 100µsec and Source Clock is 32MHz, the value of APGDUR register is set to the
following value:

 1 
APGDUR  int 100  32000  
  1  3199  0x0C7F
 1000 

Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
APGDURL
0x1A
APG
DUR7
APG
DUR6
APG
DUR5
APG
DUR4
*1
*1
*1
*1
APG
DUR3
APG
DUR11
APG
DUR2
APG
DUR9
APG
DUR1
APG
DUR8
APG
DUR0
APG
DUR7
APGDURH
0x1B
-
-
-
-
Initial
Value
R/W
0x00
R/W
0x00
R/W
*1 prohibition against writing
(5) APGMSR: Setting register for the measurement time of Analog Ping
This register is used to set the measurement time of Analog Ping. Measurement time is defined as the time frame after
the duration time wherein BD57020MWV monitors the state of COIL_IN to confirm the presence of Rx. The input clock
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from TCXOIN terminal is a source clock. The relation between the measurement time and source clock is determined by
the following formula:

 1 
APGMSR  int MeasurementTime  SourceCloc k  
  1
 1000 

“int” means rounding down to the nearest whole number
For example, if Measurement Time=10µsec and Source Clock is 32MHz, APGMSR register is set to the following value:

 1 
APGMSR  int 10  32000  
  1  319  0x013F
 1000 

Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
APGMSRL
0x1C
APG
MSR7
APG
MSR6
APG
MSR5
APG
MSR4
*1
*1
*1
*1
APG
MSR3
APGMS
R11
APG
MSR2
APGMS
R10
APG
MSR1
APGMS
R9
APG
MSR0
APGMS
R8
APGMSRH
0x1D
-
-
-
-
Initial
Value
R/W
0x00
R/W
0x00
R/W
*1 prohibition against writing
(6) APGCNT: Setting register for the execution number of times of Analog Ping
This register is used to set the number of times Analog Ping carries out automatically. If APGCNT= 0, Analog Ping is
carried out until APEN bit of APGCTRL register is 0. If APIEN=1 in the INTENB register, when the number of Analog Ping
execution times reaches the set number, BD57020MWV generates an interrupt signal. BD57020MWV keeps generating
an interrupt signal until APEN bit of APGCTRL register is 0.
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
APGCNT
0x1E
APG
CNT7
APG
CNT6
APG
CNT5
APG
CNT4
APG
CNT3
APG
CNT2
APG
CNT1
APG
CNT0
0x00
R/W
5. Interrupt control
BD57020MWV generates various interrupt signals. Set the following registers for generating the interrupt signal.
(1) INTSTT: Interrupt status register
This register shows an interrupt status when an interrupt factor occurred. When any bit of this register is set,
BD57020MWV generates an interrupt signal on INTB terminal. When the bit is set to 1, the interrupt signal is cleared.
・[7]
Reserved
・[6]
APINT: An interrupt signal of Analog Ping occurs.
・[5]
Reserved
・[4]
AGINT: An interrupt signal by the protection movement occurs.
・[3]
EINT: An interrupt signal by parity error or the framing error occurs during the packet reception.
・[2]
CINT: An interrupt signal by the check sum error occurs during the packet reception.
・[1]
RINT2: An interrupt signal by the normal completion during the packet reception of demodulating circuit 2.
・[0]
RINT1: An interrupt signal by the normal completion during the packet reception of demodulating circuit 1.
Name
INTSTT
Address
0x03
b7
*1
-
b6
b5
b4
b3
b2
b1
b0
APINT
*1
AGINT
EINT
CINT
RINT2
RINT1
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(2) INTENB: Control register for an interrupt
This register is used to control an interrupt signal. When the interrupt factor that is set to 1 by this register occurred, a bit
to support of the interrupt status register is set. But there is no bit of the interrupt status register (INTSTT) corresponding
to PXIEN of the interrupt enable register (INTENB). Because the admitted interrupt occurs in 1 pulse by PXIEN, the
status at the time of the outbreak of interrupt is not maintained.
・[7]
PXIEN: Control bit for an interrupt signal every 256 cycles by PWM change function
・[6]
APINT: Control bit for an interrupt signal in Analog Ping
・[5]
Reserved
・[4]
AGINT: Control bit for an interrupt signal by protection movement
・[3]
EINT: Control bit for an interrupt signal by the parity error or the framing error during the packet reception
・[2]
CINT: Control bit for an interrupt signal by the check sum error during the packet reception
・[1]
RINT2: Control bit for an interrupt signal by normal completion at demodulating circuit 2 during the packet
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・[0]
Name
INTENB
reception
RINT1: Control bit for an interrupt signal by normal completion at demodulating circuit 1 during the packet
reception
Address
0x04
b7
PXIEN
b6
b5
b4
b3
b2
b1
b0
APIEN
*1
AGIEN
EIEN
CIEN
RIEN2
RIEN1
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
6.
AM demodulator block
BD57020MWV has the two AM demodulator blocks for communication with Rx. The characteristics of demodulator blocks
are different to improve communication stability. The following registers are used for the configuration of the demodulator
blocks.
(1) RXCTRL: Control register for Packet reception
This register is used to control the demodulating blocks. If PRE1 bit=1, the demodulator 1 is enabled to receive the
packets. If PRE2 bit=1, the demodulator 2 is enabled to receive the packets. It is possible to set both PRE1 bit and PRE2
bit to 1 at the same time, then demodulator 1 and demodulator 2 works independently. The digital filters of the
demodulators are enabled if FTE1 bit and FTE2 bit are set to 1 in this register. In order to raise communication stability,
please be sure that the digital filters are enabled.
If other demodulating circuit is receiving a packet even if reception error (frame error, parity error or check sum error)
occurs in demodulating circuit 1 or demodulating circuit 2 while CTRL is 0, it does not generate an interrupt.
If CTRL bit = 1 and a reception error occurs on demodulator 1 or demodulator 2, BD57020MWV generates an interrupt
signal immediately.
・[7]
CTRL: Setting bit of exclusive control function
・[6]
Reserved
・[5]
FTE2: Setting bit for the digital filter of the demodulator 2
・[4]
FTE1: Setting bit for the digital filter of the demodulator 1
・[3:2]
Reserved
・[1]
PRE2: Setting bit for the demodulator 2
・[0]
PRE1: Setting bit for the demodulator 1
Name
RXCTRL
Address
0x01
b7
b6
CTRL
*1
-
b5
FTE2
b4
b3
b2
b1
b0
FTE1
*1
*1
PRE2
PRE1
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(2) RXSTT: Packet reception status register
This register holds the status of the packet reception of the demodulating circuit. If packet reception with demodulating
circuit 1 is completed normally, RCV1 becomes 1. If packet reception with demodulating circuit 2 is completed normally,
RCV2 becomes 1. If check sum error occurs during the packet reception with demodulating circuit 1 or demodulating
circuit 2, CERR becomes 1. If parity error or framing error occurs during the packet reception with demodulating circuit 1
or demodulating circuit 2, PERR becomes 1.
The factors of the framing error during packet reception are as follows:
・Stop bit is not found.
・Reception was completed in the middle of a byte.
・The packet size that is calculated from the value of the header byte is different from the one that is received.
In addition, RCV1, RCV2, CERR and RERR, latch when packet reception is completed. These are cleared if RINT1,
RINT2, CINT and RINT (INTSTT:0x03) are written 1.These are overwritten when the next packet is received.
When demodulating circuit 1 is receiving packet, BSY1 becomes 1. When demodulating circuit 2 is receiving packet,
BSY2 becomes 1.
・[7]
・[6]
・[5:4]
・[3]
・[2]
・[1]
・[0]
Name
RXSTT
BSY2: In receiving a packet with demodulating circuit 2
BSY1: In receiving a packet with demodulating circuit 1
Reserved
PERR: Parity error or framing error occurs during the packet reception with demodulating circuit 1 or
demodulating circuit 2
CERR: Check sum error occurs during the packet reception with demodulating circuit 1 or demodulating
circuit 2
RCV2: Packet reception is completed with demodulating circuit 2 normally
RCV1: Packet reception is completed with demodulating circuit 1 normally
Address
0x02
b7
b6
b5
b4
b3
b2
b1
b0
BSY2
BSY1
-* 1
-* 1
RERR
CERR
RCV2
RCV1
Initial
Value
0x00
R/W
R
*1 prohibition against writing
(3) CLKDIV:
Register for setting Clock frequency division
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This register sets the fundamental period of the demodulating circuit. This set the fundamental period (CLKDIV) with a
count level. The value of CLKDIV must be set so that Target Clock becomes 16kHz (62.5µsec). CLKDIV is determined
by the following formula:
 SourceClock 
  1
CLKDIV  int 
 TargetClock  2 
“int” means rounding down to the nearest whole number
For example, if Source Clock is 32MHz, CLKDIV set to the following value:
 32000 
CLKDIV  int 
  1  999  0x03E7
 16  2 
Name
Address
CLKDIV1L
0x0C
CLKDIV1H
0x0D
b7
b6
b5
b4
b3
b2
b1
b0
CLK
DIV7
CLK
DIV15
CLK
DIV6
CLK
DIV14
CLK
DIV5
CLK
DIV13
CLK
DIV4
CLK
DIV12
CLK
DIV3
CLK
DIV11
CLK
DIV2
CLK
DIV10
CLK
DIV1
CLK
DIV9
CLK
DIV0
CLK
DIV8
Initial
Value
R/W
0xE7
R/W
0x03
R/W
(4) FLTPRD: Register for setting filter fundamental period
This register appoints the fundamental period of the digital filter. This set the fundamental period (FLTPRD) with a count
level. The value of CLKDIV must be set so that Target Clock becomes 2kHz (500µsec). FLTPRD is determined by the
following formula:
 SourceCloc k 
  1
FLTPRD  round 
 TargetClock 
“round” means rounding off to the nearest whole number
For example, when Source Clock is 32MHz, CLKDIV is set to the following value:
 32000 
FLTPRD  round 
  1  15999  0x3E7F
 2 
Name
AddRess
FLTPRDL
0xA0
FLTPRDH
0xA1
b7
b6
b5
b4
b3
b2
b1
b0
FLT
PRD7
FLT
PRD15
FLT
PRD6
FLT
PRD14
FLT
PRD5
FLT
PRD13
FLT
PRD4
FLT
PRD12
FLT
PRD3
FLT
PRD11
FLT
PRD2
FLT
PRD10
FLT
PRD1
FLT
PRD9
FLT
PRD0
FLT
PRD8
Initial
Value
R/W
0x00
R/W
0x00
R/W
(5) RXSTT_1: Packet reception status register 1
This register holds the packet reception status of demodulating circuit 1.
・[7]
PRE1: In searching the preamble of the packet with demodulating circuit 1
・[6]
BSY1: In receiving a packet with demodulating circuit 1
・[5]
RDN1:Packet reception is completed with demodulating circuit 1
・[4]
ERF1:Framing error occurs during the packet reception with demodulating circuit 1
・[3]
ERP1:Parity error occurs during the packet reception with demodulating circuit 1
・[2]
ERC1:Check sum error occurs during the packet reception with demodulating circuit 1
・[1]
RCV2:Packet reception is completed with demodulating circuit 2 normally
・[0]
RCV1:Packet reception is completed with demodulating circuit 1 normally
Name
RXSTT_1
Address
0x52
b7
b6
b5
b4
b3
b2
b1
b0
PRE1
BSY1
RDN1
ERF1
ERP1
ERC1
RCV2
RCV1
Initial
Value
0x00
R/W
R
(6) RXSTT_2: Packet reception status register 2
This register holds the packet reception status of demodulating circuit 2.
・[7]
PRE2: In searching the preamble of the packet with demodulating circuit 2
・[6]
BSY2: In receiving a packet with demodulating circuit 2
・[5]
RDN2:Packet reception is completed with demodulating circuit 2
・[4]
ERF2:Framing error occurs during the packet reception with demodulating circuit 2
・[3]
ERP2:Parity error occurs during the packet reception with demodulating circuit 2
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BD57020MWV
・[2]
・[1]
・[0]
Name
RXSTT_2
ERC2:Check sum error occurs during the packet reception with demodulating circuit 2
RCV1:Packet reception is completed with demodulating circuit 1 normally
RCV2:Packet reception is completed with demodulating circuit 2 normally
Address
0x53
b7
b6
b5
b4
b3
b2
b1
b0
PRE2
BSY2
RDN2
ERF2
ERP2
ERC2
RCV1
RCV2
Initial
Value
0x00
R/W
R
(7) RXDAT_1: Packet data register 1
This enables to show the data of the packet that is received with demodulating circuit 1. Size of the buffers receiving Qi
packet is 32 bytes. The longest packet prescribed in Qi is 29 bytes (including a header and the check sum byte). So
BD57020MWV receive the packet of all kinds. The buffer to receive Qi packet is one to be 32 bytes, and the packet that
is received is stored by the top of the buffer memory and is overwritten when BD57020MWV receive the next packet.
Name
RXDAT_1
Address
0x60
:
0x7F
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
0x00
R
(8) RXDAT_2: Packet data register 2
This enables to show the data of the packet that is received with demodulating circuit 1. Size of the buffers receiving Qi
packet is 32 bytes. The buffer to receive Qi packet is one to be 32 bytes, and the packet that is received is stored by
the top of the buffer memory and is overwritten when BD57020MWV receive the next packet.
Name
RXDAT_2
7.
Address
0x80
:
0x9F
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
0x00
R
About the input power detection
During wireless power transmission, when a foreign object such as a piece of metal exists on the charge interface between
Tx and Rx, it generates heat, which poses a risk to cause burns and may even damage the Rx. BD57020MWV monitors
the input power to the Tx and finds transmission electricity and detects the existence of the foreign object by comparing the
transmission electricity with the received power electricity information (Received Power Packet) from Rx. BD57020MWV
calculates the input power by monitoring the input voltage and the input current of the Tx.
About the input voltage (ADPV terminal voltage) detection, BD57020MWV can output the voltage of ADPV terminal voltage
×0.1 from MONI1 terminal by the following register setting. In addition, it uses an external current detection amplifier about
the input current detection. From them, the transmission electricity is calculated.
(1) AINSEL: Analog input choice register
By this register, MONI1 terminal outputs the voltage of ADPV terminal voltage ×0.1.
・[7:2]
Reserved
・[1]
AIN1SEL1
(0x2: ADPV terminal voltage)
・[0]
Reserved
Name
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
AINSEL
0x08
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
AIN1
SEL1
-*1
0x00
R/W
*1 prohibition against writing
8.
Low Drop OUT (LDO) block
BD57020MWV is equipped with two LDO blocks. On LDO33A terminal, It is assumed that the power supply of the
microcomputer is connected. Capacitors (0.47 ~ 2.0µF) are necessary between the LDO terminals (LDO33A and LDO33B)
and GND. Please place the capacitors as close to LDO33A and LDO33B terminals as possible.
9.
About a general-purpose terminal (GPIO)
BD57020MWV has four GPIO terminals as a general-purpose terminal. The following register are used to configure the
GPIO terminals.
(1) GPDIR: Input and output direction setting register of the GPIO port
This register sets each GPIO port as an input terminal or output terminal. If set to 1, the port becomes an output
terminal. On the other hand, if set to 0, the port becomes an input terminal.
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Name
GPDIR
Address
0x42
b7
b6
b5
b4
b3
b2
b1
b0
*1
*1
*1
*1
PD3
PD2
PD1
PD0
-
-
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(2) GPIN: Input state confirmation register of the GPIO terminal
This register defines the state of the GPIO port. Only the bit set as an input port in the input and output direction
setting registers of the GPIO port is enabled. When H is input into the port, the corresponded register becomes 1.
When L was input into the port, the corresponded register becomes 0.
Name
GPIN
Address
0x40
b7
b6
b5
b4
b3
b2
b1
b0
*1
*1
*1
*1
PI3
PI2
PI1
PI0
-
-
-
-
Initial
Value
-
R/W
R
*1 prohibition against writing
(3) GPOUT: Output setting register of the GPIO terminal
This register sets an output level to the GPIO port. Only the bit set as an output port in the input and output direction
setting registers of the GPIO port is enabled. When the register is 1, the corresponded port outputs H. When the
register is 0, the corresponded port outputs L.
Name
GPOUT
Address
0x41
b7
b6
b5
b4
b3
b2
b1
b0
*1
*1
*1
*1
PO3
PO2
PO1
PO0
-
-
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(4) GPPU: The pull-up resistance of GPIO port setting register
This register sets the pull-up resistance of each GPIO port. If set to 1, the resistance connected to VDD power supply is
enabled. If set to 0, it is disabled.
Name
GPPU
Address
0x43
b7
b6
b5
b4
b3
b2
b1
b0
*1
*1
*1
*1
PPU3
PPU2
PPU1
PPU0
-
-
-
-
Initial
Value
0x00
R/W
R/W
*1 prohibition against writing
(5) GPPD: The pull-down resistance of GPIO port setting register
This register sets the pull-down resistance of each GPIO port. If set to 1, the resistance connected to GND is enabled. If
set to 0, it is disabled. The initial value of this register is 0x0F, and the pull-down resistance is enabled.
Name
GPPD
Address
0x44
b7
b6
b5
b4
b3
b2
b1
b0
-* 1
-* 1
-* 1
-* 1
PPD3
PPD2
PPD1
PPD0
Initial
Value
0x0F
R/W
R/W
*1 prohibition against writing
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BD57020MWV
10. Protective circuit
BD57020MWV has the following functions as a protection feature.
Protection
name
Detection
terminal
Detection condition
Resolutive
condition
OVLO_VIN
VIN
VIN > 6.4V
VIN <6.2V
System hung
UVLO_VIN
VIN
VIN <3.4V
VIN > 3.6V
System hung
Internal OCP
VIN
ICC > IOCP = 0.48A
External OCP
ADPV
ADPI
ADPV - ADPI > VOCP
= 160mV
UVLO_ADPV
ADPV
VIN <4.3V
VIN > 4.5V
Pre-driver block stop (
LSIDE = H, HSIDE = L
UVLO_VDD
VDD
VDD <2.5V
VDD > 2.8V
Power-on reset cancellation
RESETB = L
UVLO_VDDIO
VDDIO
VDDIO <2.5V
VDDIO > 2.8V
Protection type
ICC <IOCP =
0.48A
ADPV - ADPI
<160mV
And
Note 1
Register (
)
0xB1 = 0x08 *
System hung
Pre-driver block stop
The LSIDE = HSIDE = L output
Note 2
)
IO block Disable
(Note1) It is necessary to reset it from a register to cancel external overcurrent protection. It can reset external overcurrent protection by writing in 0x08 at
address 0xB1. However, please set 0 by all means because this register does not automatically return to 0 after setting it to 0x08.
(Note2) BD57020MWV can mask the pre-driver block stop even if it detects UVLO_ADPV depending on the register setting.
(1) ERR_MODE: Error mode setting register in UVLO_ADPV
This register configures the error mode in UVLO_ADPV. If ERR_SEL = 1, the pre-driver block works regardless of UVLO_ADPV.
pre-driver block stops if it detects UVLO_ADPV.
If ERR_SEL = 0, the
Name
AddRess
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
ERR_MODE
0xC4
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
ERR_
SEL
-* 1
0x00
R/W
*I am prohibited from 1 note
About External OCP movement
BD57020MWV monitors the input current to the Tx. If there is an excessive flow of electric current, it will stop the operation
of the pre-driver block. Then, LSIDE1 (LSIDE2) terminal and the
HSIDE1 (HSIDE2) terminal become the L output.
Adapter
The relation of current limit ILIM and the current sense resistor RS, is
Voltage
RS
determined by the following formula:
I LIM 
VOCP
[A]
RS
ADPV
ADPI
In this formula, VOCP is the OCP detecting voltage.
For example, ILIM becomes 1.6A if RS=100mΩ and VOCP=160mV (typ).
The value of RS is between 30 ~ 47mΩ when Adapter Voltage is 5V. And
the value of RS is between 30 ~ 100mΩ when Adapter Voltage is 12V or
19V. Please be careful enough on the occasion of the value setting with
the set.
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Figure 5. The input current detection
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BD57020MWV
11. Command interface
11-1.Command Interface
I2C bus method is used in command interface with host CPU on BD57020MWV.
In BD57020MWV, not only writing but read-out is possible except for some registers.
Besides the slave address in BD57020MWV, one byte select address can be Specified, written and readout.
The format of I2C bus slave mode is shown below.
The slave address of BD57020MWV is 0x44 (7Bit) while ADDR terminal input is L. It is 0x45 (7Bit) while ADDR terminal
input is H.
S
MSB
LSB
Slave Address
S:
Slave Address:
A:
Select Address:
Data:
P:
A
MSB
LSB
Select Address
MSB
A Data
LSB
A
P
Start condition
Putting up the bit of read mode (H") or write mode (L") after slave address (7bit) set with ADDR, the data
of eight bits in total will be sent. (MSB first)
The acknowledge bit in each byte adds into the data when acknowledge is sent and received. When data
is correctly sent and received, "L" will be sent and received. There was no acknowledge for "H".
1 byte select address is used in BD57020MWV. (MSB first)
Data byte, data (the MSB first) sent and received
Stop Condition
MSB
SDA
6
5
LSB
SCL
Start Condition
When SDA↓, SCL=”H”
Stop Condition
When SDA↑, SCL=”H”
Figure 6. Command Interface
SDA
SCL
S
Sr
Start Condition
Repeated Start
Condition
Figure 7. Repeated Start Condition
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11-2.Data Format
Write format
b7
b6
S
b5
b4
b3
b2
b1
Slave Address
(7bit)
b0
Start Condition
b7
A
C
K
R
/W
b6
b5
b4
b3
b2
b1
b0
Select Address
(8bit)
Acknowledge from
slave device
'0' Write
A
C
K
b7
b6
b5
b4
b3
b2
b1
b0
Write Data
(8bit)
Acknowledge from
slave device
Acknowledge from
slave device
A
C
K
P
Stop Condition
Figure 8. Write Data Format
Read format
b7
b6
S
b5
b4
b3
b2
b1
Slave Address
(7bit)
b0
Start Condition
b7
A
C
K
R
/W
b6
b5
b4
b3
b2
b1
b0
Read Data
(8bit)
Acknowledge from
slave device
'1' Read
A
C
K
b7
b6
b5
b4
b3
b2
b1
b0
Read Data
(8bit)
Acknowledge from
master device
Non acknowledge
from master device
N
A
K
P
Stop Condition
Figure 9. Read Data Format
Read Data from specified Select Address
b7
b6
S
b5
b4
b3
b2
b1
Slave Address
(7bit)
b0
A
C
K
R
/W
b7
b6
b5
b4
b3
b2
b1
b0
b7
A
C
K
Select Address
(8bit)
b6
Sr
b5
b4
b3
b2
b1
b0
Slave Address
(7bit)
A
C
K
R
/W
b7
b6
b5
b4
b3
b2
b1
b0
Read Data
N
A
C
P
N
A
C
P
Read Data from Select Address
'0' Write
Repeated Start Condition
'1' Read
Figure 10. Read Data from specified Select Address (1)
b7
S
b6
b5
b4
b3
Slave Address
(7bit)
b2
b1
b0
R
/W
A
C
K
b7
b6
b5
b4
b3
b2
Select Address
(8bit)
b1
b0
A
C
K
b7
P
S
b6
b5
b4
b3
Slave Address
(7bit)
b2
b1
b0
A
C
K
R
/W
b7
b6
b5
b4
b3
b2
b1
b0
Read Data
Read Data from Select Address
'0' Read
'1' Read
Figure 11. Read Data from specified Select Address (2)
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11-3. Control signal specifications
○Bus line, I/O stage electrical specification and timing
SDA
t
BUF
t
t
LO W
t
t
F
HDSTA
R
SCL
t
P
HDSTA
t
t
HDDAT
H IG H
t
t
SUDAT
t
SUSTA
S
SUSTO
Sr
P
Figure 12. Timing chart
Table 11-1. SDAI and SCLI bus-line characteristic
(Unless specified, Ta = 25 degrees Celsius, VDD=3.3V)
Parameter
1
2
Sign
SCL clock frequency
Bus free time between a "stop" condition and "start"
conditions
Draft mode
Unit
Min.
Max.
fSCL
0
400
kHz
tBUF
1.3
-
μs
tHDSTA
0.6
-
μs
It is a "start" condition (retransmission) in hold time.
3
After this period,
The first clock pulse is generated.
4
LOW state hold time of the SCL clock
tLOW
1.3
-
μs
5
HIGH state hold time of the SCL clock
tHIGH
0.6
-
μs
6
Setup time of the retransmission "start" condition
tSUSTA
0.6
-
μs
Note1)
-
μs
7
Data hold time
tHDDAT
0
8
Data setup time
tSUDAT
100
-
ns
9
Rise time of SDA and the SCL traffic light
tR
20+0.1Cb
300
ns
10
Fall time for SDA and SCL signaling
tF
20+0.1Cb
300
ns
11
Setup time of the "stop" condition
tSUSTO
0.6
-
μs
12
Capacitive load of each bus line
Cb
-
400
pF
The above-mentioned numerical values are all the values corresponding to VIH min and VIL max level.
Note1) To exceed an undefined area on falling edged of SCLI, transmission device should internally offer the hold-time of 300ns or more for SDAI signal
(VIH min of SCLI signal).
The above-mentioned characteristic is a theory value in IC design and it doesn't be guaranteed by shipment inspection.
When problem occurs by any chance, we talk in good faith and correspond .
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11-4. List of registers
Address
0x00
0x01
0x02
0x03
0x04
0x05
:
0x07
b7
b6
b5
b4
b3
b2
b1
b0
DID7
CTRL
BSY2
-* 1
PXIEN
DID6
-* 1
BSY1
APINT
APIEN
DID5
FTE2
-* 1
-* 1
-* 1
DID4
FTE1
-* 1
AGINT
AGIEN
DID3
-* 1
RERR
RINT
RIEN
DID2
-* 1
CERR
CINT
CIEN
DID1
PRE2
RCV2
RINT2
RIEN2
DID0
PRE1
RCV1
RINT1
RIEN1
Initial
Value
0x15
0x00
0x00
0x00
0x00
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
AINSEL
0x08
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
AIN1
SEL1
-* 1
0x00
R/W
Reserved
0x09
:
0x0B
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
CLKDIV1L
0x0C
CLK
DIV3
CLK
DIV11
-* 1
-* 1
CLK
DIV2
CLK
DIV10
-* 1
OSCSEL
CLK
DIV1
CLK
DIV9
-* 1
TCXEN
CLK
DIV0
CLK
DIV8
-* 1
TCXSEL
R/W
0x0E
0x0F
0x10
:
0x11
CLK
DIV4
CLK
DIV12
-* 1
PWMD0
0x03
Reserved
PWRCTRL
CLK
DIV5
CLK
DIV13
-* 1
PWMD1
R/W
0x0D
CLK
DIV6
CLK
DIV14
-* 1
-* 1
0xE7
CLKDIV1H
CLK
DIV7
CLK
DIV15
-* 1
-* 1
0x07
-* 1
R/W
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
-* 1
-* 1
-* 1
PWM1
EN
-* 1
PS256
PSWEN
PDEN
0x00
R/W
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
APEN
-* 1
APG
ITV7
APG
ITV15
APG
DUR7
-* 1
APSTA2
APG
ITV6
APG
ITV14
APG
DUR6
-* 1
APSTA1
APG
ITV5
APG
ITV13
APG
DUR5
-* 1
APSTA0
APG
ITV4
APG
ITV12
APG
DUR4
R/W
0x00
R/W
0x00
R/W
-* 1
0x00
R/W
APG
MSR7
APGMS
R15
APG
CNT7
-* 1
PWM0
PRD7
PWM0
PRD15
PWM0
DTY7
PWM0
DTY15
PWM1
PHS7
PWM1
PHS15
PWMX
PRD7
PWMX
PRD15
PWMX
DTY7
PWMX
DTY15
APG
MSR6
APGMS
R14
APG
CNT6
-* 1
PWM0
PRD6
PWM0
PRD14
PWM0
DTY6
PWM0
DTY14
PWM1
PHS6
PWM1
PHS14
PWMX
PRD6
PWMX
PRD14
PWMX
DTY6
PWMX
DTY14
APG
MSR5
APGMS
R13
APG
CNT5
-* 1
PWM0
PRD5
PWM0
PRD13
PWM0
DTY5
PWM0
DTY13
PWM1
PHS5
PWM1
PHS13
PWMX
PRD5
PWMX
PRD13
PWMX
DTY5
PWMX
DTY13
APG
MSR4
APGMS
R12
APG
CNT4
-* 1
PWM0
PRD4
PWM0
PRD12
PWM0
DTY4
PWM0
DTY12
PWM1
PHS4
PWM1
PHS12
PWMX
PRD4
PWMX
PRD12
PWMX
DTY4
PWMX
DTY12
APEX0
-* 1
APG
ITV0
APG
ITV8
APG
DUR0
APG
DUR7
APG
MSR0
APGMS
R8
APG
CNT0
-* 1
PWM0
PRD0
PWM0
PRD8
PWM0
DTY0
PWM0
DTY8
PWM1
PHS0
PWM1
PHS8
PWMX
PRD0
PWMX
PRD8
PWMX
DTY0
PWMX
DTY8
0x00
-* 1
APEX1
-* 1
APG
ITV1
APG
ITV9
APG
DUR1
APG
DUR8
APG
MSR1
APGMS
R9
APG
CNT1
-* 1
PWM0
PRD1
PWM0
PRD9
PWM0
DTY1
PWM0
DTY9
PWM1
PHS1
PWM1
PHS9
PWMX
PRD1
PWMX
PRD9
PWMX
DTY1
PWMX
DTY9
R/W
R/W
-* 1
-* 1
-* 1
APG
ITV2
APG
ITV10
APG
DUR2
APG
DUR9
APG
MSR2
APGMS
R10
APG
CNT2
-* 1
PWM0
PRD2
PWM0
PRD10
PWM0
DTY2
PWM0
DTY10
PWM1
PHS2
PWM1
PHS10
PWMX
PRD2
PWMX
PRD10
PWMX
DTY2
PWMX
DTY10
0x00
0x00
-* 1
-* 1
-* 1
APG
ITV3
APG
ITV11
APG
DUR3
APG
DUR11
APG
MSR3
APGMS
R11
APG
CNT3
-* 1
PWM0
PRD3
PWM0
PRD11
PWM0
DTY3
PWM0
DTY11
PWM1
PHS3
PWM1
PHS11
PWMX
PRD3
PWMX
PRD11
PWMX
DTY3
PWMX
DTY11
0x00
R/W
0x00
R/W
0x00
R/W
-
-* 1
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
0x00
R/W
Name
IDENT
RXCTRL
RXSTT
INTSTT
INTENB
Reserved
Reserved
PDCTRL0
0x12
APGCTRL
APGSTT
0x13
:
0x15
0x16
0x17
APGITVL
0x18
APGITVH
0x19
APGDURL
0x1A
APGDURH
0x1B
Reserved
R/W
R
R/W
R
R/W
R/W
APGMSRL
0x1C
APGMSRH
0x1D
APGCNT
0x1E
Reserved
0x1F
PWM0PRDL
0x20
PWM0PRDH
0x21
PWM0DTYL
0x22
PWM0DTYH
0x23
PWM1PHSL
0x24
PWM1PHSH
0x25
PWMXPRDL
0x26
PWMXPRDH
0x27
PWMXDTYL
0x28
PWMXDTYH
0x29
Reserved
0x2A
:
0x2F
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
PWMGEN0
0x30
P0DLY
D1
P0DLY
D0
P0DLY
C2
P0DLY
C1
P0DLY
C0
P0DLY
B2
P0DLY
B1
P0DLY
B0
0x92
R/W
*1 prohibition against writing
*0x in the head of for each characters means a hex digit.
If there is nothing, it means decimal numeral
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TSZ22111 • 15 • 001
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TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
Name
PWMGEN1
Reserved
GPIN
GPOUT
GPDIR
GPPU
GPPD
Reserved
Address
b7
b6
b5
b4
b3
b2
b1
b0
Initial
Value
R/W
0x31
P1DLY
D1
P1DLY
D0
P1DLY
C2
P1DLY
C1
P1DLY
C0
P1DLY
B2
P1DLY
B1
P1DLY
B0
0x92
R/W
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
PI3
PO3
PD3
PPU3
PPD3
PI2
PO2
PD2
PPU2
PPD2
PI1
PO1
PD1
PPU1
PPD1
PI0
PO0
PD0
PPU0
PPD0
0x00
0x00
0x00
0xFF
R
R/W
R/W
R/W
R/W
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
RX1
CNT2
RX2
CNT2
ERC1
ERC2
RX1
CNT1
RX2
CNT1
RCV2
RCV2
RX1
CNT0
RX2
CNT0
RCV1
RCV1
0x00
R/W
0x00
R/W
0x00
0x00
R
R
-* 1
-* 1
-* 1
-
-* 1
0x00
R
0x00
R
0x00
R/W
0x00
R/W
-* 1
0x32
:
0x3F
0x40
0x41
0x42
0x43
0x44
0x45
:
0x4F
RXCNT_1
0x50
-* 1
-* 1
-* 1
-* 1
RXCNT_2
0x51
-* 1
-* 1
-* 1
-* 1
RXSTT_1
RXSTT_2
0x52
0x53
0x54
:
0x5F
0x60
:
0x7F
0x80
:
0x9F
PRE1
PRE2
BSY1
BSY2
RDN1
RDN2
ERF1
ERF2
RX1
CNT3
RX2
CNT3
ERP1
ERP2
-* 1
-* 1
-* 1
-* 1
-* 1
Reserved
RXDAT_1
RXDAT_2
FLTPRDL
0xA0
FLTPRDH
0xA1
Reserved
ANA_STAT
ANA_ERR_
CLR
0xA2
:
0xAF
0xB0
FLT
PRD7
FLT
PRD15
FLT
PRD6
FLT
PRD14
FLT
PRD5
FLT
PRD13
FLT
PRD4
FLT
PRD12
FLT
PRD3
FLT
PRD11
FLT
PRD2
FLT
PRD10
FLT
PRD1
FLT
PRD9
FLT
PRD0
FLT
PRD8
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
0x02
R
*1
*1
*1
OCP
OCP
ERCL
-* 1
*1
*1
-
*1
-
-* 1
0x00
R/W
0xB1
-
-
-
-
Reserved
0xB2
:
0xC3
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
ERR_MODE
0xC4
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
ERR_
SEL
-* 1
0x00
R/W
Reserved
0xC5
:
0xFF
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-* 1
-
-* 1
*1 prohibition against writing
*0x in the head of for each characters means a hex digit.
If there is nothing, it means decimal numeral
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/35
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
Typical Performance Curves
2.40
16.0
Input Current Icc2 [mA]
Input Current Icc1 [mA]
2.20
2.00
1.80
1.60
1.40
15.0
14.0
13.0
12.0
-20
0
20
40
Temp [℃]
60
80
-20
20
40
Temp [℃]
60
80
Figure 14. ICC2 [mA] vs. Temp. [°C]
(TCXOIN CLK = 32MHZ)
3.60
3.60
3.50
3.50
Output Voltage VLDO33A [V]
Output Voltage VLDO33A [V]
Figure 13. ICC1 [mA] vs. Temp. [°C]
(TCXOIN CLK = 0kHz)
0
3.40
3.30
3.20
3.10
3.40
3.30
3.20
3.10
3.00
3.00
-20
0
20
40
Temp. [℃]
60
80
0
Figure 15. Output Voltage VLDO33A [V] vs. Temp. [°C]
(Output Current = 0mA)
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10
20
30
Output Current [mA]
40
Figure 16. Output Voltage VLDO33A [V] vs
Output current [mA]
(Temp. = 25°C)
23/35
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
- continued
80
90
70
80
70
60
System Efficiency [%]
System Efficiency [%]
Typical Performance Curves
50
40
30
60
50
40
30
20
20
10
10
0
0
0.0
1.0
2.0
3.0
4.0
Rx Output Power [W]
0.0
5.0
2.0
4.0
6.0
8.0
Rx Output Power [W]
10.0
Figure 17-2. System Efficiency [%] vs Rx Output Power [W]
(Rx=BD57015GWL,Vout=10V)
Figure 17-1. System Efficiency [%] vs Rx Output Power [W]
(Rx=BD57011GWL,Vout=5V)
Timing Chart
19V
ADPV
5V
VIN
3.3V
LDO33A
3.3V
LDO33B
TCXOEN
・・・
・・・
・・・
・・・
・・・
LSIDE1
・・・
・・・
・・・
・・・
・・・
Analog Ping
100 usec
Min = 1msec
Digital Ping
70msec
Figure 18. Start up sequence
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
Application Example
1) Recommended Circuit Diagram
RVIN2
RTVIN
U4
INA199A1
RVIN3
RVIN1
1 REF
OUT 6
RSOUT
3.3V
M9
PGND
DTVIN
CADP4
VADPV
3
IN+ 4
MONI0_PA0
CSOUT
RSIN-
CSIN
V+
RSIN+
RS1
PGND
GND
M1
IN-
CPA2
PGND PGND
CADP3
RS2
RPPH
GNDADPV
CADP1
CVIN1
M8
RGPU
DCHCTRL
GND
GND
GND
M7
M6
GND
RGPD
40
3.3V
1
CV33B
2 LDO33B
3 LDO33A
CV33A
M5
GND
CQOUT1
RQOUT1
1
IN+
VDD 5
GND 3
IN-
OUT 4
GND
7
TCXOIN
GND GND
CPA
2 VSS
GND
RREFL2
6
RQOUT2
TG_GPIO0
RTCXOUT
GND
ROSC
OSC
COSC1
8
TG_GPIO1
9
TG_GPIO2
10
COSC2
SW2
TCXOOUT
BOOT2
GPIO2
RL2
MOS_L1
GND
RLD2
CCOILV
LSIDE2
25
PGND
HSIDE2
3.3V
24
CBOOT2
23
22
TEST
COIL_IN 21
RVDH
RVDL
RVDL2
3.3V
PGND
M10
RSCL
RCOILIN_CPO
RSDA
PGND
CSCL
CSDA
JP5
JP6
GND
3.3VB
PGND
GND
LED3
1
PD1
PB0
4
PA0
25
27
28
29
30
26
PC6
PC1
PC5
PC4
31
PD0
PC0
13
12
9
3.3VB
GND
19
18
17
PWRPATH_EN_GPO
14 PC2
15
PD5
16
PA1
PB4
PD4
PA2
PD3
8
PB5
PC3
PB6
PB3
PD2
PB2
For Debugger
C8
NC20
7
TESTF
GND
6
PB1
C2
VSS 21
20
U2
ML610Q772
NC4
11
RCOILIN_GPO
GND
24
PB7
23
PC7
VDD 22
10
R8
RESET_N
TEST
VPP
CAIN0
TEST
2
3
5
RX-D
RESET_N
32
DCHCTRL
MONI0_PA0
RLED3
GND
CAIN1
LED2
LED1
RLED2
RLED1
MONI1-PA1
C4
SLDO_EN_GPO
GND
Changing the software may cause the changing the circuit diagram.
Figure 19. Typical application circuit diagram
2) Parts list
Parts Name
Tx Coil
LTX
IC
U1
U2
U3
U4
OSC
FET/Tr
MOS_H2, MOS_L2
MOS_H1, MOS_L1, M7
M1
M2, M4, M6, M8, M10
M3, M5, M9
Diode/LED
DVQ
DTVIN
LED1, LED2, LED3, LED4
Recommended Value
Unit
24
µH
32
MHz
10
10
-7
0.2
2
6.8
6.2
VF<2.0V
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Recommended Part
Maker
Number
760 308 110
Würth
1
BD57020MWV
ML610Q772
BU7241G
INA199A1
NX3225GA
ROHM
LAPIS
ROHM
TI
NDK
1
1
1
1
1
A
A
A
A
A
RQ3E100GN
RQ3E100GN
RQ1E070RP
RUE002N02
RUR020N02
ROHM
ROHM
ROHM
ROHM
ROHM
2
3
1
5
3
V
V
-
EDZTE616.8B
EDZTE616.2B
SML-P11MT
ROHM
ROHM
ROHM
1
1
4
25/35
RCLMP
GND
* Thermal Pad is connected to the GND.
GND
GND
TG_GPIO3
GND
MOS_L2
LSIDE2
RLD1
M4
GND
MOS_H2
RHD2
LTX2
RL1
LSIDE2
GPIO1
RH2
HSIDE2
HSIDE2
GPIO0
MOS_H1
30
PGND 27
26
U1
BD57020MWV
TCXOIN
GPIO3
RREFH
4 VDD
5 TCXOEN
CQOUT2
RH1
HSIDE1 29
LSIDE1 28
CLKSET
5V
U3
BU7241G
11
3.3V
CBOOT1
RHD1
SW1
FSKIN
16 SCL
17
SDA
18
INTB
19
RESETB
20
AGND
GND
OVPIN
15
RQIN2
14
RQIN1
VDDIO
RQPD
GND
RREFL1
REFGND
3.3VB
GND
CLKIN
GND
ADPV 39
38
ADPI
37
MONI1
36
MONI0
35
VIN
34
VIN
33
OVPOUT
32
ADD
31
BOOT1
GND
M3
DVQ
LTX1
CS3
CDC2
12
RVQ2
LED4
CDC1
RLED4
RDCH
MONI1-PA1
PWRPATH_EN_GPO
RVQ1
GND
CS2
GND
SLDO_EN_GPO
RPPEN
GND
CS1
5V
M2
RTVQ
CADP2
RPPG
GND PGND
13
COM-CH
PGND
5
2 GND
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
CCLMP
BD57020MWV
Parts Name
Coil/Trans
COM_CH
Capacitor
CADP1
CADP2
CADP3
CADP4
CS1
CS2
CS3
CVIN1
CBOOT1, CBOOT2
CDC1, CDC2
CV33B
CV33A
CSCL
CSDA
CAIN0
CAIN1
CCOILV
CCLMP
CPA
CPA2
CSIN
CSOUT
CQOUT1
CQOUT2
COSC1, COSC2
C2
C4
C8
Resistor
RS1, RS2
RTCXOUT
RH1, RH2
RHD1, RHD2
RL1, RL2
RLD1, RLD2
RTVIN
RVIN1, RVIN2, RVIN3
RDCH
RSCL
RSDA
RLED1, RLED2, RLED3
RLED4
RPPH
RPPEN
RPPG
RTVQ
RVQ1, RVQ2
RQPD
RGPD
Recommended Value
Unit
Recommended Part
Maker
Number
-
ohm
-
-
SHORT
0.1
10
10
22
0.033
0.033
0.033
1
0.22
10
1
1
10
0.1
0.01
1000
0.01
0.01
0.1
47
1
1
4700
2200
µF
µF
µF
µF
µF
µF
µF
µF
µF
µF
µF
µF
pF
F
µF
µF
pF
F
µF
µF
µF
F
µF
µF
F
µF
pF
pF
GRM32D7U2E333JW31
GRM32D7U2E333JW31
GRM32D7U2E333JW31
GRM21A7U2E102JW31
-
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
100
1
20
2
20
100
680
1
1.5
3.3
1.5
3
100
100
100
100
47
100
100
mΩ
MΩ
Ω
MΩ
Ω
Ω
kΩ
Ω
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
Ω
kΩ
kΩ
-
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
26/35
1
1
1
1
1
1
1
1
1
2
1
1
1
OPEN
1
1
1
OPEN
1
1
1
OPEN
1
1
OPEN
1
1
1
2
1
2
2
2
OPEN
1
3
1
1
1
3
1
1
1
1
1
2
1
1
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
Parts Name
RGPU
RQIN1, RQIN2
RQOUT1
RQOUT2
RREFH
RREFL1
RREFL2
ROSC
RVDH
RVDL
RVDL2
RCLMP
RSINRSIN+
RSOUT
R8
Recommended Value
10
12
2
200
100
1
4.7
33
6.2
6.2
1
1
1
36
Unit
kΩ
Ω
kΩ
kΩ
kΩ
MΩ
kΩ
Ω
kΩ
kΩ
kΩ
Ω
Ω
Ω
kΩ
kΩ
Recommended Part
MCR10EZHF333
-
Maker
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
Number
1
2
1
1
1
1
1
SHORT
1
1
1
OPEN
1
1
1
1
3) Selection of Components Externally Connected
Component
Symbol
Limit
Unit
CBOOT1, CBOOT2
0.1 to 0.47
µF
CV33A, CV33B
0.47 to 2.0
µF
L Side FET gate resistance
RL1, RL2
1.0 to 30
Ω
H Side FET gate resistance
RH1, RH2
1.0 to 30
Ω
Input current sense resistance
RS
30 to 100
mΩ
BOOT1 (2) terminal strapping
capacity
LDO33A (B) terminal
strapping capacity
About the above operating condition, it is the value in the IC only. Please be careful enough on the occasion of the value setting with the set.
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TSZ22111 • 15 • 001
27/35
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
Power Dissipation
(UQFN040V5050 Package)
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
3.5
3.26W
POWER DISSIPATION : Pd [W]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
AMBIENT TEMPERATURE : Ta [°C]
125
150
* 74.2mm x 74.2mm x 1.6mm Glass Epoxy Board
(front and back layer heat radiation copper foil 4.5 mm x 4.5 mm,
second and third layer heat radiation copper foil 74.2 mm x 74.2 mm)
Figure 20. Power Dissipation Curve (Pd-Ta Curve)
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TSZ22111 • 15 • 001
28/35
TSZ02201-0F2F0AK00130-1-2
25.Mar.2016 Rev.003
BD57020MWV
I/O equivalent circuits
VIN, OVPOUT terminal
BOOT1, HSIDE1, SW1, LSIDE1, PGND terminal
(BOOT2, HSIDE2, SW2, LSIDE2)
OVPOUT
VIN
BOOT1 (2)
OVPOUT
HSIDE1 (2)
SW1 (2)
LSIDE1 (2)
PGND
OVPIN, LDO33A (LDO33B) terminal
VDD,TCXOIN, TCXOOUT terminal
VDD
VDD
VDD
OVPIN
TCXOIN
LDO33A(B)
VDD
TCXOOUT
TCXOEN terminal
VDD
VDDIO,
FSKIN (CLKSET, CLKIN, ADDR, TEST) terminal
VDDIO
VDDIO
TCXOEN
CLKIN
CLKSET
FSKIN
ADDR
TEST
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GPIO0 (GPIO1, 2, 3) terminal
VDD
SCL terminal
SDA terminal
VDDIO
VDDIO
VDD
VDD
GPIO0
GPIO1
GPIO2
GPIO3
INTB terminal
SDA
SCL
VDD
MONI0 terminal
INTB
RESETB terminal
VDD
VDD
MONI0
COIL_IN terminal
VDD
RESETB
ADPV, ADPI terminal
ADPV
ADPI
COIL_IN
MONI1 terminal
MONI1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 21. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B
D
5
7
0
2
0
Part Number
M
W
V
-
Package
MWV: UQFN040V5050
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
UQFN040V5050 (TOP VIEW)
Part Number Marking
D57020
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
Revision
27.Jul.2015
001
10.Aug.2015
002
25.Mar.2016
003
Changes
New Release
P1 Figure2.
Deleted the line.
P2 Recommended Operating Conditions
VADPV Min = 4.8V
→VADPV Min = 4.6V
P5 Pin Description MONI1
Input voltage value and input current value output.
→Input voltage value
P15 About the input power detection
Changed the paragraphs.
P25 Figure19.
Circuit diagram modified.
P25 to P27 Parts list
Parts list modified.
P1
Figure 1.
Modified the figure.
P3
Electrical Characteristics
Corrected the font of unit.
P7
1. Pre-driver block
Changed the sentence.
Corrected the font of unit.
P11
(4) APGDUR
Corrected the font of unit.
P12
(5) APGMSR
Corrected the font of unit.
P13
(1) RXCTRL
Changed the sentence.
P14
(3) CLKDIV
Corrected the font of unit.
(4) FLTPRD
Corrected the font of unit.
P17
About External OCP movement
Changed the sentence.
P24
Typical Performance Curves
Changed a name of the efficiency data.
Figure 17.
→ Figure 17-1.
Added to the efficiency data. Figure 17-2.
P25
1) Recommended Circuit Diagram
Modified the circuit diagram.
P25 to P27
2) Parts list
Modified the parts list.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001