CS 33 www.vishay.com Vishay Sfernice Wirebondable Dual Value Thin Film Chip Resistor Networks, Center Tap (High Ohmic Value) FEATURES • • • • • • Actual Size Chromium silicon thin film is very well suited to produce high density and high ohmic value resistor chips. Performances and sizes are greatly improved compared to Thick Film counterparts. The center tap configuration offers a greater flexibility for hybrid layout design. Center tap feature Small size 30 mil x 30 mil Very high ohmic values (up to 10 M) Aluminum or gold terminations Wirebondable Good stability 0.1 % (2000 h, rated power, at + 70 °C) • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 SCHEMATIC RT R1 R2 RT = R1 + R2 with R1 = R2 Standard STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RESISTANCE RANGE (1) POWER RATING P70 °C W ABSOLUTE TOLERANCE ±% RATIO TOLERANCE ±% ABSOLUTE TCR (2) ± ppm/°C RATIO TCR ± ppm/°C CS 33 0303 10K to 10M 0.125 0.5, 1, 2 0.5 50, 100 5 Notes (1) (R = R + R ) T 1 2 (2) ± 100 ppm/°C, ± 50 ppm/°C on request at - 55 °C to + 155 °C PERFORMANCES TEST SPECIFICATIONS Ohmic value: Ratio Stability Voltage coefficient Limiting voltage Noise Thermal EMF Shelf life stability 1/1 standard (unequal values: please consult) ± 0.1 % typical, ± 0.2 maximum 0.1 ppm/V 100 VDC on RT < - 20 dB typical < 0.01 μV/°C 200 ppm CONDITIONS 2000 h at + 70 °C under Pn MIL-STD-202 method 308 1 year at + 25 °C Rated Power in % DERATING CLIMATIC SPECIFICATIONS 100 Operating temperature range - 55 °C to + 155 °C Storage temperature range - 55 °C to + 155 °C 80 60 40 20 0 0 25 50 75 100 125 150 175 Ambient Temperature in °C Revision: 26-Mar-13 Document Number: 60067 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CS 33 www.vishay.com Vishay Sfernice DIMENSIONS DIMENSION B Bonding Pad Area D A INCHES MILLIMETERS A 0.033 ± 0.004 0.855 ± 0.10 B 0.033 ± 0.004 0.855 ± 0.10 C 0.01 to 0.015 0.25 to 0.40 D 0.006 0.15 E 0.004 0.10 F 0.006 0.15 E C F MECHANICAL SPECIFICATIONS Resistive element Chromium silicon Passivation Silicone nitride Substrate material Silicon (consult vishay for Al2O3) Bonding pads Aluminum or gold GLOBAL PART NUMBER INFORMATION New Global Part Numbering: CS33-100KF1MD0099 C S 3 GLOBAL MODEL 3 - R1 VALUE Decimal R, K, or M Revision: 26-Mar-13 1 0 ABS. TOLERANCE D = ± 0.5 % F = ± 1.0 % G = ± 2.0 % 0 K F R2 VALUE Decimal R, K, or M 1 M RAT. TOLERANCE D = ± 0.5 % D 0 0 9 TERMINATIONS OPTION Blank = Aluminum G = Gold Leave blank if no option 9 Document Number: 60067 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000