VEMT4700 Datasheet

VEMT4700
Vishay Semiconductors
Silicon NPN Phototransistor
FEATURES
• Package type: surface mount
• Package form: PLCC-3
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible and near infrared radiation
• Fast response times
• Angle of half sensitivity: ϕ = ± 60°
94 8554
• Base terminal connected
• Package notch indicates collector
• Package matched with IR emitter series VSML3710
DESCRIPTION
• Floor life: 168 h, MSL 3, acc. J-STD-020
VEMT4700 is a high speed silicon NPN epitaxial planar
phototransistor in a miniature PLCC-3 package for surface
mounting on printed boards. The device is sensitive to
visible and near infrared radiation.
• Lead (Pb)-free reflow soldering
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
• Photo interrupters
• Miniature switches
• Counters
• Encoders
• Position sensors
• Light sensors
PRODUCT SUMMARY
COMPONENT
VEMT4700
Ica (mA)
ϕ (deg)
λ0.1 (nm)
0.5
± 60
450 to 1080
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VEMT4700-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-3
VEMT4700-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-3
Note
• MOQ: minimum order quantity
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902
Document Number: 81501
Rev. 1.4, 14-Jul-10
For technical questions, contact: [email protected]
www.vishay.com
1
VEMT4700
Vishay Semiconductors
Silicon NPN Phototransistor
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Collector emitter voltage
VCEO
70
V
Emitter collector voltage
VECO
5
V
IC
50
mA
ICM
100
mA
PV
100
mW
Collector current
tp/T ≤ 0.1, tp ≤ 10 μs
Collector peak current
Power dissipation
Junction temperature
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
Acc. reflow solder profile fig. 10
Tsd
260
°C
Soldered on PCB with pad dimensions: 4 mm x 4 mm
RthJA
400
K/W
Soldering temperature
Thermal resistance junction/ambient
PV - Power Dissipation Limit (mW)
125
R thJA = 400 K/W
100
75
50
25
0
0
10 20 30 40 50 60 70 80 90 100
20376
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
TEST CONDITION
SYMBOL
MIN.
Collector emitter breakdown
voltage
PARAMETER
IC = 1 mA
V(BR)CEO
70
Collector emitter dark current
VCE = 20 V, E = 0
ICEO
VCE = 5 V, f = 1 MHz, E = 0
CCEO
Ee = 1 mW/cm2, λ = 950 nm, VCE = 5 V
Ica
Collector emitter capacitance
Collector light current
TYP.
MAX.
UNIT
V
1
0.25
200
nA
3
pF
0.5
mA
Angle of half sensitivity
ϕ
± 60
deg
Wavelength of peak sensitivity
λp
850
nm
Range of spectral bandwidth
λ0.1
450 to 1080
nm
Ee = 1 mW/cm2, λ = 950 nm,
IC = 0.1 mA
VCEsat
0.15
VS = 5 V, IC = 1 mA, λ = 950 nm,
RL = 1 kΩ
tr/tf
6
μs
VS = 5 V, IC = 1 mA, λ = 950 nm,
RL = 100 Ω
tr/tf
2
μs
VS = 5 V, IC = 2 mA, RL = 100 Ω
fc
180
kHz
Collector emitter saturation voltage
Rise time, fall time
Cut-off frequency
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2
For technical questions, contact: [email protected]
0.3
V
Document Number: 81501
Rev. 1.4, 14-Jul-10
VEMT4700
Silicon NPN Phototransistor
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Ica - Collector Light Current (mA)
10
103
VCE = 20 V
102
101
10
40
60
80
Ee = 1 mW/cm2
0.5 mW/cm2
0.2 mW/cm2
2.0
1.8
VCE = 5 V
Ee = 1 mW/cm2
λ = 950 nm
1.6
1.4
1.2
1.0
0.8
0.6
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
94 8239
0.1
10
f = 1 MHz
8
6
4
2
0
0.1
1
100
10
VCE - Collector Emitter Voltage (V)
Fig. 6 - Collector Emitter Capacitance vs. Collector Emitter Voltage
10
ton/toff - Turn-on/Turn-off Time (µs)
8
1
0.1
VCE = 5 V
λ = 950 nm
0.01
0.001
0.01
94 8316
100
10
Fig. 5 - Collector Light Current vs. Collector Emitter Voltage
94 8294
Fig. 3 - Relative Collector Current vs. Ambient Temperature
1
VCE - Collector Emitter Voltage (V)
94 8317
Fig. 2 - Collector Dark Current vs. Ambient Temperature
Ica rel - Relative Collector Current
1
100
Tamb - Ambient Temperature (°C)
94 8304
Ica - Collector Light Current (mA)
λ = 950 nm
0.1
20
CCEO - Collector Emitter Capacitance (pF)
ICEO - Collector Dark Current (nA)
104
VCE = 5 V
RL = 100 Ω
λ = 950 nm
6
4
toff
2
ton
0
0.1
1
10
Ee - Irradiance (mW/cm²)
Fig. 4 - Collector Light Current vs. Irradiance
Document Number: 81501
Rev. 1.4, 14-Jul-10
0
94 8293
2
4
6
8
10
12
14
IC - Collector Current (mA)
Fig. 7 - Turn-on/Turn-off Time vs. Collector Current
For technical questions, contact: [email protected]
www.vishay.com
3
VEMT4700
Vishay Semiconductors
Silicon NPN Phototransistor
10°
20°
0.8
0.6
0.4
0.2
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
30°
1.0
Srel - Relative Sensitivity
S (λ)rel - Relative Spectral Sensitivity
0°
80°
0
400
600
800
0.6
1000
0.4
0.2
0
94 8318
λ - Wavelength (nm)
94 8348
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
Fig. 9 - Relative Radiant Sensitivity vs. Angular Displacement
PACKAGE DIMENSIONS in millimeters
Mounting Pad Layout
area covered with
solder resist
4
0.5
2.6 (2.8)
1.2
4
1.6 (1.9)
Dimensions: IR and vaporphase
(wave soldering)
21439
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For technical questions, contact: [email protected]
Document Number: 81501
Rev. 1.4, 14-Jul-10
VEMT4700
Silicon NPN Phototransistor
Vishay Semiconductors
SOLDER PROFILE
Fig. 11 - Blister Tape
3.5
3.1
300
255 °C
240 °C
217 °C
Temperature (°C)
250
2.2
2.0
max. 260 °C
245 °C
5.75
5.25
200
max. 30 s
3.6
3.4
150
4.0
3.6
8.3
7.7
max. 100 s
max. 120 s
1.85
1.65
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
1.6
1.4
4.1
3.9
4.1
3.9
0.25
2.05
1.95
94 8668
0
0
50
19841
100
150
200
250
300
Fig. 12 - Tape Dimensions in mm for PLCC-3
Time (s)
MISSING DEVICES
Fig. 10 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
> 160 mm
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
TAPE AND REEL
PLCC-3 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
94 8158
Tape leader
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 13 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
Adhesive tape
Blister tape
Component cavity
Document Number: 81501
Rev. 1.4, 14-Jul-10
94 8670
For technical questions, contact: [email protected]
www.vishay.com
5
VEMT4700
Vishay Semiconductors
Silicon NPN Phototransistor
COVER TAPE REMOVAL FORCE
10.0
9.0
120°
4.5
3.5
2.5
1.5
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
14.4 max.
180
178
94 8665
Fig. 14 - Dimensions of Reel-GS08
10.4
8.4
120°
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
321
329
14.4 max.
18857
Fig. 15 - Dimensions of Reel-GS18
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6
For technical questions, contact: [email protected]
Document Number: 81501
Rev. 1.4, 14-Jul-10
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000