T1610P Datasheet

T1610P
www.vishay.com
Vishay Semiconductors
Silicon PIN Photodiode
FEATURES
• Package type: chip
A
• Package form: single chip
• Dimensions (L x W x H in mm): 2.97 x 2.97 x 0.28
• Wafer diameter (in mm): 100
• Radiant sensitive area (in mm2): 7.7
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible light
• Fast response times
• Angle of half sensitivity: ϕ = ± 60°
21591
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
T1610P is a high speed and high sensitive PIN photodiode
chip with 7.7 mm2 sensitive area. It is sensitive to visible light
much like the human eye and has peak sensitivity at 560 nm.
Anode is the bond pad on top, cathode is the backside
contact.
APPLICATIONS
• Ambient light sensor
• Backlight dimmer
GENERAL INFORMATION
The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is
provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used
conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures
and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in
this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore
sold die may not perform on an equivalent basis to standard package products.
PRODUCT SUMMARY
Ira (μA)
ϕ (deg)
λ0.5 (nm)
2.9
± 60
390 to 800
PACKAGING
REMARKS
PACKAGE FORM
Wafer sawn on foil with disco frame
MOQ: 3500 pcs
Chip
COMPONENT
T1610P
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
T1610P-SD-F
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
VR
16
V
Junction temperature
Tj
100
°C
Operating temperature range
Tamb
-40 to +100
°C
Storage temperature range
Tstg1
-40 to +100
°C
Storage temperature range on foil
Tstg2
-40 to +50
°C
Rev. 1.5, 21-May-14
TEST CONDITION
UNIT
Document Number: 81998
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1610P
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
Breakdown voltage
IR = 100 μA, E = 0
V(BR)
16
Reverse dark current
TYP.
MAX.
UNIT
V
VR = 10 V, E = 0
Iro
2
VR = 3 V, f = 1 MHz, E = 0
CD
730
pF
EV = 100 lx, CIE illuminant A, VR = 5 V
Ira
2.9
μA
Angle of half sensitivity
ϕ
± 60
deg
Wavelength of peak sensitivity
λp
560
nm
λ0.5
390 to 800
nm
Diode capacitance
Reverse light current
Range of spectral bandwidth
5
nA
Rise time
VR = 5 V, RL = 50 Ω, λ = 515 nm
tr
100
ns
Fall time
VR = 5 V, RL = 50 Ω, λ = 515 nm
tf
100
ns
Note
• The measurements are based on samples of die which are mounted on a TO-header without resin coating
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1800
S(λ)rel - Relative Spectral Sensitivity
1.0
CD - Diode Capacitance (pF)
1600
1400
1200
1000
800
600
400
200
0
0
5
21742
10
15
20
25
30
0.8
0.6
0.4
0.2
0.0
400
35
500
21741
VR - Reverse Voltage (V)
Fig. 1 - Diode Capacitance vs. Reverse Voltage
600 700 800 900 1000 1100
λ - Wavelength (nm)
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength
MECHANICAL DIMENSIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Length of chip edge (x-direction)
Lx
2.97
Length of chip edge (y-direction)
Ly
2.97
mm
Sensitive area
AS
7.7
mm2
Die height
Bond pad anode
mm
H
0.28
mm
x*y
0.125 x 0.11
mm2
ADDITIONAL INFORMATION
Frontside metallization, anode
Backside metallization, cathode
Dicing
Die bonding technology
AlSi
NiV-Ag
Sawing
Epoxy bonding
Note
• All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
Rev. 1.5, 21-May-14
Document Number: 81998
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1610P
www.vishay.com
Vishay Semiconductors
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.
It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as
defined in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the
wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence
(humidity and contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Rev. 1.5, 21-May-14
Document Number: 81998
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000