T1070P Datasheet

T1070P
www.vishay.com
Vishay Semiconductors
Silicon NPN Phototransistor
FEATURES
• Package type: chip
• Package form: single chip
• Dimensions (L x W x H in mm): 0.72 x 0.72 x 0.22
• Wafer diameter (in mm): 100
• Radiant sensitive area (in mm2): 0.25
• High photo sensitivity
E
• Suitable for visible light
B
• Fast response times
• Angle of half sensitivity: ϕ = ± 60°
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
21682
DESCRIPTION
APPLICATIONS
T1070P ambient light sensor chip is a silicon NPN epitaxial
planar phototransistor. It is sensitive to visible light much like
the human eye and has peak sensitivity at 570 nm.
• Ambient light sensor
• Backlight dimmer
GENERAL INFORMATION
The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is
provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used
conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures
and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in
this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore
sold die may not perform on an equivalent basis to standard package products.
PRODUCT SUMMARY
IPCE (μA)
ϕ (deg)
λ0.5 (nm)
50
± 60
440 to 800
PACKAGING
REMARKS
PACKAGE FORM
wafer sawn on foil with disco frame
MOQ: 55 000 pcs
chip
COMPONENT
T1070P
Note
• Test condition see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
T1070P-SD-F
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
UNIT
Collector emitter voltage
TEST CONDITION
VCEO
6
V
Emitter collector voltage
VECO
1.5
V
Collector current
IC
20
mA
Junction temperature
Tj
100
°C
Operating temperature range
Tamb
-40 to +100
°C
Storage temperature range
Tstg1
-40 to +100
°C
Storage temperature range on foil
Tstg2
-40 to +50
°C
Rev. 1.7, 29-Sep-14
Document Number: 81119
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1070P
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Collector emitter breakdown voltage
Collector dark current
Collector emitter capacitance
Collector light current
TEST CONDITION
SYMBOL
MIN.
IC = 0.1 mA
V(BR)CEO
6
TYP.
MAX.
UNIT
V
VCE = 5 V, E = 0
ICEO
3
VCE = 5 V, f = 1 MHz, E = 0
CCEO
16
pF
EV = 20 lx, CIE illuminant A, VCE = 5 V
IPCE
10
μA
50
nA
EV = 100 lx, CIE illuminant A, VCE = 5 V
IPCE
50
μA
CIE illuminant A
TKIPCE
1.18
%/K
LED, white
Temperature coefficient of IPCE
TKIPCE
0.9
%/K
Angle of half sensitivity
ϕ
± 60
deg
Wavelength of peak sensitivity
λp
570
nm
λ0.5
440 to 800
nm
VCEsat
0.1
V
Range of spectral bandwidth
Collector emitter saturation voltage
EV = 20 lx, CIE illuminant A, IPCE = 1.2 μA
Note
• The measurements are based on samples of die which are mounted on a TO-header without resin coating
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
VCE = 5 V
10 -7
IPCE - Photo Current (µA)
ICEO - Collector Dark Current (A)
10 -6
10 -8
10 -9
10 -10
10 -11
10
10 -12
10 -13
-40
19758
1
-20
0
20
40
60
80
Tamb - Ambient Temperature (°C)
100
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0
VCE = 5 V, white LED
-40
19759
-20
0
20 40 60 80
Tamb - Ambient Temperature (°C)
100
Fig. 2 - Relative Photo Current vs. Ambient Temperature
Rev. 1.7, 29-Sep-14
100
E v - Illuminance (Ix)
1000
Fig. 3 - Photo Current vs. Illuminance
CCE0 - Collector Emitter Capacitance (pF)
2.2
0.4
0.2
10
19760
Fig. 1 - Collector Dark Current vs. Ambient Temperature
IPCE rel - Relative Photo Current
100
25
f = 1 MHz
20
15
10
19762
5
0
0.1
1.0
10.0
VCE - Collector Emitter Voltage (V)
Fig. 4 - Collector Emitter Capacitance vs. Collector Emitter Voltage
Document Number: 81119
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1070P
www.vishay.com
Vishay Semiconductors
S(λ)rel - Relative Spectral Sensitivity
1.0
20019
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
300 400 500 600 700 800 900 1000 1100
λ - Wavelength (nm)
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
MECHANICAL DIMENSIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Length of chip edge (x-direction)
Lx
0.72
Length of chip edge (y-direction)
Ly
0.72
mm
Sensitive area
AS
0.5 x 0.5
mm2
Die height
Bond pad emitter (E)
mm
H
0.22
mm
axb
0.1 x 0.1
mm2
ADDITIONAL INFORMATION
Frontside metallization, base (B), emitter (E)
aluminum
Backside metallization, collector
gold alloy
Dicing
Die bonding technology
sawing
epoxy bonding
Note
• All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.
It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as
defined in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the
wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence
(humidity and contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Rev. 1.7, 29-Sep-14
Document Number: 81119
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000