Complementary MOSFET ELM34604AA-N ■General Description ■Features ELM34604AA-N uses advanced trench technology to provide excellent Rds(on) and low gate charge. • • • • N-channel P-channel Vds=40V Id=7A Rds(on) < 28mΩ(Vgs=10V) Rds(on) < 42mΩ(Vgs=4.5V) Vds=-40V Id=-5A Rds(on) < 65mΩ(Vgs=-10V) Rds(on) < 105mΩ(Vgs=-4.5V) ■Maximum Absolute Ratings Parameter Symbol Vds Drain-source voltage Gate-source voltage Ta=25°C. Unless otherwise noted. N-ch (Max.) P-ch (Max.) Unit Note 40 -40 V Vgs ±20 7 6 ±20 -6 -5 V Idm 20 -20 A Pd 2.0 1.3 2.0 1.3 W Tj,Tstg -55 to 150 -55 to 150 °C Ta=25°C Ta=70°C Continuous drain current Id Pulsed drain current Tc=25°C Tc=70°C Power dissipation Junction and storage temperature range A 3 ■Thermal Characteristics Parameter Maximum junction-to-ambient Symbol Rθja Device N-ch Maximum junction-to-ambient Rθja P-ch ■Pin configuration SOP-8(TOP VIEW) 1 8 2 7 3 6 4 5 Typ. Max. 62.5 Unit °C/W 62.5 °C/W Note ■Circuit Pin No. Pin name 1 2 SOURCE1 GATE1 3 4 5 SOURCE2 GATE2 DRAIN2 6 7 8 DRAIN2 DRAIN1 DRAIN1 7-1 • N-ch • P-ch D1 G1 D2 G2 S1 S2 Complementary MOSFET ELM34604AA-N ■Electrical Characteristics (N-ch) Parameter STATIC PARAMETERS Drain-source breakdown voltage Symbol Conditions BVdss Id=250μA, Vgs=0V Vds=30V, Vgs=0V, Ta=55°C 10 Gate-body leakage current Gate threshold voltage On state drain current Igss Vgs(th) Vds=Vgs, Id=250μA Id(on) Vgs=10V, Vds=5V Static drain-source on-resistance Rds(on) Pulsed current DYNAMIC PARAMETERS Input capacitance Output capacitance Reverse transfer capacitance SWITCHING PARAMETERS Total gate charge Gate-source charge Gate-drain charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time V 1 Idss Max.body-diode continuous current 40 Vds=32V, Vgs=0V Zero gate voltage drain current Forward transconductance Diode forward voltage Ta=25°C. Unless otherwise noted. Min. Typ. Max. Unit Note ±100 nA 2.5 V A 1 mΩ 1 1 S V 1 1 Is 1.3 A Ism 2.6 A Gfs Vsd Vds=0V, Vgs=±20V μA 1.0 20 1.5 Vgs=10V, Id=7A 21 28 Vgs=4.5V, Id=6A 30 42 Vds=10V, Id=7A If=Is, Vgs=0V 19 3 Ciss 790 pF Coss Vgs=0V, Vds=10V, f=1MHz Crss 175 65 pF pF Qg Qgs 16.0 2.5 nC nC 2 2 2.1 2.2 4.4 nC ns 2 2 7.5 15.0 ns 2 11.8 21.3 ns 2 3.7 7.4 ns 2 Vgs=10V, Vds=20V, Id=7A Qgd td(on) tr Vgs=10V, Vds=20V, Id=1A td(off) Rgen=6Ω tf NOTE : 1. Pulse test : Pulsed width≤300μsec and Duty cycle≤2%. 2. Independent of operating temperature. 3. Pulsed width limited by maximum junction temperature. 4. Duty cycle ≤ 1%. 7-2 P2804NVG N- & P-Channel Enhancement Mode Field Effect Transistor SOP-8 Lead-Free Complementary MOSFET ELM34604AA-N ■Typical Electrical and Thermal Characteristics (N-ch) Body Diode Forward Voltage Variation with Source Current and Temperature 100 V GS = 0V T A = 125° C Is - Reverse Drain Current(A) 10 25° C 1 -55° C 0.1 0.01 0.001 7-3 4 0 0.4 0.2 0.6 0.8 1.0 VSD - Body Diode Forward Voltage(V) 1.2 1.4 AUG-19-2004 NIKO-SEM N- & P-Channel Enhancement Mode Complementary MOSFET Field Effect Transistor ELM34604AA-N 7-4 P2804NVG SOP-8 Lead-Free Complementary MOSFET ELM34604AA-N ■Electrical Characteristics (P-ch) Parameter STATIC PARAMETERS Drain-source breakdown voltage Symbol Conditions BVdss Id=-250μA, Vgs=0V Zero gate voltage drain current Idss Gate-body leakage current Igss Vds=-30V, Vgs=0V, Ta=55°C -10 Vds=0V, Vgs=±20V μA ±100 nA -2.5 V A 1 mΩ 1 -1 S V 1 1 Is -1.3 A Ism -2.6 A Static drain-source on-resistance Rds(on) Pulsed current DYNAMIC PARAMETERS Input capacitance V -1 Vgs(th) Vds=Vgs, Id=-250μA Id(on) Vgs=-10V, Vds=-5V Max.body-diode continuous current -40 Vds=-32V, Vgs=0V Gate threshold voltage On state drain current Forward transconductance Diode forward voltage Ta=25°C. Unless otherwise noted. Min. Typ. Max. Unit Note Gfs Vsd -1.0 -20 -1.5 Vgs=-10V, Id=-5A 50 65 Vgs=-4.5V, Id=-4A 80 105 Vds=-10V, Id=-5A If=Is, Vgs=0V 11 3 Ciss 690 pF Coss Vgs=0V, Vds=-10V, f=1MHz Crss 310 75 pF pF Gate-source charge Qg Qgs 14.0 2.2 nC nC 2 2 Gate-drain charge Turn-on delay time Qgd td(on) 1.9 6.7 13.4 nC ns 2 2 Turn-on rise time Turn-off delay time tr 9.7 19.4 ns 2 19.8 35.6 ns 2 12.3 22.2 ns 2 Output capacitance Reverse transfer capacitance SWITCHING PARAMETERS Total gate charge Turn-off fall time Vgs=-10V, Vds=-20V Id=-5A Vgs=-10V, Vds=-20V td(off) Id=-1A, RL=1Ω, Rgen=6Ω tf NOTE : 1. Pulse test : Pulsed width≤300μsec and Duty cycle≤2%. 2. Independent of operating temperature. 3. Pulsed width limited by maximum junction temperature. 7-5 N- & P-Channel Enhancement Mode Field Effect Transistor Complementary MOSFET P2804NVG ELM34604AA-N SOP-8 Lead-Free ■Typical Electrical and Thermal Characteristics (P-ch) -Is - Reverse Drain Current(A) 100 V GS = 0V 10 1 0.1 25° C -55° C 0.01 0.001 0 7-6 T A = 125° C 0.8 1.0 1.2 0.2 0.6 0.4 -VSD - Body Diode Forward Voltage(V) 1.4 NIKO-SEM N- & P-Channel Enhancement Mode Field Effect Transistor Complementary MOSFET ELM34604AA-N 7-7 P2804NVG SOP-8 Lead-Free