ZXMHC3F381N8

A Product Line of
Diodes Incorporated
ZXMHC3F381N8
30V SO8 Complementary enhancement mode MOSFET H-Bridge
Summary
Device
N-CH
P-CH
V(BR)DSS
QG
30V
-30V
RDS(on)
ID
TA= 25°C
33mΩ @ VGS= 10V
5.0A
60mΩ @ VGS= 4.5V
3.9A
55mΩ @ VGS= -10V
-4.1A
80mΩ @ VGS= -4.5V
-3.3A
9.0nC
12.7nC
P1S/P2S
Description
This new generation complementary MOSFET H-Bridge
features low on-resistance achievable with low gate drive.
P2G
P1G
Features
•
•
P1D/N1D
2 x N + 2 x P channels in a SOIC package
Low voltage (VGS = 4.5 V) gate drive
DC Motor control
•
DC-AC Inverters
N2G
N1G
Applications
•
P2D/N2D
N1S/N2S
Ordering information
Device
ZXMHC3F381N8TC
Reel size
(inches)
Tape width
(mm)
Quantity
per reel
13
12
2,500
Device marking
ZXMHC
3F381
Issue 1.0 - March 2009
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ZXMHC3F381N8
Absolute maximum ratings
Parameter
Symbol
Nchannel
Pchannel
Unit
Drain-Source voltage
VDSS
30
-30
V
Gate-Source voltage
VGS
±20
±20
V
ID
4.98
-4.13
A
(b)
3.98
-3.31
(a)
3.98
-3.36
(f)
4.17
-3.51
IDM
22.9
-19.6
A
IS
2.0
-2.0
A
ISM
22.9
-19.6
A
Continuous Drain current @ VGS= 10V; TA=25°C
@ VGS= 10V; TA=70°C
@ VGS= 10V; TA=25°C
@ VGS= 10V; TL=25°C
Pulsed Drain current @ VGS= 10V; TA=25°C
(b)
(c)
Continuous Source current (Body diode) at TA =25°C
Pulsed Source current (Body diode) at TA =25°C
Power dissipation at TA =25°C
Linear derating factor
Power dissipation at TA =25°C
Linear derating factor
Power dissipation at TL =25°C
Linear derating factor
(c)
(a)
(b)
0.87
PD
W
mW/°C
6.94
(b)
1.35
PD
W
mW/°C
10.9
(f)
PD
Operating and storage temperature range
0.95
0.98
7.63
7.81
W
mW/°C
Tj, Tstg
-55 to 150
°C
Symbol
Value
Unit
RθJA
144
°C/W
RθJA
92
°C/W
RθJA
106
°C/W
RθJA
254
°C/W
Thermal resistance
Parameter
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to lead
(a)
(b)
(d)
(e)
(f)
RθJL
131
128
°C/W
NOTES:
(a)
(b)
(c)
(d)
(e)
(f)
For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still
air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when
operating in a steady-state condition with one active die.
Same as note (a), except the device is measured at t ≤ 10 sec.
Same as note (a), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the
maximum junction temperature.
For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still
air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when
operating in a steady-state condition with one active die.
For a device surface mounted on minimum copper 1.6mm FR4 PCB, in still air conditions; the device is measured when
operating in a steady-state condition with one active die.
Thermal resistance from junction to solder-point (at the end of the drain lead); the device is operating in a steady-state
condition with one active die.
Issue 1.0 - March 2009
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ZXMHC3F381N8
Thermal characteristics
RDS(ON)
1
-ID Drain Current (A)
ID Drain Current (A)
RDS(ON)
10 Limited
DC
1s
100ms
100m
10ms
10m
100us
DC
1s
100ms
10ms
1
1ms
Note (a)
10m
Single Pulse, T amb=25°C
0.1
1
100m
1ms
Note (a)
10 Limited
100us
Single Pulse, T amb=25°C
0.1
10
VDS Drain-Source Voltage (V)
1
10
-VDS Drain-Source Voltage (V)
N-channel Safe Operating Area
P-channel Safe Operating Area
One Active Die
25 x 25mm 1oz
120
100
80
D=0.5
60
40
Single Pulse
D=0.2
D=0.05
20
0
100µ
D=0.1
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Any one
active die
0.5
0.0
0
25
50
75
100
125
150
Temperature (°C)
Transient Thermal Impedance
Maximum Power (W)
Max Power Dissipation (W)
Thermal Resistance (°C/W)
1.0
140
Derating Curve
One Active Die
Single Pulse
T amb=25°C
100
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
Issue 1.0 - March 2009
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ZXMHC3F381N8
N-channel electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symbol
Min.
Drain-Source breakdown
voltage
V(BR)DSS
30
Zero Gate voltage Drain
current
IDSS
IGSS
Typ.
Max.
Unit
Conditions
Static
Gate-Body leakage
Gate-Source threshold
voltage
VGS(th)
1.0
V
ID = 250μA, VGS= 0V
0.5
µA
VDS= 30V, VGS= 0V
±100
nA
VGS= ±20V, VDS= 0V
3.0
V
ID= 250μA, VDS= VGS
0.033
0.060
Ω
VGS= 10V, ID= 5A
VGS= 4.5V, ID= 4A
VDS= 15V, ID= 5A
Static Drain-Source
(a)
on-state resistance
RDS(on)
Forward
(a) (c)
Transconductance
gfs
11.8
S
Input capacitance
Ciss
430
pF
Output capacitance
Coss
101
pF
Reverse transfer
capacitance
Crss
56
pF
Turn-on-delay time
td(on)
2.5
ns
Rise time
tr
3.3
ns
Turn-off delay time
td(off)
11.5
ns
Fall time
tf
6.3
ns
Total Gate charge
Qg
9.0
nC
Gate-Source charge
Qgs
1.7
nC
Gate-Drain charge
Qgd
2.0
nC
VSD
0.82
Dynamic
Capacitance
Switching
(c)
VDS= 15V, VGS= 0V
f= 1MHz
(b) (c)
Gate charge
VDD= 15V, VGS= 10V
ID= 1A
RG ≅ 6Ω,
(c)
VDS=15V, VGS= 10V
ID= 5A
Source–Drain diode
Diode forward voltage
Reverse recovery time
(a)
(c)
Reverse recovery charge
(c)
1.2
V
trr
12
ns
Qrr
4.9
nC
IS= 1.7A, VGS= 0V
IS= 2.1A, di/dt= 100A/μs
NOTES:
(a) Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%.
(b) Switching characteristics are independent of operating junction temperature.
(c) For design aid only, not subject to production testing
Issue 1.0 - March 2009
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ZXMHC3F381N8
N-channel typical characteristics
T = 150°C
VGS
4.5V
10
4V
3.5V
1
3V
0.1
T = 25°C
2.5V
2.5V
2V
0.1
1
10
0.1
0.1
T = 25°C
0.01
3
4
VGS Gate-Source Voltage (V)
Typical Transfer Characteristics
Normalised RDS(on) and VGS(th)
T = 150°C
ISD Reverse Drain Current (A)
VGS
T = 25°C
100
3V
10
3.5V
1
4V
4.5V
0.1
0.01
0.01
10V
0.1
1
10
On-Resistance v Drain Current
© Diodes Incorporated
VGS = 10V
ID = 5A
1.4
RDS(on)
1.2
1.0
0.8
VGS(th)
VGS = VDS
0.6
0.4
-50
ID = 250uA
0
50
100
Tj Junction Temperature (°C)
150
10
1
T = 150°C
0.1
T = 25°C
0.01
1E-3
0.2
0.4
0.6
0.8
1.0
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
ID Drain Current (A)
Issue 1.0 - March 2009
1.6
Normalised Curves v Temperature
1000
2.5V
10
Output Characteristics
VDS = 10V
2
1
VDS Drain-Source Voltage (V)
Output Characteristics
ID Drain Current (A)
3.5V
3V
VDS Drain-Source Voltage (V)
RDS(on) Drain-Source On-Resistance (Ω)
VGS
4V
0.01
0.1
1
4.5V
1
0.01
10
10V
10
ID Drain Current (A)
ID Drain Current (A)
10V
5
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ZXMHC3F381N8
N-channel typical characteristics –continued
600
500
VGS Gate-Source Voltage (V)
C Capacitance (pF)
VGS = 0V
f = 1MHz
400
CISS
COSS
300
CRSS
200
100
0
1
10
VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
10
9
8
7
6
5
4
3
2
1
0
ID = 5A
VDS = 15V
0
1
2
3
4
5
6
7
Q - Charge (nC)
8
9
Gate-Source Voltage v Gate Charge
Test circuits
Current
regulator
QG
12V
VG
QGS
50k
Same as
D.U.T
QGD
VDS
IG
D.U.T
ID
VGS
Charge
Basic gate charge waveform
Gate charge test circuit
VDS
90%
RD
VGS
VDS
RG
VDD
10%
VGS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
Issue 1.0 - March 2009
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Switching time test circuit
6
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ZXMHC3F381N8
P-channel electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symbol
Min.
Drain-Source breakdown
voltage
V(BR)DSS
-30
Zero Gate voltage Drain
current
IDSS
IGSS
Typ.
Max.
Unit
Conditions
Static
Gate-Body leakage
Gate-Source threshold
voltage
VGS(th)
-1.0
V
ID = -250μA, VGS= 0V
-0.5
µA
VDS= -30V, VGS= 0V
±100
nA
VGS= ±20V, VDS= 0V
-3.0
V
ID= -250μA, VDS= VGS
0.055
0.080
Ω
VGS= -10V, ID= -5A
VGS= -4.5V, ID= -4A
VDS= -15V, ID= -5A
Static Drain-Source
(a)
on-state resistance
RDS(on)
Forward
(a) (c)
Transconductance
gfs
14
S
Input capacitance
Ciss
670
pF
Output capacitance
Coss
126
pF
Dynamic
Capacitance
(c)
Reverse transfer
capacitance
Crss
70
pF
Turn-on-delay time
td(on)
1.9
ns
Rise time
tr
3.0
ns
Turn-off delay time
td(off)
30
ns
Fall time
tf
21
ns
Switching
VDS= -15V, VGS= 0V
f= 1MHz
(b) (c)
Gate charge
VDD= -15V, VGS= -10V
ID= -1A
RG ≅ 6Ω
(c)
Total Gate charge
Qg
12.7
nC
Gate-Source charge
Qgs
2.0
nC
Gate-Drain charge
Qgd
2.4
nC
VSD
-0.82
trr
Qrr
VDS= -15V, VGS= -10V
ID= -5A
Source–Drain diode
Diode forward voltage
Reverse recovery time
(a)
(c)
Reverse recovery charge
(c)
V
IS= -1.7A, VGS= 0V
16.5
ns
IS= -2.1A, di/dt= 100A/μs
11.5
nC
-1.2
NOTES:
(a) Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%.
(b) Switching characteristics are independent of operating junction temperature.
(c) For design aid only, not subject to production testing
Issue 1.0 - March 2009
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ZXMHC3F381N8
P-channel typical characteristics
-ID Drain Current (A)
4.5V
4V
10V
T = 150°C
-ID Drain Current (A)
10V
T = 25°C
10
3.5V
3V
1
2.5V
0.1
VGS
0.01
3V
10
2.5V
2V
1
VGS
1
10
0.1
-VDS Drain-Source Voltage (V)
1
Output Characteristics
1.6
Normalised RDS(on) and VGS(th)
-ID Drain Current (A)
VDS = 10V
T = 150°C
1
T = 25°C
2.5
3.0
3.5
-VGS Gate-Source Voltage (V)
VGS
T = 25°C
10
3V
3.5V
1
4V
4.5V
0.1
10V
0.01
0.01
0.1
1
10
On-Resistance v Drain Current
© Diodes Incorporated
ID = 5A
RDS(on)
1.2
1.0
0.8
VGS = VDS
0.6
0.4
-50
ID = 250uA
0
50
VGS(th)
100
Tj Junction Temperature (°C)
150
10
T = 150°C
1
0.1
T = 25°C
0.01
Vgs = 0V
1E-3
0.2
0.4
0.6
0.8
1.0
-VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
-ID Drain Current (A)
Issue 1.0 - March 2009
VGS = 10V
1.4
Normalised Curves v Temperature
-ISD Reverse Drain Current (A)
RDS(on) Drain-Source On-Resistance (Ω)
Typical Transfer Characteristics
2.5V
10
-VDS Drain-Source Voltage (V)
Output Characteristics
0.1
2.0
3.5V
0.1
0.1
10
4V
8
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ZXMHC3F381N8
P-channel typical characteristics –continued
-VGS Gate-Source Voltage (V)
1000
C Capacitance (pF)
VGS = 0V
800
f = 1MHz
600
CISS
COSS
CRSS
400
200
0
1
10
-VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
10
9
8
7
6
5
4
3
2
1
0
ID = 5A
VDS = 15V
0
5
10
15
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Test circuits
Current
regulator
QG
12V
VG
QGS
50k
0.2␮F
Same as
D.U.T
QGD
VDS
IG
D.U.T
ID
VGS
Charge
Gate charge test circuit
Basic gate charge waveform
VDS
90%
RD
VGS
VDS
RG
VDD
10%
VGS
tr
td(off)
t(on)
tr
t(on)
Switching time test circuit
Switching time waveforms
Issue 1.0 - March 2009
© Diodes Incorporated
Pulse width ⬍ 1␮S
Duty factor 0.1%
td(on)
9
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ZXMHC3F381N8
Packaging details - SO8
DIM
Inches
Millimeters
DIM
Inches
Min.
Millimeters
Max.
Max.
Min.
Max.
A
0.053
0.069
1.35
1.75
e
A1
0.004
0.010
0.10
0.25
b
0.013
0.020
0.33
0.51
D
0.189
0.197
4.80
5.00
c
0.008
0.010
0.19
0.25
H
0.228
0.244
5.80
6.20
θ
0°
8°
0°
8°
E
0.150
0.157
3.80
4.00
-
-
-
-
-
L
0.016
0.050
0.40
1.27
-
-
-
-
-
0.050 BSC
Min.
Max.
Min.
1.27 BSC
Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters
Issue 1.0 - March 2009
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ZXMHC3F381N8
IMPORTANT NOTICE
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DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS
FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems
without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use
provided in the
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B. A critical component is any component in a life support device or system whose failure to perform can be reasonably
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Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support
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