Analog Mixed Signal and Power Management Packaging Robust packaging is a key technology component of Analog Products. Freescale puts solutions together in single packages to accommodate power, high voltages, communications, control, and protection features. Environmentally Preferred Products (EPP) is also a key mandate for Freescale Analog products. Packaging Analog Mixed Signal and Power Management The Analog and Mixed Signal Products Division of Freescale has a long history of serving the commercial and automotive marketplace, and vast experience with the automotive industry’s quality requirements / expectations. We achieved QS9000 certification status in July 1998, TS16949 certification in 2004, and we use AEC-Q100 as the basis for our product stress test qualifications (products introduced prior to July 1998, which may have limited qualification or other data available). Data may be available on a fee-for-service basis. 2 Analog Mixed Signal and Power Management Packaging Freescale Environmentally Preferred Products (EPP) OVERVIEW: EPP STRATEGY: Producing Environmentally Friendly Products Freescale offers Environmentally Preferred products and packages. These products are RoHS compliant. Some are Pb-free, use Pb-free package terminations, or may be halogen free. Delivering products that are free of hazardous substances is a Freescale priority. To that end, Freescale has a proactive Environmentally Preferred Products Program that assures it meets customer and legislative requirements, as well as Freescale’s own standards, whichever is the most stringent, to reduce or eliminate the presence of lead (Pb) in its semiconductors. Historically, lead has been used in semiconductor packages to ensure an effective electrical connection is made when the semiconductor is integrated into the end product. Freescale works closely with its customers and suppliers to ensure a smooth transition into compliance with current and pending requirements of the European Union, China, Japan and the USA regarding the use of hazardous substances in electronic equipment. In addition, Freescale closely monitors electronics industry standards for qualification of replacement technologies. Together, these efforts result in products that incorporate environmentally preferred materials and design features. Freescale Environmental Product activities include RoHS (Restriction of Hazardous Substances), WEEE (Waste of Electrical and Electronic Equipment), and ELV (End of Life Vehicle) Directive compliance initiatives. Freescale restricts many hazardous substances from its products, but lead (Pb) is the primary focus. • EPP ball grid array (BGA) products use tin silver copper or SnAg (tin silver) solder balls. (SnAgCu) • Termination finishes on EPP plated products use 100% matte tin (Sn) with a one hour, 150oC post-plate anneal. Some EPP products may use nickel palladium gold (NiPdAu) termination finishes. • Environmentally Preferred Packaging Strategy: • RoHS compliant • MSL (Moisture Sensitivity Level) of 3 or better • Package Peak Temperature (PPT) per JEDEC J-STD-020C • Halogen-free mold compound • Freescale intends to offer BGA products with SnPbAg solderballs for automotive and other RoHS exempt applications. The SnPbAg solderball products will use different part numbers from the Pb-free solderball products. PB-FREE Termination Suffix: This brochure uses various part number suffixes to identify products with Pb-free plating or balls. RoHS compliant products with these Pbfree terminations may contain other sources of Pb (RoHS exempt) in the packages. Freescale may also sell versions of some products that contain Pb which is not exempt from RoHS. Freescale will identify these products with separate part numbers. RELIABILITY: THERMAL ADDENDUM: Freescale subjects its products to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. Verify each part number for its particular MSL and PPT. • All surface mount products intended for high temperature board attach using Pb-free solders are fully characterized for MSL and PPT. • Next, click on the ‘RoHS’ or ‘No’ value under the ‘Compliance Flags RoHS’ column. This will open another window with the PPT and MSL. • Commercial & industrial products are qualified according to the JEDEC J-STD-020 version in effect at the time of qualification. REFERENCE INFORMATION: • Automotive products are qualified according to AEC-Q100. • Find EPP and RoHS information at www.freescale.com/ pbfree • Tin plating is qualified according to the JEDEC JESD201 procedure. • Search at www.freescale.com by entering all or a portion of the part number (e.g., MC34845 or 34845) in the Part Number Search field. • Download a copy of the Freescale solder profile application note by entering ‘AN3298’ in the KEYWORD SEARCH at www.freescale.com. Contact your Freescale account representative or send an email to [email protected] for further EPP assistance. 3 Packaging Analog Mixed Signal and Power Management Small Outline Surface Mount Packages 8 SOICN Suffix D Pb-free Suffix EF 14 SOICN Suffix D Pb-free Suffix EF 16 SOICN Suffix D Pb-free Suffix EF D D D 16 SOICW Suffix DW Pb-free Suffix EG 20 SOICW Suffix DW Pb-free Suffix EG DW DW SMALL OUTLINE SURFACE MOUNT PACKAGE DIMENSIONS Body Size Package D1 Lead Pitch E1 e A A1 H L b c SOIC 8 SOICN 4.90 3.90 1.27 1.55 0.18 6.00 0.83 0.43 0.22 14 SOICN 8.65 3.90 1.27 1.55 0.18 6.00 0.83 0.43 0.22 16 SOICN 9.90 3.90 1.27 1.55 0.18 6.00 0.83 0.43 0.22 16 SOICW 10.30 7.50 1.27 2.50 0.18 10.30 0.70 0.43 0.28 20 SOICW 12.80 7.50 1.27 2.50 0.18 10.30 0.70 0.43 0.28 24 SOICW 15.40 7.50 1.27 2.50 0.21 10.30 0.70 0.43 0.28 28 SOICW 17.93 7.50 1.27 2.50 0.21 10.30 0.70 0.43 0.28 32 SOICW 11.00 7.50 0.65 2.50 0.21 10.30 0.70 0.30 0.22 54 SOICW 17.90 7.50 0.65 2.50 0.21 10.30 0.70 0.30 0.28 All dimensions are in millimeters and are nominal values. OVERVIEW: RELIABILITY: Freescale provides a large selection of proven and reliable small outline surface mount (SOIC) packages in both narrow body (3.90 mm) and wide body (7.50 mm) styles. Lead counts range from 8 to 54 leads and are formed in a popular “gullwing” shape that easily adapts to all surface mount technology (SMT) processes. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Narrow SOICN (3.90 mm) and Wide SOICW (7.50 mm) Body Sizes • Pb-free Terminal Finishes • Gullwing Lead Forms • 1.27 mm and 0.65 mm Lead Pitch • Rail or Tape & Reel Packing Available • JEDEC Compliant Case Outlines 4 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Small Outline Surface Mount Packages 24 SOICW Suffix DW Pb-free Suffix EG DW 28 SOICW Suffix DW Pb-free Suffix EG 32 SOICW Fine Pitch Suffix DWB Pb-free Suffix EW 54 SOICW Fine Pitch Suffix DWB Pb-free Suffix EW DWB DW DWB TOP VIEW H E1 b Cross Section D1 A SOICN, SOICW GUIDELINES FOR SOLDERING: Freescale’s broad array of Small Outline IC’s (SOIC) include the popular “gull wing” lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. APPLICATION NOTE Please refer to application note AN2409 for package information concerning SOICW fine pitch packages. This includes packages without and with exposed thermal pads. e L A1 c See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA 75°C/W - 175°C/W JESD51-2 RθJL 40°C/W - 80°C/W JESD51-8 Power Dissipation: Up to 1.5 W 5 Packaging Analog Mixed Signal and Power Management Small Outline Surface Mount Packages 16 TSSOP Suffix DTB/MTB Pb-free Suffix EJ 24 TSSOP Suffix DTB Pb-free Suffix EJ SMALL OUTLINE SURFACE MOUNT PACKAGE (FINE PITCH - TSSOP) Body Size Package Lead Pitch D1 E1 e A A1 H L b c 16 TSSOP 5.00 4.40 0.65 1.20 0.10 6.40 0.60 0.30 0.22 24 TSSOP 7.80 5.60 0.65 1.20 0.10 7.60 0.60 0.30 0.22 TSSOP All dimensions are in millimeters and are nominal values. OVERVIEW: RELIABILITY: Freescale provides a large selection of proven and reliable small outline surface mount (SOIC) packages. The TSSOP (4.4 & 5.6 mm) style fall between the SOICN (narrow body) and the SOICW (wide body). The TSSOP range from 16 to 24 pin. The leads are formed in a popular “gullwing” shape that easily adapts to all surface mount technology (SMT) processes. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Pb-free Terminal Finishes • 0.65 mm Lead Pitch • Tray Packing Available • Rail or Tape & Reel Packaging Available 6 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Small Outline Surface Mount Packages GUIDELINES FOR SOLDERING: Freescale’s broad array of Small Outline IC’s (SOIC) include the popular “gull wing” lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. APPLICATION NOTE See THERMAL ADDENDUM: Thermal Resistance RθJA Typical Values Test Condition 100°C/W - 190°C/W JESD51-2 Power Dissipation: Up to 1.0 W Please refer to application note AN2409 for package information concerning SOICW fine pitch packages. This includes packages without and with exposed thermal pads. 7 Packaging Analog Mixed Signal and Power Management Thermally Enhanced Small Outline Surface Mount Packages 24 SOICW Suffix DW Pb-free Suffix EG 28 SOICW Suffix DW Pb-free Suffix EG 32 SOICW Suffix DWB Pb-free Suffix EW 54 SOICW Suffix DWB Pb-free Suffix EW DW DWB DWB DW THERMALLY ENHANCED SMALL OUTLINE SURFACE MOUNT PACKAGE DIMENSIONS Body Size Package D1 Lead Pitch E1 e A A1 F G H L b c SOICW 24 SOICW 15.40 7.50 1.27 2.50 0.21 N/A N/A 10.30 0.67 0.43 0.25 28 SOICW 17.93 7.50 1.27 2.50 0.21 N/A N/A 10.30 0.66 0.43 0.25 32 SOICW 11.00 7.50 0.65 2.50 0.21 N/A N/A 10.30 0.70 0.30 0.25 54 SOICW 17.90 7.50 0.65 2.50 0.21 N/A N/A 10.30 0.70 0.30 0.25 32 SOICW-EP 11.00 7.50 0.65 2.34 0.21 3.40 3.40 10.30 0.70 0.30 0.25 32 SOICW-EP 11.00 7.50 0.65 2.34 0.21 4.70 4.70 10.30 0.70 0.30 0.25 32 SOICW-EP 11.00 7.50 0.65 2.34 0.21 4.60 5.70 10.30 0.70 0.30 0.25 54 SOICW-EP 17.90 7.50 0.65 2.50 0.05 4.55 4.55 10.30 0.70 0.30 0.25 54 SOICW-EP 17.90 7.50 0.65 2.50 0.05 4.55 6.25 10.30 0.70 0.30 0.25 54 SOICW-EP 17.90 7.50 0.65 2.50 0.05 5.05 10.30 10.30 0.70 0.30 0.25 All dimensions are in millimeters and are nominal values. Note: -EP denotes Exposed Thermal Pad OVERVIEW: RELIABILITY: Thermally enhanced SOIC packages are also available to increase the power dissipation capability up to 2X for a given IC application, thereby expanding the margin of operating parameters possible. Enhancements are made such as thermal leads tied to die pads or exposed die pads that can be directly soldered to a multi-layer PCB board heat sink or thermal vias. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • 7.50 mm wide SOIC Body Sizes • Thermal Leads and/or Exposed Pad for Increased Performance • Pb-free Terminal Finishes • Gullwing Lead Forms • 1.27 mm and 0.65 mm Lead Pitch • Rail or Tape & Reel Packing Available 8 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Thermally Enhanced Small Outline Surface Mount Packages 32 SOICW-EP Exposed Pad Suffix DWB Pb-free Suffix EK 54 SOICW-EP Exposed Pad Suffix DWB Pb-free Suffix EK TOP VIEW BOTTOM VIEW G Cross Section H E1 SOICW-EP (Exposed Pad) F D1 c A The exposed pad size depends on the lead frame and product chosen e b A1 L G Cross Section H F E1 Inverted SOICW-EP (Exposed Pad) D1 GUIDELINES FOR SOLDERING: Freescale’s broad array of Small Outline IC’s (SOIC) include the popular "gull wing" lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. Thermal leads or an exposed pad should be soldered directly to a multi-layered PCB with thermal via holes to realize the greatest potential of the enhanced SOICW packages. Refer to AN2409, and device specific thermal data. APPLICATION NOTE Please refer to application note AN2409 for package information concerning SOICW fine pitch packages. This includes packages without and with exposed thermal pads. See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA 60°C/W - 100°C/W JESD51-2 RθJL 10°C/W - 40°C/W JESD51-8 RθJC* 1°C/W - 2°C/W JESD51-8 * SOICW-Exposed Pad Power Dissipation: Up to 4.0 W 9 Packaging Analog Mixed Signal and Power Management Heatsink Small Outline Surface Mount Packages 20 HSOP Suffix DH Pb-free Suffix VW 30 HSOP Suffix DH Pb-free Suffix VW 36 HSOP Suffix DH Pb-free Suffix VW 44 HSOP Suffix DH Pb-free Suffix VW HEATSINK SMALL OUTLINE SURFACE MOUNT PACKAGE DIMENSIONS Body Size Package D Lead Pitch E1 e A A3 D1 E E3 L b c HSOP 20 HSOP 15.90 11.00 1.27 3.00 0.20 12.20 14.20 6.80 0.97 0.46 0.30 30 HSOP 15.90 11.00 0.80 3.00 0.20 12.20 14.20 6.90 0.97 0.41 0.30 36 HSOP 15.90 11.00 0.65 3.15 0.10 11.00 14.20 6.80 0.95 0.32 0.30 44 HSOP 15.90 11.00 0.65 3.20 0.08 12.20 14.20 6.90 0.97 0.29 0.30 All dimensions are in millimeters and are nominal values. OVERVIEW: RELIABILITY: Freescale offers a family of Heatsink Small Outline Packages (HSOP) that have significantly improved thermal performance characteristics as compared to traditional small outline packages (SOIC). The HSOP’s have an internally integrated copper heat slug that provides a direct path for heat conduction away from an IC and into a solder attached PCB board (heatsink or thermal vias). Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Mechanically Attached Thick Copper Heat Slug • Pb-free Terminal Finish • Lead Pitch Ranging from 0.65 mm to 1.27 mm • Gullwing Lead Forms • Rail or Tape & Reel Packing Available 10 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Heatsink Small Outline Surface Mount Package BOTTOM VIEW E3 TOP VIEW b Cross Section D1 D e E1 HSOP E A c A3 L GUIDELINES FOR SOLDERING: The Freescale portfolio of Heatsink Small Outline Packages include the popular "gull wing" lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. The copper slug should be soldered directly to a multi-layered PCB with thermal via holes to realize the greatest potential of the HSOP power packages. APPLICATION NOTE Please refer to application note AN2388 for package information concerning HSOP packages. See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA 30°C/W - 40°C/W JESD51-2 RθJL 12°C/W - 15°C/W JESD51-8 RθJC 0.5°C/W - 1°C/W JESD51-5 Power Dissipation: 2.0 to 4.0 W 11 Packaging Analog Mixed Signal and Power Management Quad Flat Pack Surface Mount Packages (LQFP) 52 LQFP Suffix FTB Pb-free Suffix AE 80 LQFP Suffix FTB Pb-free Suffix AF FTA FTB 64 LQFP Suffix FTA Pb-free Suffix AE FTB 48 LQFP Suffix FTA Pb-free Suffix AE FTA 44 LQFP Suffix FTB Pb-free Suffix AC FTB 32 LQFP Suffix FTB Pb-free Suffix AC QUAD FLAT PACK SURFACE MOUNT PACKAGE DIMENSIONS Body Size Package D1 Lead Pitch E1 e A1 A2 D E L b c LQFP 32 LQFP 7.00 7.00 0.80 0.10 1.40 9.00 9.00 0.60 0.38 0.15 44 LQFP 10.00 10.00 0.80 0.10 1.40 12.00 12.00 0.60 0.38 0.15 48 LQFP 7.00 7.00 0.50 0.10 1.40 9.00 9.00 0.60 0.22 0.15 52 LQFP 10.00 10.00 0.65 0.10 1.40 12.00 12.00 0.60 0.30 0.15 64 LQFP 10.00 10.00 0.50 0.10 1.40 12.00 12.00 0.60 0.22 0.15 80 LQFP 14.00 14.00 0.65 0.10 1.40 16.00 16.00 0.60 0.30 0.15 100 LQFP 14.00 14.00 0.50 0.10 1.40 16.00 16.00 0.60 0.22 0.15 144 LQFP 20.00 20.00 0.50 0.10 1.40 22.00 22.00 0.60 0.22 0.15 All dimensions are in millimeters and are nominal values. OVERVIEW: RELIABILITY: Low-profile quad flat packages (LQFPs) are classified by the overall thickness per JEDEC definition. For Analog Products, Freescale offers both package styles in lead counts ranging from 32 to 144 to cover a large range of applications. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Body Sizes Ranging from 7 mm x 7 mm to 20 mm x 20 mm • Pb-free Terminal Finishes • Gullwing Lead Forms • Lead Pitch Ranging from 0.50 mm to 0.80 mm • Tray Packing Available • JEDEC Compliant Case Outlines • Low Profile “L” (1.4 mm) Body Thickness Options • Exposed Pad “EP” available for Increased Thermal Performance 12 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Quad Flat Pack Surface Mount Packages (LQFP) 144 LQFP Suffix FTA Pb-free Suffix AG FTA FTA 100 LQFP Suffix FTA Pb-free Suffix AF GUIDELINES FOR SOLDERING: Freescale’s broad selection of Quad Flat Pack packages include the popular “gull wing” lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition APPLICATION NOTE RθJA 30°C/W - 80°C/W JESD51-2 Please refer to application note AN4388 for package information concerning QFP packages. RθJL 12°C/W - 55°C/W JESD51-8 RθJC 1°C/W - 2°C/W JESD51-5 Power Dissipation: 2.0 to 5.0 W 13 Packaging Analog Mixed Signal and Power Management Thermally Enhanced Quad Flat Pack Surface Mount Packages 64 LQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AM 128 LQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AK 80 TQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AM 100 TQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AK FTB 48 LQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AM THERMALLY ENHANCED QUAD FLAT PACK SURFACE MOUNT PACKAGE DIMENSIONS Body Size Package D1 E1 Lead Pitch e A1 A2 D E F G L b c LQFP 48 LQFP-EP 7.0 7.0 0.50 0.10 1.40 9.00 9.00 4.50 4.50 0.60 0.20 0.14 64 LQFP-EP 10.00 10.00 0.50 0.10 1.40 12.00 12.00 6.50 6.50 0.60 0.22 0.15 128 LQFP-EP 14.00 20.00 0.50 0.10 1.40 22.00 16.00 9.20 9.20 0.60 0.22 0.15 TQFP 80 TQFP-EP 12.00 12.00 0.50 0.10 1.00 14.00 14.00 5.60 5.60 0.60 0.22 0.15 100 TQFP-EP 14.00 14.00 0.50 0.10 1.00 16.00 16.00 9.00 9.00 0.60 0.22 0.15 128 TQFP-EP 14.00 14.00 0.40 0.10 1.00 16.00 16.00 8.85 8.85 0.60 0.18 0.15 All dimensions are in millimeters and are nominal values. Note: -EP denotes Exposed Thermal Pad OVERVIEW: Thin quad flat packages (TQFPs) and low-profile quad flat packages (LQFPs) are classified by the overall thickness per JEDEC definition. For Analog Products, Freescale offers both package styles in lead counts ranging from 48 to 128 to cover a large range of applications. Exposed pad (LQFP-EP and TQFP-EP) packages are available for increased thermal performance requirements. The exposed pad or copper heat slug should be soldered directly to a multi-layered PCB board to realize the greatest performance. KEY FEATURES: • Body Sizes Ranging from 7 mm x 7 mm to 14 mm x 14 mm • Pb-free Terminal Finishes • Gullwing Lead Forms • Lead Pitch Ranging from 0.40 mm to 0.65 mm • Tray Packing Available • JEDEC Compliant Case Outlines 14 • Low Profile “L” (1.4 mm) and Thin “T” (1.0 mm) Body Thickness Options • Exposed Pad “EP” available for Increased Thermal Performance RELIABILITY: Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Thermally Enhanced Quad Flat Pack Surface Mount Packages 128 TQFP-EP Exposed Pad Suffix FTA Pb-free Suffix AK TOP VIEW BOTTOM VIEW G E E1 F L D1 c EXPOSED PAD D (Exposed Pad) A2 e GUIDELINES FOR SOLDERING: Freescale’s broad selection of Quad Flat Pack packages include the popular "gull wing" lead forms designed to adapt easily to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. b A1 See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition APPLICATION NOTE RθJA 30°C/W - 80°C/W JESD51-2 Please refer to application note AN4388 for package information concerning QFP packages. RθJL 12°C/W - 55°C/W JESD51-8 RθJC 1°C/W - 2°C/W JESD51-5 Power Dissipation: 2.0 to 5.0 W 15 Packaging Analog Mixed Signal and Power Management Dual Flat No-Lead Surface Mount Packages 6 UDFN-EP Suffix FC Pb-free Suffix EP 8 UDFN Suffix FC Pb-free Suffix EP 10 UDFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View Bottom View 6 DFN-EP Suffix FC Pb-free Suffix EP 10 DFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View DUAL FLAT NO-LEAD SURFACE MOUNT PACKAGE DIMENSIONS - UDFN Body Size Package Lead Pitch D1 E1 e A1 A2 F G L b UDFN 6 UDFN-EP 2.00 2.00 0.65 0.02 0.60 0.95 1.40 0.25 0.25 8 UDFN -EP 2.00 3.00 0.50 0.02 0.55 0.95 1.35 0.55 0.25 10 UDFN-EP 3.00 3.00 0.50 0.02 0.55 1.60 2.20 0.40 0.24 6 DFN-EP 3.00 3.00 0.95 0.02 0.80 1.60 2.40 0.40 0.37 10 DFN-EP 3.00 2.00 0.50 0.03 0.90 0.50 0.41 0.40 0.24 DFN All dimensions are in millimeters and are nominal values. Note: -EP denotes Exposed Thermal Pad OVERVIEW: A unique MAP (mold array package) packaging process developed by Freescale is used to create a lead-less surface mount package. Freescale’s dual and quad flat no-lead (DFN, QFN) packages provide a cost-effective answer to the demand for reliable and high performance packaging, including some versions with enhanced thermal management characteristics. KEY FEATURES: • Pb-free Terminal Finishes • 0.40, 0.50, 0.65, 0.80, and 0.95 mm Lead Pitch • Tray Packing Available • JEDEC Compliant Case Outlines • UF-QFN (ultra-thin, fine pitch QFN) package 0.50 to 0.65 mm body thickness RELIABILITY: Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • Exposed Pad (some) • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. • DFN (dual flat no-lead) package 0.50 to 1.00 mm body thickness See PB-FREE Termination Suffix: • UDFN (ultra-thin DFN) package 0.50 to 0.65 mm body thickness 16 Analog Mixed Signal and Power Management Packaging Quad Flat No-Lead Surface Mount Packages 16 QFN-EP Suffix FC Pb-free Suffix EP 16 QFN-EP Suffix FC Pb-free Suffix EP 20 UF-QFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View Bottom View 20 UF-QFN-EP Suffix FC Pb-free Suffix EP 20 UF-QFN-EP Suffix FC Pb-free Suffix EP Bottom View 20 UF-QFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View QUAD FLAT NO-LEAD SURFACE MOUNT PACKAGE DIMENSIONS - QFN Body Size Package D1 Lead Pitch E1 e A1 A2 F G L b QFN 16 QFN-EP 3.00 3.00 0.50 0.03 0.90 1.60 1.60 0.40 0.24 16 QFN-EP 5.00 5.00 0.80 0.03 0.90 3.60 3.60 0.55 0.30 20 UF-QFN-EP 3.00 3.00 0.40 0.03 0.56 1.68 1.68 0.40 0.20 20 UF-QFN-EP 3.00 4.00 0.50 0.03 0.58 2.63 1.63 0.40 0.24 20 UF-QFN-EP 4.00 3.00 0.50 0.03 0.55 1.65 2.65 0.40 0.24 20 UF-QFN-EP 4.00 4.00 0.50 0.03 0.58 2.80 2.80 0.40 0.24 24 QFN-EP 4.00 4.00 0.50 0.03 0.90 2.60 2.60 0.40 0.24 24 UF-QFN-EP 4.00 4.00 0.50 0.03 0.58 2.80 2.80 0.40 0.24 26 QFN-EP 5.00 5.00 0.50 0.03 0.90 3.65 3.65 0.40 0.24 32 QFN -EP 5.00 5.00 0.50 0.03 0.90 3.10 3.10 0.40 0.24 32 QFN -EP 5.00 5.00 0.50 0.03 0.90 3.65 3.65 0.40 0.24 32 QFN-EP 7.00 7.00 0.65 0.03 0.90 4.70 4.70 0.63 0.30 32 QFN-EP 5.00 5.00 0.50 0.03 0.90 3.50 3.50 0.50 0.24 44 QFN-EP 9.00 9.00 0.65 0.03 0.90 6.70 6.70 0.63 0.30 48 QFN-EP 7.00 7.00 0.50 0.03 1.00 5.10 5.10 0.40 0.24 56 QFN-EP 7.00 7.00 0.40 0.03 0.90 5.10 5.10 0.40 0.20 56 QFN 8.00 8.00 0.50 0.03 0.90 n/a n/a 0.40 0.24 64 QFN 9.00 9.00 0.50 0.30 0.75 n/a n/a 0.63 0.24 All dimensions are in millimeters and are nominal values. Note: -EP denotes Exposed Thermal Pad 17 Packaging Analog Mixed Signal and Power Management Quad Flat No-Lead Surface Mount Packages (cont.) 24 QFN-EP Suffix FC Pb-free Suffix EP 24 UF-QFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View 26 QFN-EP Suffix FC Pb-free Suffix EP 32 QFN-EP Suffix FC Pb-free Suffix EP Bottom View Bottom View 32 QFN-EP Suffix FC Pb-free Suffix EP Bottom View TOP VIEW e TOP VIEW D1 DFN (Dual) L F Bottom View BOTTOM VIEW G b Exposed Metal Pad 32 QFN-EP Suffix FC Pb-free Suffix EP QFN (Quad) E1 F E1 G D1 BOTTOM VIEW Exposed Metal Pad L A1 A2 Cross Section SIDE VIEW A2 b DFN, QFN e DETAIL G See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA 35°C/W - 80°C/W JESD51-2 RθJL 12°C/W - 55°C/W JESD51-8 RθJC 1°C/W - 2°C/W JESD51-5 Power Dissipation: 1.5 to 5.0 W 18 A1 Analog Mixed Signal and Power Management Packaging Quad Flat No-Lead Surface Mount Packages (cont.) 44 QFN-EP Suffix FC Pb-free Suffix EPP 48 QFN-EP Suffix FC Pb-free Suffix EP 56 QFN-EP Suffix FC Pb-free Suffix EP 56 QFN Suffix FC Pb-free Suffix EP Bottom View Bottom View Bottom View Bottom View 64 QFN Suffix FC Pb-free Suffix EP Bottom View GUIDELINES FOR SOLDERING: Freescale’s selection of Dual and Quad Flat No-Lead Packages provide space efficient solutions for surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. The exposed pad or copper heat slug should be soldered directly to a multi-layered PCB board to realize the greatest performance. APPLICATION NOTE Please refer to application note AN1902 for package information concerning QFN packages. 19 Packaging Analog Mixed Signal and Power Management Power Quad Flat No-Lead Surface Mount Packages 16 PQFN 5 mm x 5 mm Pb-free Suffix PNB 32 PQFN 8 mm x 8 mm Pb-free Suffix PNB 36 PQFN 9 mm x 9 mm Pb-free Suffix PNB Bottom View Bottom View Bottom View POWER QUAD FLAT NO-LEAD SURFACE MOUNT PACKAGE - (PQFN) Body Size Package A Lead Pitch B e A1 F G L b PQFN 16 PQFN 5 5 0.80 2.10 2.0 2.0 1.05 0.55 32 PQFN 8 8 0.80 2.10 5.0 5.0 1.05 0.54 36 PQFN 9 9 0.80 2.10 6.0 6.0 1.05 0.54 All dimensions are in millimeters and are nominal values. OVERVIEW: RELIABILITY: A unique MAP packaging process developed by Freescale is used to create a lead-less surface mount package with enhanced thermal capability. Freescale’s Power Quad Flat No-Lead (PQFN) packages provide a cost-effective answer to the demand for reliable and high performance packaging with enhanced thermal management characteristics in a small form factor. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Pb-free Terminal Finishes • 0.8 mm Lead Pitch • Tray Packing Available • Exposed Pad(s) • Quick time to market for new devices 20 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Power Quad Flat No-Lead Surface Mount Packages F A G B Exposed Metal Pad b L A1 e GUIDELINES FOR SOLDERING: Freescale’s selection of Quad Flat No-Lead Packages provide space efficient solutions for surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. The exposed pad or copper heat slug should be soldered directly to a multi-layered PCB board to realize the greatest performance. APPLICATION NOTE See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA Refer to Product Data Sheet RθJA Refer to Product Data Sheet RθJA Refer to Product Data Sheet Please refer to application note AN2467 for package information concerning PQFN packages. 21 Packaging Analog Mixed Signal and Power Management Power Quad Flat No-Lead Surface Mount Packages 23 PQFN 12 mm x 12 mm Pb-free Suffix PNA 16 PQFN 12 mm x 12 mm Pb-free Suffix PNA 24 PQFN 12 mm x 12 mm Pb-free Suffix PNA 36 PQFN 12 mm x 12 mm Pb-free Suffix PNB Bottom View Bottom View Bottom View Bottom View POWER QUAD FLAT NO-LEAD SURFACE MOUNT PACKAGE - (PQFN) Body Size Package A Lead Pitch B e A1 PQFN 23 PQFN 12 12 0.90 2.10 16/24 PQFN 12 12 0.90 2.10 36 PQFN 12 12 0.80 2.10 All dimensions are in millimeters and are nominal values. Notes: Heatsink pads location and size may vary. Refer to the Device Data Sheet for actual physical dimensions. Freescale is investigating other pin pitches, including 0.65 mm (suffix PNC). OVERVIEW: RELIABILITY: A unique MAP packaging process developed by Freescale is used to create a lead-less surface mount package with enhanced thermal capability. Freescale’s Power Quad Flat No-Lead (PQFN) packages provide a cost-effective answer to the demand for reliable and high performance packaging with enhanced thermal management characteristics in a small form factor. Freescale subjects their packages to rigorous testing to ensure reliable performance and compatibility with surface mount assembly processes. KEY FEATURES: • Pb-free Terminal Finishes • 0.8, and 0.9 mm Lead Pitch • Tray Packing Available • Exposed Pad(s) • Quick time to market for new devices 22 • For Moisture Sensitivity levels and Peak Package Temperature, please refer to the “More Info” entry, in the part number ordering table, found at: www.freescale.com. Do a search by part number (e.g. MC34845 or 34845) for the particular Freescale device, to locate the device’s part number ordering table. Then select the "Part Data" icon in the Data Sheet/Part Data column. • All package qualifications performed per the latest version of the AEC-Q100 testing procedures. Analog Mixed Signal and Power Management Packaging Power Quad Flat No-Lead Surface Mount Packages A Heatsink/Pin Layouts Vary by Device for Each Package or Product A1 B e e (Lead pitch “e” 0.80mm) (Lead pitch “e” 0.90mm) GUIDELINES FOR SOLDERING: Freescale’s selection of Quad Flat No-Lead Packages provide space efficient solutions for surface mount (SMT) processes. With the correct pad footprint geometry, the packages will self align to the PCB board when subjected to a solder reflow process. The exposed pad or copper heat slug should be soldered directly to a multi-layered PCB board to realize the greatest performance. Please refer to application note AN2467 for soldering details. APPLICATION NOTE See THERMAL ADDENDUM: Thermal Resistance Typical Values Test Condition RθJA Refer to Product Data Sheet RθJA Refer to Product Data Sheet RθJA Refer to Product Data Sheet Please refer to application note AN2467 for package information concerning PQFN packages. 23 Soldering Footprint: The Analog and Mixed Signal Products Division of Freescale has a long history of serving the commercial and automotive marketplace, and vast experience with the automotive industry’s quality requirements / expectations. Freescale can provide suggested package footprints for the various package types suitable for the layout of printed circuit assemblies.The information can be requested at www.freescale.com/ support by choosing the “Create Service Request” item. First, gather information to place in the service request. On the www.Freescale.com home page, enter the product number into the keyword search box (top right), such as MC33988. Next choose the MC33988 product summary page (.has a html suffix) line item, from the results list. On the product summary page, click on the Buy/Parameter tab. This will provide access to the package drawing information. On the Buy /Parameter page, click on the item in the Package Description and Diagram column (blue text). This will link to a product infromation web page. Now click on the item in the value column for the Package Description and Mechanical Drawing line item. Note the Document number on the package drawing (document number - 98A......) that appears. This information along with the product number should be placed in the Request Details Subject and Description blocks for the Customer Service Request. Now go to www.freescale.com/support and choose the “Create Service Request” item, then choose step 1/category - Hardware Product Support and step 2/ topic - Generic Design Questions. Click the Next button. In the Device type selection area, select the product number from the product tree; e.g. Analog & Power Management/Power Actuation/ High side switches/MC33988. Click the Next button. Also, include the information that you are requesting relative to the package solder footprint. Be sure to include the package drawing information gather initially above. Click the Submit button to have your service request submitted. Learn More: For current information about Freescale products and documentation, please visit www.freescale.com. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2007-2012. All rights reserved. Document Number: BR1568 REV. 6.0