RENESAS CR5AS-12-T13

CR5AS-12
Thyristor
Medium Power Use
REJ03G0345-0200
Rev.2.00
Mar.01.2005
Features
• IT (AV) : 5 A
• VDRM : 600 V
• IGT : 100 µA
• Non-Insulated Type
• Glass Passivation Type
Outline
PRSS0004ZA-A
(Package name: MP-3A)
4
2, 4
3
12
3
1
1.
2.
3.
4.
Cathode
Anode
Gate
Anode
Applications
Switching mode power supply, regulator for autocycle, protective circuit for TV sets, VCRs, and printers, igniter for
autocycle, electric tool, strobe flasher, and other general purpose control applications
Maximum Ratings
Parameter
Repetitive peak reverse voltage
Non-repetitive peak reverse voltage
DC reverse voltage
Repetitive peak off-state voltageNote1
DC off-state voltageNote1
Rev.2.00, Mar.01.2005, page 1 of 7
Symbol
VRRM
VRSM
VR (DC)
VDRM
VD (DC)
Voltage class
12
600
720
480
600
480
Unit
V
V
V
V
V
CR5AS-12
Parameter
RMS on-state current
Average on-state current
Symbol
IT (RMS)
IT (AV)
Ratings
7.8
5
Unit
A
A
ITSM
90
A
I2 t
33
A2s
PGM
PG (AV)
VFGM
VRGM
IFGM
Tj
Tstg
—
0.5
0.1
6
6
0.3
– 40 to +125
– 40 to +125
0.26
W
W
V
V
A
°C
°C
g
Surge on-state current
I2t for fusing
Peak gate power dissipation
Average gate power dissipation
Peak gate forward voltage
Peak gate reverse voltage
Peak gate forward current
Junction temperature
Storage temperature
Mass
Conditions
Commercial frequency, sine half wave
180° conduction, Tc = 88°C
60Hz sine half wave 1 full cycle,
peak value, non-repetitive
Value corresponding to 1 cycle of half
wave 60Hz, surge on-state current
Typical value
Notes: 1. With gate to cathode resistance RGK = 220 Ω.
Electrical Characteristics
Parameter
Repetitive peak reverse current
Symbol
IRRM
Min.
—
Typ.
—
Max.
2.0
Unit
mA
Repetitive peak off-state current
IDRM
—
—
2.0
mA
On-state voltage
VTM
—
—
1.8
V
Gate trigger voltage
Gate non-trigger voltage
VGT
VGD
—
0.1
—
—
0.8
—
V
V
Gate trigger current
Holding current
IGT
IH
1
—
—
3.5
100Note3
—
µA
mA
Thermal resistance
Rth (j-c)
—
—
3.0
°C/W
Test conditions
Tj = 125°C, VRRM applied,
RGK = 220 Ω
Tj = 125°C, VDRM applied,
RGK = 220 Ω
Tc = 25°C, ITM = 15 A,
instantaneous value
Tj = 25°C, VD = 6 V, IT = 0.1 A
Tj = 125°C, VD = 1/2 VDRM,
RGK = 220 Ω
Tj = 25°C, VD = 6 V, IT = 0.1 A
Tj = 25°C, VD = 12 V,
RGK = 220 Ω
Junction to caseNote2
Notes: 2. The measurement point for case temperature is at anode tab.
3. If special value of IGT is required, IGT from 20 to 100 µA is possible. (IGT item: E)
Rev.2.00, Mar.01.2005, page 2 of 7
CR5AS-12
Performance Curves
102
7 Tc = 25°C
5
3
2
Rated Surge On-State Current
100
Surge On-State Current (A)
On-State Current (A)
Maximum On-State Characteristics
101
7
5
3
2
100
7
5
3
2
7
5
3
2
VFGM = 6V
PGM = 0.5W
PG(AV) = 0.1W
VGT = 0.8V
IGT = 100µA IFGM = 0.3A
(Tj = 25°C)
7
VGD = 0.1V
5 -2
10 23 5710-1 23 57 100 23 57 10123 57102 23
20
10
2 3 4 5 7 101
2 3 4 5 7 102
× 100 (%)
103
7
5
3
2
#1
#2
Typical Example
IGT(25°C)
#1
11µA
#2
61µA
102
7
5
3
2
101
7
5
3 V = 6V
2 D
RL = 60Ω
100
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
Gate Trigger Voltage vs.
Junction Temperature
Maximum Transient Thermal
Impedance Characteristics
(Junction to case, Junction to ambient)
Tj = 25°C
Gate Trigger Voltage (V)
30
Gate Current (mA)
1.0
0.9
0.7
40
Gate Trigger Current vs.
Junction Temperature
–1
0.8
50
Gate Characteristics
Gate Trigger Current (Tj = t°C)
Gate Trigger Current (Tj = 25°C)
100
60
Conduction Time (Cycles at 60Hz)
Distribution
Typical Example
0.6
0.5
0.4
0.3
0.2
0.1
0
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
Rev.2.00, Mar.01.2005, page 3 of 7
Transient Thermal Impedance (°C/W)
Gate Voltage (V)
7
5
3
2
70
On-State Voltage (V)
102
101
80
0
100
10–1
0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8
7
5
3
2
90
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
103
7
5
3
2
Junction to ambient
102
7
5
3
2
101
7
5
3
2
Junction to case
100
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100
Time (s)
CR5AS-12
Allowable Case Temperature vs.
Average On-State Current
(Single-Phase Half Wave)
Maximum Average Power Dissipation
(Single-Phase Half Wave)
14
90° 120°
12
60°
10
8
6
θ = 30°
θ
4
360°
2
0
160
180°
Case Temperature (°C)
Average Power Dissipation (W)
16
1
2
3
4
5
6
7
Resistive,
inductive loads
100
80
60
40
0
8
θ = 30°
90°
0
1
2
3
180°
120°
4
5
6
7
8
Average On-State Current (A)
Average On-State Current (A)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Half Wave)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Half Wave)
140
θ
120
360°
Resistive,
inductive loads
Natural convection
100
80
60
θ = 30°
40
60°
90°
120°
20
180°
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Ambient Temperature (°C)
160
140
θ
120
360°
Resistive,
inductive loads
Natural convection
100
80
60
θ = 30°
60°
90°
20
120°
180°
0
0
2
1
Aluminum Board
80×80×t2.3
40
3
4
5
6
8
7
Average On-State Current (A)
Average On-State Current (A)
Maximum Average Power Dissipation
(Single-Phase Full Wave)
Allowable Case Temperature vs.
Average On-State Current
(Single-Phase Full Wave)
16
160
14
140
θ
120
360°
Resistive loads
θ
12
θ
Case Temperature (°C)
Ambient Temperature (°C)
360°
60°
160
Average Power Dissipation (W)
θ
120
20
Resistive,
inductive loads
0
140
180°
360°
10 Resistive
loads
8
90°
θ = 30° 60°
120°
6
4
2
0
100
80
60
40
θ = 30°
20
0
1
2
3
4
5
6
7
Average On-State Current (A)
Rev.2.00, Mar.01.2005, page 4 of 7
8
θ
0
0
1
2
60° 90° 120° 180°
3
4
5
6
7
Average On-State Current (A)
8
CR5AS-12
160
140
140
θ
360°
Resistive loads
Natural convection
100
80
60 θ = 30°
60°
40
90°
120°
20
180°
0
θ
θ
360°
Resistive loads
Natural convection
100
80
θ = 30°
60°
90°
120°
180°
60
40
20
0
1
2
3
4
5
6
7
Average On-State Current (A)
Average On-State Current (A)
Breakover Voltage vs.
Junction Temperature
Breakover Voltage vs.
Gate to Cathode Resistance
160
Typical Example
RGK = 220Ω
140
120
100
80
60
40
20
0
–40 –20 0 20 40 60 80 100 120 140 160
160
Aluminum Board
80×80×t2.3
120
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Breakover Voltage (RGK = rkΩ)
Breakover Voltage (RGK = 220Ω) × 100 (%)
× 100 (%)
Breakover Voltage (Tj = t°C)
Breakover Voltage (Tj = 25°C)
× 100 (%)
θ
120
Ambient Temperature (°C)
160
0
Breakover Voltage (dv/dt = vV/µs)
Breakover Voltage (dv/dt = 1V/µs)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Full Wave)
103
7 Typical Example
5
3
2
102
7
5
3
2
101
7
5
3
2
100
10-2 2 3 5 710-1 2 3 5 7100 2 3 5 7 101
Gate to Cathode Resistance (kΩ)
Breakover Voltage vs.
Rate of Rise of Off-State Voltage
Holding Current vs.
Junction Temperature
Typical Example
140
102
Tj = 125°C
RGK = 220Ω
120
100
80
60
40
20
0
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
Rate of Rise of Off-State Voltage (V/µs)
Rev.2.00, Mar.01.2005, page 5 of 7
8
Tj = 125°C
Junction Temperature (°C)
Holding Current (mA)
Ambient Temperature (°C)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Full Wave)
7
5
4
3
2
Distribution
Typical Example
101
7
5
4
3
2
100
7
5
4
3 VD = 12V
2
RGK = 220Ω
10–1
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
400
Typical Example
IGT(25°C) IH(220Ω)
350
14µA
1.7mA
#1
48µA
2.7mA
300 # 2
Tj = 25°C
250
#1
200
#2
150
100
50
0 -2
10 2 3 5 710-1 2 3 5 7 100 2 3 5 7 101
Gate to Cathode Resistance (kΩ)
Gate Trigger Current (tw)
Gate Trigger Current (DC)
× 100 (%)
Gate Trigger Current vs.
Gate Current Pulse Width
104
7
5
3
2
103
7
5
3
2
#1
#2
Typical Example
IGT(DC)
#1
11µA
#2
61µA
102
7
5
V = 6V
3 D
2 RL = 60Ω
Ta = 25°C
101
0
10
2 3 4 5 7 101
2 3 4 5 7 102
Gate Current Pulse Width (µs)
Rev.2.00, Mar.01.2005, page 6 of 7
Repetitive Peak Reverse Voltage (Tj = t°C)
Repetitive Peak Reverse Voltage (Tj = 25°C)
Holding Current (RGK = rkΩ)
Holding Current (RGK = 1kΩ)
× 100 (%)
Holding Current vs.
Gate to Cathode Resistance
× 100 (%)
CR5AS-12
Repetitive Peak Reverse Voltage vs.
Junction Temperature
160
Typical Example
140
120
100
80
60
40
20
0
–40 –20 0 20 40 60 80 100 120 140 160
Junction Temperature (°C)
CR5AS-12
Package Dimensions
RENESAS Code
Package Name
MASS[Typ.]
SC-63
PRSS0004ZA-A
MP-3A
0.32g
0.76
0.1 ± 0.1
1.4 ± 0.2
6.1 ± 0.2
0.5 ± 0.2
2.5Min
1Max
0.76 ± 0.2
Unit: mm
2.3
10.4Max
6.6
5.3 ± 0.2
1 ± 0.2
JEITA Package Code
0.5 ± 0.2
1
2.3
2.3 ± 0.2
Order Code
Lead form
Standard packing
Quantity
Standard order code
Surface-mounted type Taping
3000 Type name – T +Direction (1 or 2) +3
Surface-mounted type Tube
75 Type name
Note : Please confirm the specification about the shipping in detail.
Rev.2.00, Mar.01.2005, page 7 of 7
Standard order
code example
CR5AS-12-T13
CR5AS-12
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0