TI DS91M124

DS91M124
DS91M124 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input
Literature Number: SNLS287D
DS91M124
125 MHz 1:4 M-LVDS Repeater with LVCMOS Input
General Description
Features
The DS91M124 is a 1:4 M-LVDS repeater for driving and distributing clock or data signals to up to four multipoint networks.
M-LVDS (Multipoint LVDS) is a new family of bus interface
devices based on LVDS technology specifically designed for
multipoint and multidrop cable and backplane applications. It
differs from standard LVDS in providing increased drive current to handle double terminations that are required in multipoint applications. Controlled transition times minimize reflections that are common in multipoint configurations due to
unterminated stubs.
A single DS91M124 channel is a 1:4 repeater that accepts
LVTTL/LVCMOS signals at the driver inputs and converts
them to differential M-LVDS signal levels. It features independent driver enable pins for each driver output.
The DS91M124 has a flow-through pinout for easy PCB layout. It provides a new alternative for high speed multipoint
interface applications. It is packaged in a space saving
SOIC-16 package.
■ DC - 125 MHz / 250 Mbps low jitter, low skew, low power
■
■
■
■
■
■
■
operation
Independent Driver Enable pins
Conforms to TIA/EIA-899 M-LVDS Standard
Controlled transition times minimize reflections
8 kV ESD on M-LVDS I/O pins protects adjoining
components
Flow-through pinout simplifies PCB layout
Industrial operating temperature range (−40°C to +85°C)
Available in a space saving SOIC-16 package
Applications
■ Multidrop / Multipoint clock and data distribution
■ High-Speed, Low Power, Short-Reach alternative to TIA/
EIA-485/422
■ Clock distribution in AdvancedTCA (ATCA) and MicroTCA
(μTCA) backplanes
Typical Application
30049802
© 2009 National Semiconductor Corporation
300498
www.national.com
DS91M124 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input
November 9, 2009
DS91M124
Ordering Information
Order Number
Function
Package Type
DS91M124TMA
1:4 Repeater
SOIC-16
Pin Diagram
30049801
Logic Diagram
30049803
Pin Descriptions
Number
Name
I/O, Type
Description
1, 2, 3, 8
DE
I, LVCMOS
Driver enable pin: When a DE pin is low, the corresponding driver
output is disabled. When a DE pin is high, the corresponding
driver output is enabled. There is a 300 kΩ pulldown resistor on
each DE pin.
6
DI
I, LVCMOS
Driver input pin.
5
GND
Power
10, 11, 14, 15
A
O, M-LVDS
Non-inverting driver output pins.
9, 12, 13, 16
B
O, M-LVDS
Inverting driver output pins.
4
VDD
Power
7
N/C
N/A
www.national.com
Ground pin.
Power supply pin, +3.3V ± 0.3V
NO CONNECT pin.
2
ESD Susceptibility
HBM (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
CDM (Note 3)
Power Supply Voltage
−0.3V to +4V
LVCMOS Input Voltage
−0.3V to (VDD + 0.3V)
M-LVDS Output Voltage
−1.9V to +5.5V
M-LVDS Output Short Circuit
Current Duration
Continuous
Junction Temperature
+140°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature Range
Soldering (4 sec.)
+260°C
Maximum Package Power Dissipation @ +25°C
MA Package
2.21W
Derate MA Package
19.2 mW/°C above +25°C
Package Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC)
θJA
+52°C/W
θJC
+19°C/W
≥8 kV
≥250V
≥1250V
MM (Note 2)
Note 1: Human Body Model, applicable std. JESD22-A114C
Note 2: Machine Model, applicable std. JESD22-A115-A
Note 3: Field Induced Charge Device Model, applicable std.
JESD22-C101-C
Recommended Operating
Conditions
Min Typ Max Units
3.0 3.3 3.6
V
−1.4
+3.8
V
Supply Voltage, VDD
Voltage at Any Bus Terminal
(Separate or Common-Mode)
LVTTL Input Voltage High VIH
2.0
LVTTL Input Voltage Low VIL
0
Operating Free Air
Temperature TA
−40
+25
VDD
0.8
V
V
+85
°C
DC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Note 5, Note 6, Note 7, Note 10)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VDD
V
LVCMOS DC Specifications
VIH
High-Level Input Voltage
2.0
VIL
Low-Level Input Voltage
0.8
V
IIH
High-Level Input Current
VIH = 3.6V
-15
±1
15
μA
IIL
Low-Level Input Current
VIL = 0V
-15
±1
15
μA
VCL
Input Clamp Voltage
IIN = -18 mA
-1.5
GND
V
M-LVDS DC Specifications
|VAB|
Differential Output Voltage Magnitude
ΔVAB
Change in Differential Output Voltage Magnitude
Between Logic States
VOS(SS)
Steady-State Common-Mode Output Voltage
|ΔVOS(SS)|
Change in Steady-State Common-Mode Output
Voltage Between Logic States
VA(OC)
Maximum Steady-State Open-Circuit Output Voltage
VB(OC)
Maximum Steady-State Open-Circuit Output Voltage
VP(H)
Voltage Overshoot, Low-to-High Level Output
(Note 8)
VP(L)
Voltage Overshoot, High-to-Low Level Output
(Note 8)
IOS
Output Short-Circuit Current (Note 9)
RL = 50Ω, CL = 5 pF
Figures 1, 3
Figures 1, 2
RL = 50Ω
Figure 4
RL = 50Ω, CL = 5 pF
CD = 0.5 pF
Figures 6, 7
Figure 5
IB
IAB
Driver High-Impedance Output Current
Driver High-Impedance Output Current
Driver High-Impedance Output Differential Curent
(IA − IB)
3
650
mV
−50
50
mV
2.10
V
0
50
mV
0
2.4
V
0
2.4
V
0.30
1.6
1.2VSS
V
V
−0.2VSS
-43
43
mA
0
32
μA
VA = 0V or 2.4V, VB = 1.2V
−20
20
μA
VA = −1.4V, VB = 1.2V
−32
0
μA
VA = 3.8V, VB = 1.2V
0
32
μA
VA = 0V or 2.4V, VB = 1.2V
−20
20
μA
VA = −1.4V, VB = 1.2V
−32
0
μA
VA = VB, −1.4V ≤ V ≤ 3.8V
−4
4
VA = 3.8V, VB = 1.2V
IA
480
μA
www.national.com
DS91M124
Absolute Maximum Ratings (Note 4)
DS91M124
Symbol
IA(OFF)
Parameter
Conditions
Driver High-Impedance Output Power-Off Current
VA = 3.8V, VB = 1.2V
DEn = 0V
Min
Typ
Max
Units
μA
0
32
VA = 0V or 2.4V, VB = 1.2V
DEn = 0V
−20
20
VA = −1.4V, VB = 1.2V
DEn = 0V
−32
0
VA = 3.8V, VB = 1.2V
DEn = 0V
0
32
VA = 0V or 2.4V, VB = 1.2V
DEn = 0V
−20
20
VA = −1.4V, VB = 1.2V
DEn = 0V
−32
0
VA = VB, −1.4V ≤ V ≤ 3.8V
DEn = 0V
−4
4
0V ≤ VDD ≤ 1.5V
μA
0V ≤ VDD ≤ 1.5V
μA
0V ≤ VDD ≤ 1.5V
IB(OFF)
Driver High-Impedance Output Power-Off Current
μA
0V ≤ VDD ≤ 1.5V
μA
0V ≤ VDD ≤ 1.5V
μA
0V ≤ VDD ≤ 1.5V
IAB(OFF)
Driver High-Impedance Output Power-Off Current
(IA(OFF) − IB(OFF))
μA
0V ≤ VDD ≤ 1.5V
CA
Driver Output Capacitance
CB
Driver Output Capacitance
CAB
Driver Output Differential Capacitance
CA/B
Driver Output Capacitance Balance (CA/CB)
ICCL
Loaded Supply Current Enabled
ICCZ
VDD = 0V
7.8
pF
7.8
pF
3
pF
1
No Load Supply Current Disabled
RL = 50Ω (All Outputs)
DI = VDD or GND
DEn = VDD or GND (All
Outputs)
65
75
mA
DI = VDD or GND,
DEn = GND (All Outputs)
19
24
mA
Note 4: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 5: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 6: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and
ΔVOD.
Note 7: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of
product characterization and are not guaranteed.
Note 8: Specification is guaranteed by characterization and is not tested in production.
Note 9: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Note 10: CL includes fixture capacitance and CD includes probe capacitance.
www.national.com
4
Over supply voltage and operating temperature ranges, unless otherwise specified. (Note 11, Note 12, Note 18)
Min
Typ
Max
Units
tPHL
Symbol
Differential Propagation Delay High to Low
Parameter
Conditions
1.8
3.9
6.5
ns
tPLH
Differential Propagation Delay Low to High
1.8
3.9
6.5
ns
tSKD1
Differential Pulse Skew |tPHL − tPLH| (Note 13, Note 14)
0
25
100
ps
tSKD2
Channel-to-Channel Skew (Note 13, Note 15)
0
70
250
ps
tSKD3
Differential Part-to-Part Skew (Note 13, Note 16)
(Constant TA and VDD)
0
1.5
2
ns
tSKD4
Differential Part-to-Part Skew (Note 13, Note 17)
4.7
ns
tTLH
Rise Time (Note 13)
1.1
2.0
3.0
ns
tTHL
Fall Time (Note 13)
1.1
2.0
3.0
ns
tPHZ
Disable Time High to Z
6
11
ns
tPLZ
Disable Time Low to Z
6
11
ns
tPZH
Enable Time Z to High
6
11
ns
tPZL
Enable Time Z to Low
6
11
fMAX
Maximum Operating Frequency (Note 13)
RL = 50Ω
CL = 5 pF,
CD = 0.5 pF
Figures 6, 7
0
RL = 50Ω
CL = 5 pF,
CD = 0.5 pF
Figures 8, 9
125
ns
MHz
Note 11: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 12: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of
product characterization and are not guaranteed.
Note 13: Specification is guaranteed by characterization and is not tested in production.
Note 14: tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
Note 15: tSKD2, Channel-to-Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels.
Note 16: tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to
devices at the same VDD and within 5°C of each other within the operating temperature range.
Note 17: tSKD4, Part-to-Part Skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over
recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.
Note 18: CL includes fixture capacitance and CD includes probe capacitance.
5
www.national.com
DS91M124
Switching Characteristics
DS91M124
Test Circuits and Waveforms
30049814
FIGURE 1. Differential Driver Test Circuit
30049844
FIGURE 2. Differential Driver Waveforms
30049822
FIGURE 3. Differential Driver Full Load Test Circuit
www.national.com
6
DS91M124
30049812
FIGURE 4. Differential Driver DC Open Test Circuit
30049825
FIGURE 5. Differential Driver Short-Circuit Test Circuit
30049816
FIGURE 6. Driver Propagation Delay and Transition Time Test Circuit
7
www.national.com
DS91M124
30049818
FIGURE 7. Driver Propagation Delays and Transition Time Waveforms
30049819
FIGURE 8. Driver TRI-STATE Delay Test Circuit
30049821
FIGURE 9. Driver TRI-STATE Delay Waveforms
www.national.com
8
DS91M124
Typical Performance Characteristics
30049850
30049852
Driver Rise Time as a Function of Temperature
Driver Propagation Delay (tPLHD) as a Function of
Temperature
30049851
Driver Fall Time as a Function of Temperature
30049853
Driver Propagation Delay (tPHLD) as a Function of
Temperature
30049858
Driver Output Signal Amplitude as a Function of
Resistive Load
30049854
Driver Power Supply Current as a Function of Frequency
9
www.national.com
DS91M124
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead (0.150″ Wide) Molded Small Outline Package, JEDEC
Order Number DS91M124TMA
NS Package Number M16A
www.national.com
10
DS91M124
Notes
11
www.national.com
DS91M124 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input
Notes
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
Products
Design Support
Amplifiers
www.national.com/amplifiers
WEBENCH® Tools
www.national.com/webench
Audio
www.national.com/audio
App Notes
www.national.com/appnotes
Clock and Timing
www.national.com/timing
Reference Designs
www.national.com/refdesigns
Data Converters
www.national.com/adc
Samples
www.national.com/samples
Interface
www.national.com/interface
Eval Boards
www.national.com/evalboards
LVDS
www.national.com/lvds
Packaging
www.national.com/packaging
Power Management
www.national.com/power
Green Compliance
www.national.com/quality/green
Switching Regulators
www.national.com/switchers
Distributors
www.national.com/contacts
LDOs
www.national.com/ldo
Quality and Reliability
www.national.com/quality
LED Lighting
www.national.com/led
Feedback/Support
www.national.com/feedback
Voltage Reference
www.national.com/vref
Design Made Easy
www.national.com/easy
www.national.com/powerwise
Solutions
www.national.com/solutions
Mil/Aero
www.national.com/milaero
PowerWise® Solutions
Serial Digital Interface (SDI) www.national.com/sdi
Temperature Sensors
www.national.com/tempsensors SolarMagic™
www.national.com/solarmagic
Wireless (PLL/VCO)
www.national.com/wireless
www.national.com/training
PowerWise® Design
University
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2009 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: [email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor Europe
Technical Support Center
Email: [email protected]
National Semiconductor Asia
Pacific Technical Support Center
Email: [email protected]
National Semiconductor Japan
Technical Support Center
Email: [email protected]
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated