SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array HF RoHS Pb GREEN SP3001 Lead-Free/Green Series Description The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t&4%QSPUFDUJPOPGL7 contact discharge, ±15kV air discharge, (IEC61000-4-2) t4NBMM4$QBDLBHF saves board space t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) I/O 3 t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2.5A (8/20μs) Applications I/O4 VCC t $PNQVUFS1FSJQIFSBMT t/FUXPSL)BSEXBSF1PSUT t.PCJMF1IPOFT t5FTU&RVJQNFOU t1%"T t.FEJDBM&RVJQNFOU t%JHJUBM$BNFSBT I/O1 GND I/O3 -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 39 Revised: February 9, 2010 SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 Functional Block Diagram I/O2 t-PXDBQBDJUBODFPG 0.65pF (TYP) per I/O SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol Parameter Value Units 2.5 A Operating Temperature -40 to 85 °C Storage Temperature -50 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1μA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 μA Clamp Voltage1 VC ESD Withstand Voltage1 Diode Capacitance1 1 Diode Capacitance VESD C*0(/% Min Typ IPP=1A, tp=8/20μs, Fwd 9.5 11.0 V IPP=2A, tp=8/20μs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.8 0.9 pF Reverse Bias=1.65V 0.55 0.65 pF CI/O-I/O Reverse Bias=0V 0.35 pF /PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO SP3001 Lead-Free/Green Series 40 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1 1.00 0 0.95 -1 0.90 I/O Capacitance (pF) Insertion Loss [dB] -2 -3 -4 -5 -6 -7 0.85 0.80 VCC = Float 0.75 0.70 VCC = 3.3V 0.65 VCC = 5V -8 0.60 -9 0.55 -10 0.50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Frequency [Hz] Capacitance vs. Frequency 1.4E-12 1.2E-12 Capacitance [F] 1E-12 8E-13 6E-13 4E-13 0 1.E+06 1.E+07 1.E+08 Lead-Free/Green SP3001 2E-13 1.E+09 Frequency [Hz] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 41 Revised: February 9, 2010 SP3001 Lead-Free/Green Series SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be nPBUFEPS/$ HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow Pb – Free assembly 3°C/second max 3°C/second max - Temperature (TL) (Liquidus) ¡$ - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tP) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP3001 Lead-Free/Green Series 42 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SC70-6 e 6 5 Package SC70-6 Pins 6 4 E JEDEC HE MO-203 Issue A Millimeters 2 1 3 B D A2 A A1 C Solder Pad Layout Min Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.089 E 1.15 1.35 0.045 0.053 e L Part Numbering System Inches 0.65 BSC 0.026 BSC HE 2.00 2.40 0.094 L 0.26 0.46 0.010 0.018 Product Characteristics SP3001-04 J T G Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels J = SC70-6, 3000 quantity -04 = 4 channel Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. DX4 DX4 Product Series 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Channels 6. Package surface matte finish VDI 11-13. D = SP3001 series Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP3001-04JTG 4$ DX4 3000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 43 Revised: February 9, 2010 SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 e SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - SC70-6 Symbol Inches Max Min Max E 1.65 1.85 0.064 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.081 D 1.40 1.60 0.055 0.062 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.153 0.161 10P0 40.0+/- 0.20 W 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 t SP3001 Lead-Free/Green Series Millimetres Min 44 Revised: February 9, 2010 NBY 0.010 max ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.