DMP2039UFDE Green P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary V(BR)DSS Features RDS(ON) max 27mΩ @ VGS = -4.5V -25V 40mΩ @ VGS = -1.8V • • • • • • • ID TA = +25°C Package -6.7A U-DFN2020-6 Type E -5.4A Low RDS(ON) – Ensures on State Losses are Minimized 0.6mm Profile – Ideal for Low Profile Applications 2 PCB Footprint of 4mm ESD Protected Gate Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Description This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. • • Case: U-DFN2020-6 Type E Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Diagram Terminals: Finish – NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 e3 Weight: 0.001 grams (approximate) • • • Applications • • • Mechanical Data Load Switching Battery Management Application Power Management Functions • Drain U-DFN2020-6 Type E Pin1 Gate Gate Protection Diode Bottom View Internal Schematic Bottom View ESD PROTECTED Source Equivalent Circuit Ordering Information (Note 4) Part Number DMP2039UFDE-7 Notes: Case U-DFN2020-6 Type E Packaging 3,000/Tape & Reel 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com. Marking Information Date Code Key Year Code Month Code 2011 Y Jan 1 2012 Z Feb 2 DMP2039UFDE Document number: DS35420 Rev. 5 - 2 Mar 3 P9 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) YM P9 2013 A Apr 4 May 5 2014 B Jun 6 1 of 6 www.diodes.com 2015 C Jul 7 Aug 8 2016 D Sep 9 Oct O 2017 E Nov N Dec D July 2012 © Diodes Incorporated DMP2039UFDE Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (Note 5) VGS = -4.5V TA = +25°C TA = +70°C TA = +25°C TA = +70°C TA = +25°C TA = +70°C TA = +25°C TA = +70°C Steady State t<5s Continuous Drain Current (Note 5) VGS = -1.8V Steady State t<5s ID Value -25 ±8 -6.7 -5.3 ID -8.3 -6.6 A ID -5.4 -4.3 A A -6.6 -5.2 -60 -2.0 ID Pulsed Drain Current (10µs pulse, duty cycle = 1%) Continuous Source-Drain Diode Current Units V V IDM IS A A A Thermal Characteristics Characteristic Symbol TA = +25°C TA = +70°C Steady state t<5s TA = +25°C TA = +70°C Steady state t<5s Steady state Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Note 6) Operating and Storage Temperature Range PD RθJA PD RθJA RθJC TJ, TSTG Value 0.8 1.2 160 104 2.0 2.9 63 42 10.8 -55 to +150 Units W °C/W W °C/W °C/W °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS (Note 7) Gate Threshold Voltage Symbol Min Typ Max Unit BVDSS IDSS IGSS -25 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ -1 ±10 V µA µA VGS = 0V, ID = -250µA VDS = -25V, VGS = 0V VGS = ±8.0V, VDS = 0V VGS(th) RDS (ON) |Yfs| VSD ⎯ 20 24 28 33 16 -0.7 -1.0 27 34 40 70 ⎯ -1.0 V Static Drain-Source On-Resistance -0.4 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ VDS = VGS, ID = -250µA VGS = -4.5V, ID = -6.4A VGS = -2.5V, ID = -4.8A VGS = -1.8V, ID = -2.5A VGS = -1.5V, ID = -1.5A VDS = -5V, ID = -4A VGS = 0V, IS = -1A Ciss Coss Crss Rg Qg Qg Qgs Qgd tD(on) tr tD(off) tf ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 2530 203 177 9.1 28.2 48.7 3.2 5.0 15.1 23.5 137.6 80.5 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Forward Transfer Admittance Diode Forward Voltage DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge (VGS = -4.5V) Total Gate Charge (VGS = -8V Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Notes: mΩ S V pF pF pF Ω nC nC nC nC ns ns ns ns Test Condition VDS = -15V, VGS = 0V f = 1.0MHz VDS = 0V, VGS = 0V, f = 1.0MHz VDS = -15V, ID = -4.0A VDD = -15V, VGS = -4.5V, RG = 1Ω, ID = -4.0A 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate 7. Short duration pulse test used to minimize self-heating effect 8. Guaranteed by design. Not subject to production testing. DMP2039UFDE Document number: DS35420 Rev. 5 - 2 2 of 6 www.diodes.com July 2012 © Diodes Incorporated DMP2039UFDE 20 20 VGS = 8.0V VGS = 4.5V VGS = 2.0V 12 -ID, DRAIN CURRENT (A) -ID, DRAIN CURRENT (A) 16 VGS = 1.5V VGS = 1.8V 8 4 0 10 5 TA = 150°C 0 TA = 125°C 1 2 3 4 -VDS, DRAIN -SOURCE VOLTAGE(V) Fig. 1 Typical Output Characteristics 0.06 0.05 0.04 0.03 0.02 0.01 0 1 2 3 4 5 6 7 8 -ID, DRAIN SOURCE CURRENT Fig. 3 Typical On-Resistance vs. Drain Current and Gate Voltage 9 0 10 RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω) 1.5 1.3 1.1 0.9 0.7 0.5 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Fig. 5 On-Resistance Variation with Temperature DMP2039UFDE Document number: DS35420 Rev. 5 - 2 3 of 6 www.diodes.com TA = 85°C TA = 25°C T A = -55°C 0 5 1.7 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Normalized) 15 VGS = 1.2V RDS(ON), DRAIN-SOURCE ON-RESISTANCE(Ω) RDS(ON),DRAIN-SOURCE ON-RESISTANCE(Ω) VDS = -5.0V VGS = 2.5V 0.5 1.0 1.5 2.0 2.5 -VGS, GATE-SOURCE VOLTAGE (V) Fig. 2 Typical Transfer Characteristics 3.0 0.04 VGS = -4.5V TA = 150 °C 0.03 TA = 125°C T A = 85°C 0.02 T A = 25°C TA = -55°C 0.01 0 0 4 8 12 16 -ID, DRAIN SOURCE CURRENT (A) Fig. 4 Typical On-Resistance vs. Drain Current and Temperature 20 0.06 0.05 0.04 VGS = -2.5V ID = -5A 0.03 VGS = -4.5V ID = -10A 0.02 0.01 0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Fig. 6 On-Resistance Variation with Temperature July 2012 © Diodes Incorporated DMP2039UFDE 20 18 1.2 16 -IS, SOURCE CURRENT (A) VGS(TH), GATE THRESHOLD VOLTAGE(V) 1.4 1.0 0.8 0.6 0.4 14 12 10 8 6 4 0.2 2 0 -50 0 0.4 -25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 7 Gate Threshold Variation vs. Ambient Temperature 0.6 0.8 1.0 1.2 -VSD, SOURCE-DRAIN VOLTAGE (V) Fig. 8 Diode Forward Voltage vs. Current 100,000 -IDSS, LEAKAGE CURRENT (nA) CT, JUNCTION CAPACITANCE (pF) f = 1MHz Ciss Coss Crss 10,000 TA = 150°C 1,000 TA = 125°C 100 TA = 85°C 10 T A = 25°C 0 5 10 15 -VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 9 Typical Junction Capacitance 1 20 5 10 15 20 25 -VDS, DRAIN-SOURCE VOLTAGE(V) Fig. 10 Typical Drain-Source Leakage Current vs. Voltage 8 0 100 PW = 10µs 10 6 -ID, DRAIN CURRENT (A) -VGS, GATE-SOURCE VOLTAGE (V) RDS(on) Limited 4 2 DC 1 PW = 10s PW = 1s 0.1 PW = 100ms PW = 10ms PW = 1ms PW = 100µs 0.01 0 0 5 10 15 20 25 30 35 40 45 50 Qg, TOTAL GATE CHARGE (nC) Fig. 11 Gate-Charge Characteristics DMP2039UFDE Document number: DS35420 Rev. 5 - 2 0.001 0.1 4 of 6 www.diodes.com 1 10 -VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 12 SOA, Safe Operation Area 100 July 2012 © Diodes Incorporated DMP2039UFDE 1 r(t), TRANSIENT THERMAL RESISTANCE D = 0.7 D = 0.5 D = 0.3 0.1 D = 0.1 D = 0.9 D = 0.05 D = 0.02 0.01 D = 0.01 D = 0.005 RθJA(t) = r(t) * RθJA RθJA = 64°C/W Duty Cycle, D = t1/ t2 Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 t1, PULSE DURATION TIMES (sec) Fig. 13 Transient Thermal Resistance 10 100 1,000 Package Outline Dimensions A1 A A3 D b1 K1 D2 E E2 L1 L(2X) K2 Z(4X) e b(6X) U-DFN2020-6 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 — — 0.15 b 0.25 0.35 0.30 b1 0.185 0.285 0.235 D 1.95 2.05 2.00 D2 0.85 1.05 0.95 E 1.95 2.05 2.00 E2 1.40 1.60 1.50 e — — 0.65 L 0.25 0.35 0.30 L1 0.82 0.92 0.87 K1 — — 0.305 K2 — — 0.225 Z — — 0.20 All Dimensions in mm Suggested Pad Layout Dimensions Y3 Y2 X2 C X X1 X2 Y Y1 Y2 Y3 Y1 X1 X (6x) DMP2039UFDE Document number: DS35420 Rev. 5 - 2 C Value (in mm) 0.650 0.400 0.285 1.050 0.500 0.920 1.600 2.300 Y (2x) 5 of 6 www.diodes.com July 2012 © Diodes Incorporated DMP2039UFDE IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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