MBRB4030 D

MBRB4030G,
NRVBB4030T4G
Preferred Device
SWITCHMODE
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a proprietary barrier metal.
Features







Guardring for Stress Protection
Maximum Die Size
175C Operating Junction Temperature
Short Heat Sink Tab Manufactured − Not Sheared
AEC−Q101 Qualified and PPAP Capable
NRVBB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
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SCHOTTKY BARRIER
RECTIFIER
40 AMPERES, 30 VOLTS
D2PAK
CASE 418B
STYLE 3
Mechanical Characteristics:
 Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
 Weight: 1.7 Grams (Approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal


Leads Readily Solderable
Device Meets MSL1 Requirements
ESD Ratings:
 Machine Model = C (> 400 V)
 Human Body Model = 3B (> 8000 V)
1
4
3
MARKING DIAGRAM
AY WW
B4030G
AKA
A
Y
WW
B4030
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 7
1
Publication Order Number:
MBRB4030/D
MBRB4030G, NRVBB4030T4G
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
30
V
Average Rectified Forward Current
(At Rated VR) TC = +115C (Note 1)
IF(AV)
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz), TC = +112C
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz)
IRRM
2.0
A
Storage Temperature Range
Tstg
−65 to +175
C
Operating Junction Temperature Range (Note 2)
TJ
−65 to +175
C
dv/dt
10,000
V/ms
W
600
mJ
Voltage Rate of Change (Rated VR)
Reverse Energy (Unclamped Inductive Surge), (TC = 25C, L = 3.0 mH)
40
80
300
A
A
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Rating applies when pins 1 and 3 are connected.
2. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction−to−Case
RqJC
1.0
C/W
Thermal Resistance, Junction−to−Ambient (Note 3)
RqJA
50
C/W
Symbol
Value
Unit
3. Rating applies when surface mounted on the miniumum pad size recommended.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Notes 4 and 5), per Device
(IF = 20 A, TC = + 25C)
(IF = 20 A, TC = +150C)
(IF = 40 A, TC = + 25C)
(IF = 40 A, TC = +150C)
VF
Maximum Instantaneous Reverse Current (Note 5), per Device
(Rated DC Voltage, TC = + 25C)
(Rated DC Voltage, TC = +125C)
IR
0.46
0.34
0.55
0.45
0.35
150
V
mA
4. Rating applies when pins 1 and 3 are connected.
5. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%
ORDERING INFORMATION
Package
Shipping†
MBRB4030G
D2PAK
(Pb−Free)
50 Units / Rail
MBRB4030T4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
NRVBB4030T4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRB4030G, NRVBB4030T4G
ELECTRICAL CHARACTERISTICS
100
I F, INSTANTANEOUS FORWARD CURRENT (A)
(PIN 1 SHORTED TO PIN 3)
I F, INSTANTANEOUS FORWARD CURRENT (A)
(PIN 1 SHORTED TO PIN 3)
100
TJ = 150C
10
100C
1.0
0.1
0
25C
10
100C
1.0
0.2
0.4
0.6
0.3
0.5
VF, INSTANTANEOUS VOLTAGE (V)
0.1
TJ = 150C
0.7
0.1
0.8
0
0.1
0.4
0.2
0.3
0.5
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Maximum Forward Voltage
0.7
1.0
TJ = 150C
I R , REVERSE CURRENT (A)
TJ = 150C
0.1
100C
0.01
10-3
0.1
100C
0.01
10-3
10-4
0
5
25C
10-4
25C
20
10
15
VR, REVERSE VOLTAGE (V)
25
30
10-5
0
Figure 3. Maximum Reverse Current
5
15
20
10
VR, REVERSE VOLTAGE (V)
TJ = 25C
TYPICAL
1000
1
25
Figure 4. Typical Reverse Current
104
C, CAPACITANCE (pF)
I R , REVERSE CURRENT (A)
0.6
Figure 2. Typical Forward Voltage
1.0
10-5
25C
MAXIMUM
10
VR, REVERSE VOLTAGE (V)
Figure 5. Maximum and Typical Capacitance
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3
30
MBRB4030G, NRVBB4030T4G
ELECTRICAL CHARACTERISTICS
20
DC
60
50
 (RESISTIVE LOAD)
IPK
= 5.0 (CAPACITIVE
IAV
LOAD)
SQUARE WAVE
40
30
10
20
10
20
0
100
110
120
140
130
TC, CASE TEMPERATURE (C)
I F(AV), AVERAGE FORWARD CURRENT (A)
(PIN 1 SHORTED TO PIN 3)
I F(AV), AVERAGE FORWARD CURRENT (A)
(PIN 1 SHORTED TO PIN 3)
70
RqJA = 25C/W
DC

(RESISTIVE LOAD)
IPK
= 5.0 (CAPACITIVE
IAV
LOAD)
10
10
5
20
0
150
DC
10
 (RESISTIVE LOAD)
SQUARE WAVE
8
IPK
= 5.0 (CAPACITIVE
IAV
LOAD)
6
10
4
20
2
0
50
100
TA, AMBIENT TEMPERATURE (C)
150
50
TJ = 150C
 (RESISTIVE LOAD)
40
IPK
= 5.0 (CAPACITIVE
IAV
LOAD)
30
SQUARE WAVE
10
20
20
DC
10
0
0
30
50
40
60
20
IF(AV), AVERAGE FORWARD CURRENT (A)
10
Figure 8. Current Derating, Free Air
70
Figure 9. Forward Power Dissipation
1.0
R(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
0
Figure 7. Current Derating
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)
(PIN 1 SHORTED TO PIN 3)
I F(AV), AVERAGE FORWARD CURRENT (A)
(PIN 1 SHORTED TO PIN 3)
RqJA = 50C/W
150
50
100
TA, AMBIENT TEMPERATURE (C)
Figure 6. Current Derating, Infinite Heatsink
12
SURFACE MOUNTED ON
MINIMUM RECOMMENDED
PAD SIZE
SQUARE WAVE
15
SINGLE PULSE
Ppk
0.1
0.01
Ppk
tp
TIME
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk, is peak of an
equivalent square power pulse.
t1
DTJL = Ppk  RqJL [D + (1 - D)  r(t1 + tp) + r(tp) - r(t1)]
where
DTJL = the increase in junction temperature above the lead temperature
r(t) = normalized value of transient thermal resistance at time, t, for example,
r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
0.1
1.0
10
t, TIME (ms)
Figure 10. Thermal Response
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4
100
1000
80
MBRB4030G, NRVBB4030T4G
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
−B−
V
W
4
1
2
A
S
3
−T−
SEATING
PLANE
K
J
G
D
M
T B
M
N
R
P
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
U
L
M
W
H
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
MBRB4030G, NRVBB4030T4G
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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6
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MBRB4030/D