MBRB20100CTG, NRVBB20100CTT4G, NRVBBS20100CTT4G SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package The D2PAK Power Rectifier is a state−of−the−art device that employs the use of the Schottky Barrier principle with a platinum barrier metal. Features • • • • • • • • • • Package Designed for Power Surface Mount Applications Center−Tap Configuration Guardring for Stress Protection Low Forward Voltage 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in Short Heat Sink Tab Manufactured − Not Sheared! Similar in Size to Industry Standard TO−220 Package NRVBB and NRVBBS Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* http://onsemi.com SCHOTTKY BARRIER RECTIFIER 20 AMPERES 100 VOLTS D2PAK CASE 418B STYLE 3 1 4 3 MARKING DIAGRAM Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.4 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal AY WW B20100G AKA Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • MBRB20100CTG, NRVBB20100CTT4G Meets MSL1 Requirements A Y WW B20100 G AKA • NRVBBS20100CTT4G Meets MSL2 Requirements • ESD Ratings: ♦ ♦ Machine Model = C (> 400 V) Human Body Model = 3B (> 8000 V) = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 August, 2012 − Rev. 10 1 Publication Order Number: MBRB20100CT/D MBRB20100CTG, NRVBB20100CTT4G, NRVBBS20100CTT4G MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 100 V Average Rectified Forward Current Per Leg (Rated VR, TC = 155°C) Total Device IF(AV) 10 20 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150°C) IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature (Note 1) TJ −65 to +175 °C dv/dt 10,000 V/ms Voltage Rate of Change (Rated VR) 20 150 0.5 A A A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS (Per Leg) Symbol Characteristic Thermal Resistance, Junction−to−Case Junction−to−Ambient (Note 2) Value RqJC RqJA 2.0 50 Symbol Value Unit °C/W 2. When mounted using minimum recommended pad size on FR−4 board. ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 10 Amp, TC = 125°C) (iF = 10 Amp, TC = 25°C) (iF = 20 Amp, TC = 125°C) (iF = 20 Amp, TC = 25°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR 0.75 0.85 0.85 0.95 6.0 0.1 Unit V mA 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. ORDERING INFORMATION Package Shipping† D2PAK 50 Units / Rail MBRB20100CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel NRVBB20100CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel NRVBBS20100CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel Device MBRB20100CTG (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 10 50 TJ = 150°C 125°C 20 IR , REVERSE CURRENT (mA) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) MBRB20100CTG, NRVBB20100CTT4G, NRVBBS20100CTT4G 150°C 10 100°C 5 TJ = 25°C 3 1 1.0 125°C 0.1 100°C 0.01 0.001 25°C 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0001 1 0 20 vF, INSTANTANEOUS VOLTAGE (VOLTS) 100 80 Figure 2. Typical Reverse Current Per Diode 20 20 RATED VOLTAGE APPLIED RqJC = 2°C/W 18 AVERAGE POWER (WATTS) dc 60 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Per Diode IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 40 15 SQUARE WAVE 10 5.0 IPK/IAV = 5 TJ = 125°C PI 16 IPK/IAV = 10 14 12 IPK/IAV = 20 10 SQUARE WAVE 8 6 DC 4 2 0 80 100 120 140 TC, CASE TEMPERATURE (°C) 160 0 180 Figure 3. Typical Current Derating, Case, Per Leg 0 2 4 6 8 10 12 14 AVERAGE CURRENT (AMPS) 16 18 20 Figure 4. Average Power Dissipation & Average Current http://onsemi.com 3 MBRB20100CTG, NRVBB20100CTT4G, NRVBBS20100CTT4G PACKAGE DIMENSIONS D2PAK CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K J G D W H 3 PL 0.13 (0.005) M T B STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE M VARIABLE CONFIGURATION ZONE DIM A B C D E F G H J K L M N P R S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 N R P U L L M L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB20100CTG, NRVBB20100CTT4G, NRVBBS20100CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRB20100CT/D