TC4404/TC4405 1.5A Dual Open-Drain MOSFET Drivers Features: General Description: • Independently Programmable Rise and Fall Times • Low Output Impedance – 7 Typ. • High Speed tR, tF – <30 nsec with 1000 pF Load • Short Delay Times – <30 nsec • Wide Operating Range: - 4.5V to 18V • Latch-Up Protected: Will Withstand > 500 mA Reverse Current (Either Polarity) • Input Withstands Negative Swings Up to -5V The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load; or a reduced output swing, if driving a resistive load, or to limit base current, when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30 nsec for a 1000 pF load. Applications: For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSFET, because they allow accurate control of turn-ON, while maintaining fast turnOFF and maximum noise immunity for an OFF device. • • • • Motor Controls Driving Bipolar Transistors Driver for Non-overlapping Totem Poles Reach-Up/Reach-Down Driver Device Selection Table Part Number Package Temp. Range TC4404COA 8-Pin SOIC 0°C to +70°C TC4404CPA 8-Pin PDIP 0°C to +70°C TC4404EOA 8-Pin SOIC -40°C to +85°C TC4404EPA 8-Pin PDIP -40°C to +85°C TC4404MJA 8-Pin CERDIP -55°C to +125°C TC4405COA 8-Pin SOIC 0°C to +70°C TC4405CPA 8-Pin PDIP 0°C to +70°C TC4405EOA 8-Pin SOIC -40°C to +85°C TC4405EPA 8-Pin PDIP -40°C to +85°C TC4405MJA 8-Pin CERDIP -55°C to +125°C When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. For driving many loads in low-power regimes, these drivers, because they eliminate shoot-through currents in the output stage, require significantly less power at higher frequencies, and can be helpful in meeting low-power budgets. Package Type 8-Pin PDIP/SOIC/CERDIP VDD 1 8 A TOP VDD 1 8 A TOP IN A 2 7 A BOTTOM IN A 2 7 A BOTTOM IN B 3 6 B TOP IN B 3 6 B TOP GND 4 5 B BOTTOM GND 4 5 B BOTTOM VDD 1 8 A TOP VDD 1 8 A TOP IN A 2 7 A BOTTOM IN A 2 7 A BOTTOM IN B 3 6 B TOP IN B 3 6 B TOP GND 4 5 B BOTTOM GND 4 5 B BOTTOM TC4404 TC4404 TC4405 2002-2012 Microchip Technology Inc. TC4405 DS21418D-page 1 TC4404/TC4405 Because neither drain in an output is dependent on the other, these devices can also be used as open-drain buffer/drivers where both drains are available in one device, thus minimizing chip count. Unused open drains should be returned to the supply rail that their device sources are connected to (pull-downs to ground, pull-ups to VDD), to prevent static damage. In addition, in situations where timing resistors or other means of limiting crossover currents are used, like drains may be paralleled for greater current carrying capacity. These devices are built to operate in the most demanding electrical environments. They will not latch-up under any conditions within their power and voltage ratings; they are not subject to damage when up to 5V of noise spiking of either polarity occurs on their ground pin; and they can accept, without damage or logic upset, up to 1/2 amp of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 2 kV of electrostatic discharge. Functional Block Diagram 1 VDD TC4404 Inverting 8 (6) 300 mV Pull-Up 7 (5) Input 2 (3) 4.7V GND Pull-Down TC4405 Noninverting 4 Effective Input C ≤ 12 pF DS21418D-page 2 A (B) 2002-2012 Microchip Technology Inc. TC4404/TC4405 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ..................................................... +22V Power Dissipation (TA 70°C) PDIP........................................................ 730 mW CERDIP .................................................. 800 mW SOIC ....................................................... 470 mW Package Thermal Resistance PDIP RJ-A ............................................. 125°C/W PDIP RJ-C ............................................... 45°C/W CERDIP RJ-A ........................................ 150C/W CERDIP RJ-C .......................................... 55°C/W SOIC RJ-A ............................................. 155°C/W SOIC RJ-C ............................................... 45°C/W Operating Temperature Range C Version ........................................ 0°C to +70°C E Version...................................... -40°C to +85°C M Version ................................... -55°C to +125°C Storage Temperature Range.............. -65°C to +150°C TC4404/TC4405 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units V Test Conditions Input VIH Logic 1, High Input Voltage 2.4 — — VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -1 — 1 A 0VVINVDD Output VOH High Output Voltage VDD – 0.025 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance — 7 10 IOUT = 10 mA, VDD = 18V; Any Drain IPK Peak Output Current (Any Drain) — 1.5 — A Duty cycle2%, t 300 sec IDC Continuous Output Current (Any Drain) — — 100 mA IR Latch-Up Protection (Any Drain) Withstand Reverse Current — >500 — mA Duty cycle2%, t 300 sec Switching Time (Note 1) tR Rise Time — 25 30 nsec Figure 3-1, CL = 1000 pF tF Fall Time — 25 30 nsec Figure 3-1, CL = 1000 pF tD1 Delay Time — 15 30 nsec Figure 3-1, CL = 1000 pF tD2 Delay Time — 32 50 nsec Figure 3-1, CL = 1000 pF — — — — 4.5 0.4 mA Power Supply IS Power Supply Current VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design. 2002-2012 Microchip Technology Inc. DS21418D-page 3 TC4404/TC4405 TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units VIH Logic 1, High Input Voltage 2.4 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -10 — 10 A Test Conditions 0VVINVDD Output VOH High Output Voltage VDD – 0.025 — — V VOL Low Output Voltage — — 0.025 V RO Output Resistance — 9 12 IOUT = 10 mA, VDD = 18V; Any Drain IPK Peak Output Current (Any Drain) — 1.5 — A Duty cycle2%, t 300 sec IDC Continuous Output Current (Any Drain) — — 100 mA IR Latch-Up Protection (Any Drain) Withstand Reverse Current — >500 — mA Duty cycle2%, t 300 sec Figure 3-1, CL = 1000 pF Switching Time (Note 1) tR Rise Time — — 40 nsec tF Fall Time — — 40 nsec Figure 3-1, CL = 1000 pF tD1 Delay Time — — 40 nsec Figure 3-1, CL = 1000 pF tD2 Delay Time — — 60 nsec Figure 3-1, CL = 1000 pF — — — — 8 0.6 mA Power Supply IS Power Supply Current VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Note 1: Switching times ensured by design. DS21418D-page 4 2002-2012 Microchip Technology Inc. TC4404/TC4405 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, SOIC, CERDIP) Symbol 1 VDD Supply input, 4.5V to 18V. 2 IN A Control input A, TTL/CMOS compatible input. 3 IN B Control input A, TTL/CMOS compatible input. 4 GND Ground. 5 B BOTTOM 6 B TOP 7 A BOTTOM 8 A TOP 2002-2012 Microchip Technology Inc. Description Output B, pull-down. Output B, pull-up. Output A, pull-down. Output A, pull-up. DS21418D-page 5 TC4404/TC4405 3.0 APPLICATIONS INFORMATION 3.1 Circuit Layout Guidelines In addition, it is advisable that low ESR bypass capacitors (4.7 F or 10 F tantalum) be placed as close to the driver as possible. The driver should be physically located as close to the device it is driving as possible to minimize the length of the output trace. Avoid long power supply and ground traces (added inductance causes unwanted voltage transients). Use power and ground planes wherever possible. +5V 90% Input VDD = 18V 0V 10% tD1 tD2 tF 4.7 μF 18V 0.1 μF tR 90% 90% Output 1 2 Input 8,7 1 Output Inverting Driver CL = 1000 pF 2 10% 10% 0V +5V 90% Input 0V 4 10% 18V tD1 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 90% tR Output tD2 10% 0V 90% tF 10% Noninverting Driver FIGURE 3-1: 3.2 Switching Time Test Circuit Typical Applications (4.5V - 18V) VDD (4.5V - 18V) VDD From TTL RT TC4404 RT VOUT GND FIGURE 3-2: Zero Crossover Current Totem-Pole Switch DS21418D-page 6 From TTL RIB TC4405 RIB GND FIGURE 3-3: Driving Bipolar Transistors 2002-2012 Microchip Technology Inc. TC4404/TC4405 +24V 47 kΩ 47 kΩ +12V 15V 0.1 μF 15V 0.1 μF Direction (TTL Level) RT Speed (PWM) Motor RT ISENSE GND FIGURE 3-4: TC4469 TC4404 Servo Motor Control +12V +12V Switched +12V +5V From TTL GND +5V TC4404 GND Switched -12V -12V FIGURE 3-5: -12V Reach-Up and Reach-Down Driving 2002-2012 Microchip Technology Inc. DS21418D-page 7 TC4404/TC4405 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise Time vs. Supply Voltage Fall Time vs. Supply Voltage 100 2200 pF 2200 pF 80 60 1000 pF 40 470 pF 60 1000 pF 40 60 15V 40 20 20 100 pF 100 pF 4 6 10V 470 pF 20 8 10 12 14 16 0 18 VDD (V) 4 6 8 10 12 14 16 0 100 18 Rise and Fall Times vs. Temperature 50 60 TIME (nsec) 80 10V 15V 40 60 CLOAD = 1000 pF VDD = 17.5V 40 30 tFALL 20 20 CLOAD = 1000 pF TA = +25°C 50 DELAY TIME (nsec) VDD = 5V 10,000 Propagation Delay vs. Supply Voltage 60 100 TA = +25°C 1000 CLOAD (pF) VDD (V) Fall Time vs. Capacitive Load tFALL (nsec) 80 1500 pF tRISE (nsec) 1500 pF tFALL (nsec) tRISE (nsec) 80 VDD = 5V TA = +25°C TA = +25°C TA = +25°C 0 Rise TIme vs. Capacitive Load 100 100 tD2 40 30 tD1 20 tRISE 0 100 1000 10,000 CLOAD (pF) 10 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (°C) Effect of Input Amplitude on Delay Time tD2 30 10 0 2 DS21418D-page 8 4 6 VDRIVE (V) 8 10 12 14 VDD (V) 16 18 TA = +25°C 40 30 20 tD1 10 tD2 IQUIESCENT (mA) DELAY TIME (nsec) DELAY TIME (nsec) 40 8 10 VDD = 17.5V VLOAD = 1000pF 50 6 Quiescent Supply Current vs. Voltage 60 CLOAD = 1000pF VDD = 10V TA = +25°C 20 4 Propagation Delay Time vs. Temperature 60 50 10 BOTH INPUTS = 1 1 tD1 10 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (°C) BOTH INPUTS = 0 0.1 4 6 8 10 12 VDD (V) 14 16 18 2002-2012 Microchip Technology Inc. TC4404/TC4405 TYPICAL CHARACTERISTICS (CONTINUED) Quiescent Supply Current vs. Temperature Pull-Up Output Resistance 4.0 Pull-Down Output Resistance 25 25 3.5 2.5 WORST CASE @ TJ = +150°C RDS(ON) (Ω) 3.0 15 TYP @ +25°C 10 TEMPERATURE (°C) 2002-2012 Microchip Technology Inc. TYP @ +25°C 8 5 5 25 45 65 85 105 125 15 10 8 2.0 -55 -35 -15 5 WORST CASE @ TJ = +150°C 20 20 RDS(ON) (Ω) IQUIESCENT (mA) VDD = 18V BOTH INPUTS = 1 4 6 8 10 12 VDD (V) 14 16 18 4 6 8 10 12 14 16 18 VDD (V) DS21418D-page 9 TC4404/TC4405 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping pForm p g ( ) User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) DS21418D-page 10 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in 2002-2012 Microchip Technology Inc. TC4404/TC4405 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .310 (7.87) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21418D-page 11 TC4404/TC4405 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin CERDIP (Narrow) .110 (2.79) .090 (2.29) Pin 1 .300 (7.62) .230 (5.84) .020 (0.51) Min. .055 (1.40) Max. .320 (8.13) .290 (7.37) .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .040 (1.02) .020 (0.51) .150 (3.81) Min. .200 (5.08) .125 (3.18) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) DS21418D-page 12 2002-2012 Microchip Technology Inc. TC4404/TC4405 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° Max. .050 (1.27) .016 (0.40) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21418D-page 13 TC4404/TC4405 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. DS21418D-page 14 2002-2012 Microchip Technology Inc. TC4404/TC4405 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2002-2012 Microchip Technology Inc. DS21418D-page 15 TC4404/TC4405 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC4404/TC4405 Literature Number: DS21418D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21418D-page 16 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767931 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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