Hybrid Products Group Standard and Custom Products for HiRel Applications Microsemi Hybrid Products Group Microsemi’s Hybrid Products Group designs and manufactures high-reliability micro-circuit assemblies incorporating multi-technology semiconductor components in a variety of hermetic packages. Our products include linear and digital microcircuits, op-amps, logic arrays, multiple discrete assemblies, analog control circuits and power hybrids. In addition to custom manufacturing, Microsemi also produces a standard product line consisting of linear and switching regulators and solid-state relays. Our products have applications in ground-based military equipment, missiles, aircraft and satellites. The Hybrid Products Group has more than 40 years experience producing reliable, highquality components and hermetic assemblies. We can provide fast prototype turnaround on your new designs. Call Microsemi today. Our engineers are ready to help you find solutions and achieve your design goals. Markets • • • • • Defense Space Aerospace Medical Communications Product Types • Linear & Digital Microcircuits • Custom SCD Assemblies • Replacements for Burr-Brown, Teledyne, Fairchild, National Hybrids • Linear Regulators • Point-of-Load Switchers • Solid-State Relays Product Applications • • • • • • Rad-Hard Power Supplies Rad-Hard Satellite Heater Controls Launch Systems Avionics Power Control Booster Controls Guidance System Power Meeting High Reliability Requirements for • • • • • MIL-STD- 883 MIL-STD- 750 MIL-PRF-38535 MIL-PRF-38534 MIL-PRF- 19500 Point-of-Load Switching Regulators • Output Currents of 1A, 3A, 4.5A, 15A • Rad-Tolerant to 300Krad TID (MIL-STD-883, Method 1019.6) • SEU to 55 MeV • Class H & K Screening • Complete Assembly — Only 1 Voltage Set Resistor Required • Surface Mount Packaging Typical Application + Vbus 60W DC-DC 90% + 5V 8565 (85%) - 12V + 12V 8572 (90%) 8564S (85%) 0V to +3.0V, 5A +4V to 1.3Vout, 3A +4.0 to 0Vout 4.0A (Single) 8.0A Parallel CPU Logic FPGA Linear Regulators Part Description Critical Parameters Packages 8601 Pos., Linear, 3A, Fixed & Adj VLDO= 0.300V (3A), (5A), Rad-Hard to 300Krad+ 5 Pin MO-078 8605R Pos., Linear, 5A, Fixed w/Remote Sense VLDO= 0.300V (3A), 0.400V (5A) Rad-Hard to 300Krad+ 5- Pin MO-078, 8-Pin SMT 117 Pos. Linear, Adj., 1.25A, Vin= 40V Rad-Hard to 300Krad D2 127 Rad-Hard to 300 Krad Dual, 1A, Pos. & Neg.Linear regulator 8-Pin, TO-254 • Adjustable or Fixed Output Voltages: 1.265V to 5.0V • Vin= +3.3V • Vdropout < 300mV typ. • 3A & 5A Load Versions • Shutdown Control • Internal Capacitors per MIL-PRF-123 or MIL-PRF-55365 TID & SEE Rated Solid-State Relays • • • • • • • • 250V Operation Accepts Logic Level Inputs, (+3.0V- +5.5V) 1A & 10A Max Current Class H & K Screening Levels Surface Mount & Thru-Hole Packages Normally Open or Normally Closed Operation TID > 300Krad; SET= 85 MeV Buffrered Inputs +28V +5V VL D 1 S 2 D 8 5 HEATER ISOLATION INPUT 1 4 3 +5V RETURN INPUT T2 ENABLE DC/DC CONVERTER 6 ISOLATION S 7 Design & Construction Features • • • • • • • • • Moly/CRS/AlSiC/CuW/Kovar bases Matched CTE Packaging DBC, Thick Film & Thin Film Assemblies Gold Flash Package Gold or Solder Component Terminations Eliminates Tin Whisker Issues Low Thermal Resistance 60% Capacitor Voltage De-rating at 125°C 50% Current Margins (Internal Components) All Internal Components Selected from: - MIL-PRF-123 - MIL-PRF- 55356 - MIL-T- 27 Custom & Standard Product Features • • • • • • Radiation Tolerance to 1 MRad High-Efficiency Regulators Output Currents to 20A+ High-Density Packaging In-House Quality Conformance Inspection (QCI) Custom Lead-forming HiRel Screening C TEST Cots H K Equivalent MILPRF-38534 MILSTD-883 Element Evaluation Non-Destruct Wirebond Pull Pre-Cap Visual Temperature Cycle Constant Acceleration PIND Pre-Burn In Electrical N/A Class H Class K N/A Sample 100% 2023 N/A N/A N/A N/A N/A 100% 100% 100% 2017 1010 2001 2020 100% 100% 100% 100% 100% 100% Burn-In N/A 100% (160 Hours) 100% (320 Hours) 100% 100% 100% N/A 100% 100% Yes 100% Final Electrical Tests Seal (Fine and Gross Leak) X-Ray External Visual 100% (25°C) 100% N/A Sample 1015 1014 2012 2009 Processes & Capabilities • Design, Development, Production • DBC, Thick & Thin Film Technologies • Multi-layer Substrates • Mixed Signal Custom Circuits • Chip & Wire • Eutectic, Solder & Epoxy die attach: .0007” - .003” Gold Wire-bonding .001” - .020” Aluminum Wire-bonding • Active Trim • Large Diameter Wire/Power Applications • Seam Seal/Resistance Weld • Lead Forming • Environmental Screening and Quality Conformance Inspection to MIL-PRF-38534 Microsemi Corporation Military/HiRel/Aerospace Group 6 Lake Street Lawrence, MA 01841 Ph: 978-620-2600 Fax: 978-689-0803 Email: [email protected]