plastic low profile fine-pitch ball grid array package; 170 balls

0
LF
BG
A1
7
SOT1315-1
plastic low profile fine-pitch ball grid array package; 170 balls
8 June 2016
Package information
1. Package summary
Terminal position code
B (bottom)
Package type descriptive code
LFBGA170
Package type industry code
LFBGA170
Package style descriptive code
LFBGA (low profile fine-pitch ball grid array)
Package body material type
P (plastic)
IEC package outline code
---
JEDEC package outline code
MO-205
JEITA package outline code
---
Mounting method type
S (surface mount)
Issue date
4-11-2011
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
11.9
-
12
12.1
mm
E
package width
11.9
-
12
12.1
mm
A
seated height
1.25
-
1.35
1.5
mm
A2
package height
0.95
-
1
1.1
mm
e
nominal pitch
-
-
0.8
-
mm
n2
actual quantity of termination
-
-
170
-
SOT1315-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array package; 170 balls
2. Package outline
LFBGA170: plastic low profile fine-pitch ball grid array package; 170 balls
D
B
SOT1315-1
A
ball A1
index area
A
A2
A1
E
detail X
C
e1
e
1/2 e
b
Øv
Øw
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
index area
e2
1/2 e
1 2 3 4 5 6 7 8 9 10 11 12 13 14
X
10 mm
scale
Dimensions (mm are the original dimensions)
mm
A
A1
y
e
0
Unit
y1 C
C A B
C
A2
b
D
E
e
e1
e2
v
w
y
y1
max 1.50 0.40 1.10 0.50 12.1 12.1
nom 1.35 0.35 1.00 0.45 12.0 12.0 0.80 10.4 10.4 0.15 0.08 0.12 0.10
min 1.25 0.30 0.95 0.40 11.9 11.9
sot1315-1_po
Outline
version
SOT1315-1
References
IEC
JEDEC
JEITA
European
projection
Issue date
11-09-05
11-11-01
MO-205
Fig. 1. Package outline LFBGA170 (SOT1315-1)
SOT1315-1
Package information
All information provided in this document is subject to legal disclaimers.
8 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1315-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array package; 170 balls
3. Soldering
Footprint information for reflow soldering of LFBGA170 package
SOT1315-1
Hx
P
P
Hy
see detail X
solder land
solder paste deposit
0.65
solder land plus solder paste
0.525
0.40
occupied area
solder resist
detail X
Dimensions in mm
P
Hx
Hy
0.80
12.0
12.0
sot1315-1_fr
Fig. 2. Reflow soldering footprint for LFBGA170 (SOT1315-1)
SOT1315-1
Package information
All information provided in this document is subject to legal disclaimers.
8 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1315-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array package; 170 balls
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1315-1
Package information
All information provided in this document is subject to legal disclaimers.
8 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1315-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array package; 170 balls
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 June 2016
SOT1315-1
Package information
All information provided in this document is subject to legal disclaimers.
8 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5