HX QF N6 0 SOT1134-2 plastic compatible thermal enhanced extremely thin quad flat package; no leads 10 June 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HXQFN60U Package type industry code HXQFN60U Package style descriptive code HXQFN (thermal enhanced extremely thin quad flatpack; no leads) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 22-8-2011 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 3.9 - 4 4.1 mm E package width 5.9 - 6 6.1 mm A seated height - - - 0.5 mm A2 package height 0.38 - 0.4 0.42 mm e nominal pitch - - 0.5 - mm n2 actual quantity of termination - - 60 - SOT1134-2 NXP Semiconductors plastic compatible thermal enhanced extremely thin quad flat package; no leads 2. Package outline HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals; body 4 x 6 x 0.5 mm B D SOT1134-2 A terminal 1 index area A E A2 A1 detail X e2 b e1 v w e C A B C L1 D2 D6 L eR B8 B10 A16 eT y1 C D3 D7 A17 A10 eR C eT 1/2 e A11 C A B C v w y e B11 B7 Eh e3 e4 1/2 e B17 B1 A1 terminal 1 index area A26 D5 D1 A32 B20 B18 A27 Dh D8 D4 eT eR X K eT eR 0 5 mm Dimensions Unit mm A A1 A2 b max 0.50 0.08 0.42 0.28 nom 0.05 0.40 0.23 min 0.02 0.38 0.18 D Dh E Eh e e1 e2 e3 e4 eR 4.1 4.0 3.9 1.95 1.85 1.75 6.1 6.0 5.9 3.95 3.85 3.75 0.5 1.0 2.5 3.0 4.5 0.5 eT K L L1 v 0.25 0.28 0.195 0.49 0.20 0.23 0.145 0.1 0.15 0.18 0.095 w y 0.05 0.08 y1 0.1 sot1134-2_po References Outline version IEC JEDEC JEITA SOT1134-2 --- --- --- European projection Issue date 11-08-15 Fig. 1. Package outline HXQFN60U (SOT1134-2) SOT1134-2 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT1134-2 NXP Semiconductors plastic compatible thermal enhanced extremely thin quad flat package; no leads 3. Soldering Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder land solder paste deposit 125 mm stencil solder land plus solder paste occupied area solder resist Dimensions in mm sot1134-2_fr Fig. 2. Reflow soldering footprint for HXQFN60U (SOT1134-2) SOT1134-2 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT1134-2 NXP Semiconductors plastic compatible thermal enhanced extremely thin quad flat package; no leads 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1134-2 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT1134-2 NXP Semiconductors plastic compatible thermal enhanced extremely thin quad flat package; no leads 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 June 2016 SOT1134-2 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5