SOT630-1 plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 8 June 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code TFBGA112 Package type industry code TFBGA112 Package style descriptive code TFBGA (thin fine-pitch ball grid array) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 27-4-2006 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 6.9 - 7 7.1 mm E package width 6.9 - 7 7.1 mm A seated height - - 1.12 - mm A2 package height 0.76 - 0.84 - mm e nominal pitch - - 0.5 - mm n2 actual quantity of termination - - 112 - SOT630-1 NXP Semiconductors plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 2. Package outline TFBGA112: plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm D B SOT630-1 A ball A1 index area A E A2 A1 detail X C e1 e 1/2 # b e # y1 C v M C A B wM C y M L K e J H G e2 F E 1/2 D e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b D E e e1 e2 v w y y1 mm 1.12 0.28 0.15 0.84 0.76 0.37 0.27 7.1 6.9 7.1 6.9 0.5 5.5 5.5 0.1 0.15 0.12 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-03-03 03-12-15 SOT630-1 Fig. 1. Package outline TFBGA112 (SOT630-1) SOT630-1 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT630-1 NXP Semiconductors plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 3. Soldering Footprint information for reflow soldering of TFBGA112 package SOT630-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR Hx Hy 0.50 0.275 0.300 0.425 7.500 7.500 sot630-1_fr Fig. 2. Reflow soldering footprint for TFBGA112 (SOT630-1) SOT630-1 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT630-1 NXP Semiconductors plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT630-1 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT630-1 NXP Semiconductors plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 June 2016 SOT630-1 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5