TS33000 High Efficiency Synchronous DC/DC Buck Converter TRIUNE PRODUCTS Features Description • The TS33000 is a DC/DC synchronous switching regulator with fully integrated power switches, internal compensation, and full fault protection. The switching frequency of 2.25MHz enables the use of extremely small filter components, resulting in smaller board space and reduced BOM costs. • • • • • • • • • • • • • • • • Fixed Output option has automatic low power PFM mode for reduced quiescent current at light loads 2.25MHz +/- 10% fixed switching frequency Fixed output voltages: 0.8V, 0.9V, 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V with +/- 2% output tolerance Input voltage range: 2.0V to 5.5V Voltage mode PWM control with input voltage feedforward compensation Voltage supervisor for VOUT reported at the PG pin Input supply under voltage lockout Soft start for controlled startup with no overshoot Full protection for over-current, over-temperature, and VOUT overvoltage Less than 100nA in shutdown mode Multiple enable pins for flexible system sequencing Low external component count Junction operating temperature -40C to 125C Packaged in a 16 pin QFN (3x3) When the input current is greater than approximately 50mA, the TS33000 utilizes PWM voltage mode feedback with input voltage feed-forward to provide a wide input voltage range without the need for external compensation. For the Fixed Output option, when the input current is less than 50mA, the device uses a PFM mode to provide increased efficiency at light loads. The cross over between PFM mode and PWM is automatic and has hysteresis to prevent oscillation between the modes. Additionally, the nLP mode pin can be used to force the device into PWM mode to reduce the output ripple, if needed (Fixed Output only). Applications • • • • • Point of load Systems with deep submicron ASICs/FPGAs Set-top box Communications equipment Portable and handheld equipment The TS33000 integrates a wide range of protection circuitry; including input supply under-voltage lockout, output undervoltage, output over-voltage, soft start, high side FET and low side FET current limits, and thermal shutdown. Typical Applications Fixed Output VCC VCC VSW VOUT Sense EN GND nLP EN Rev 1.9 PGND nLP TS33000 2x4.7uF TS33000 Final Datasheet May 1, 2015 1.5uH VOUT 4.7uF FB VCC or VOUT 10 kohm (optional) PG www.semtech.com PG 1 of 17 Semtech Pinout PGND VSW VSW PGND VSW VSW VCC VCC TS33000 VCC TEST OUT GND EN PG nLP VOUT Sense FB Pin Description Pin # Pin Name Pin Function Description 1 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 12, 14, & 15 2 VCC Input Voltage Input voltage supply. Short to Pins 3 & 11 3 VCC Input Voltage Input voltage supply. Short to Pins 2 & 11 4 GND GND Ground for the internal circuitry of the device 5 FB Feedback Input Feedback voltage for the regulator when used in adjustable mode. Connect to the output voltage resistor divider for adjustable mode and No Connection for fixed output modes 6 VOUT Sense Output Voltage Sense 7 nLP nLP Input 8 PG PG Output Power Good indicator Open-drain output. 9 EN Enable Input Input high voltage enables the device. Input low disables the device. 10 TEST OUT Test Mode Output Connect to GND. For internal testing use only. 11 VCC Input Voltage Input voltage supply. Short to Pins 2 & 3 12 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 14, & 15 13 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 16 14 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 12, & 15 15 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 12, & 14 16 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 13 TS33000 Final Datasheet May 1, 2015 Rev 1.9 Output Voltage Sense. Requires kelvin connection to 4.7uF output capacitor Forcing this pin high prevents the device from going into Low Power PFM mode operation www.semtech.com 2 of 17 Semtech Functional Block Diagram PG nLP EN VCC MONITOR & CONTROL VCC Under Voltage Protection Thermal Protection Oscillator Over Current Protection Ramp Generator Vref & Softstart Gate Drive VSW Gate Drive Control Error Amp Comparator 1.5uH VOUT 4.7uF Gate Drive PGND Compensation Network RTOP (Adjustable) RBOT GND FB (Adjustable) Vout Sense (Adjustable) (Adjustable) Figure 1: TS33000 Block Diagram for fixed and adjustable mode devices TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 3 of 17 Semtech Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(1, 2) Parameter Value Unit VCC -0.3 to 6.0 V VSW -1 to 6.0 V EN, PG,FB, nLP, TEST OUT, VOUT Sense -0.3 to 6 V Electrostatic Discharge – Human Body Model ±2k V Electrostatic Discharge – Charge Device Model ±500 V Lead Temperature (soldering, 10 seconds) 260 °C Notes: (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. Thermal Characteristics Symbol θJA Parameter Value Unit Thermal Resistance Junction to Air (Note 1) 50 °C/W Note 1: Assumes QFN16 1 in area of 2 oz copper and 25°C ambient temperature. 2 Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VCC Input Operating Voltage 2.0 3.3 5.5 V TSTG Storage Temperature Range -65 150 °C TJ MAX Maximum Junction Temperature 150 °C 125 °C TJ Operating Junction Temperature Range -40 LOUT Output Filter Inductor Typical Value (Note 1,3) 1.2 1.5 1.8 uH COUT Output Filter Capacitor Typical Value (Note 2,3) 3.76 4.7 5.64 uF COUT-ESR Output Filter Capacitor ESR 0 5 20 mΩ CBYPASS Input Supply Bypass Capacitor Typical Value (Note 2) 2x4.7 uF Note 1: For best performance, an inductor with a saturation current rating higher than the maximum VOUT load requirement plus the inductor current ripple. See the inductor current ripple calculations in inductor calculations sections. Note 2: For best performance, a low ESR ceramic capacitor should be used – X7R or X5R types should be used. Y5V should be avoided. Note 3: Min and max listed are to account for +/-20% variation of the typical value. Typical values of 4.7uF and 1.5uH are recommended. TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 4 of 17 Semtech Characteristics Electrical characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit 5.5 V VCC Supply Voltage VCC ICC-NORM ICC-LPM ICC-SHUTDOWN Input Supply Voltage Quiescent current Normal Mode Quiescent current Low Power PFM Mode Quiescent current Shutdown Mod 2.0 VCC = 3.3V, ILOAD = 0A, VEN=3.3V, nLP=3.3V VCC = 3.3V, ILOAD = 0A, VEN=3.3V, nLP=0V 12 mA 45 mA VCC = 3.3V, EN=0V 0.1 uA VCC Increasing 1.9 VCC Under Voltage Lockout VCC-UV VCC-UV_HYST Input Supply Under Voltage Threshold Input Supply Under Voltage Threshold Hysteresis 2.0 100 V mV OSC fOSC Oscillator Frequency 2.0 2.25 2.5 MHz PG Open Drain Output tPG PG Release Timer IOH-PG High-Level Output Leakage VPG=5V VCC=5V VOL-PG Low-Level Output Voltage IPG = -0.3mA 10 ms 0.1 uA 0.01 V EN/nLP Input Voltage Thresholds VIH-EN/nLP High Level Input Voltage VCC=2V to 5V VIL-EN/nLP Low Level Input Voltage VCC=2V to 5V Input Hysteresis VCC=2V to 5V 100 mV VEN=5V VCC=5V 0.1 uA VEN=0V VCC=5V 0.1 uA Pulldown to GND 100 KΩ VHYST-EN/nLP IIN-EN nLPPD EN Input Leakage nLP Pulldown Resistor 1.0 V 0.4 V Thermal Shutdown TSD TSDHYST TS33000 Final Datasheet May 1, 2015 Thermal Shutdown Junction Temperature 150 TSD Hysteresis Rev 1.9 170 10 www.semtech.com 190 C C 5 of 17 Semtech Regulator Characteristics Electrical characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit VOUT – 2% VOUT VOUT + 2% V Switch Mode Regulator: L=1.5uH and C=4.7uF VOUT-PWM RDSON IOUT Output Voltage Tolerance in Mode High Side Switch On Resistance IVSW = -300mA 110 mΩ Low Side Switch On Resistance IVSW = 300mA 75 mΩ Output Current 600 mA IOCDHS Over Current Detect HS 900 mA IOCDLS Over Current Detect LS 900 mA VOUT-LINE Output Line Regulation VCC = 2.5V to 5V, VOUT = 1.8V, ILOAD = 300mA -10 VOUT-LOAD Output Load Regulation ILOAD = 10mA to 300mA, VCC = 5V, VOUT = 1.8V VOUT 0.5% Feedback Reference FB Switch Point FBTH FBTH-TOL Feedback Reference Tolerance VOUT 10 mV VOUT + 0.5% V 0.6 -1.5 V 1.5 % IFB Feedback Input Current 100nA nA tSS Softstart Ramp Time 500 us VOUT-PG VOUT Power Good Threshold 85% VOUT VOUT-PG_HYST VOUT Power Good Hysteresis 2% VOUT VOUT-OV VOUT Over Voltage Threshold 106% VOUT VOUT-OV_HYST VOUT Over Voltage Hysteresis 2% VOUT TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 6 of 17 Semtech Functional Description This voltage-mode Point of Load (POL) synchronous stepdown power supply product can be used in the consumer, industrial, and automotive market segments. It includes flexibility to be used for a wide range of output voltages and is optimized for high efficiency power conversion with low RDSON integrated synchronous switches. A 2.25MHz internal switching frequency facilitates low cost LC filter combinations and improved transient response. Additionally, the fixed output version, with integrated Power on Reset and Fault circuitry enables a minimal external component count to provide a complete power supply solution for a variety of applications. Detailed Pin Description Unregulated input, VCC This terminal is the unregulated input voltage source for the IC. It is recommended that 2 4.7uF bypass capacitors be placed close as possible to the VCC pins for best performance. Since this is the main supply for the IC, good layout practices need to be followed for this connection. Feedback, FB This is the voltage feedback input terminal for the adjustable version. For the fixed mode versions, this pin should be left floating and not connected. The connection on the PCB should be kept as short as possible from the feedback resistors, kept away from the VSW connections or other switching/high frequency nodes, and should not be shared with any other connection. This should minimize stray coupling, reduce noise injection, and minimize voltage shift cause by output load. To choose the resistors for the adjustable version, use the following equation: VOUT = 0.6 (1 + RTOP/RBOT ) For stability, RTOP should be 270K Ohms to 330K Ohms. Output Voltage Sense, VOUT Sense This is the input terminal for the voltage output feedback and is needed for both adjustable and fixed voltage versions. This should be connected to the main output capacitor, and the same good layout practices should be followed as for the FB connection. Keep this line as short as possible, keep it away TS33000 Final Datasheet May 1, 2015 Rev 1.9 from the VSW and other switching or high frequency traces, and do not share this connection with any other connection on the PCB. Switching output, VSW This is the switching node of the regulator. It should be connected directly to the 1.5uH inductor with a wide, short trace. It is switching between VCC and PGND at the switching frequency. Ground, GND This ground is used for the majority of the device including the analog reference, control loop, and other circuits. Power Ground, PGND This is a separate ground connection used for the low side synchronous FET to isolate switching noise from the rest of the device. Enable, EN This is an input terminal to activate the entire device. This will enable the internal reference, oscillator, TSD, etc, and allow the fault detection circuitry to work correctly. Notice that the EN needs to low for the part to exhibit 100nA quiescent current. Power Good Output, PG This is an open drain, active high output. The switched mode output voltage is monitored and the PG line will remain low until the output voltage reaches the VOUT-UV threshold, approximately 85% of the final regulation output. Once the internal comparator detects the output voltage is above the desired threshold, an internal 10mSec delay timer is activated and the PG line is de-asserted to high when this delay timer expires. In the event the output voltage decreases below VOUT, the PG line will be asserted low immediately and remain low UV until the output rises above VOUT-UV and the delay timer times out again. If EN is pulled low, the VCC input undervoltage trips, or Thermal Shutdown is reached, the PG pin will immediately be pulled low. nLow Power Mode Output, nLP This is an input to force the PWM mode when light load is on the output. The PFM low power mode has higher output voltage ripple, which is some applications may be unacceptable. If low ripple is needed on the output this pin can be tied to VCC input, or switched above 1.0V during operation to force the device into normal PWM mode. www.semtech.com 7 of 17 Semtech Internal Protection Details Internal Current Limit Current limit is always active when the regulator is enabled. High side current limit will shorten the high side on time and tri-state the high side. Additionally, low side current limit will protect the low side FET and turn off the switch if current limit is sensed on the low side switch. Since the output is fully synchronous, the current limit is protected on the low side in both the positive and negative direction. Soft Start Soft start ensures current limit does not prevent regulator startup and minimize overshoot at startup. The typical startup time is 925us. These values do not change with output voltage, current limit settings, or adjustable/fixed mode. The soft start is re-triggered with the any rising edge that enables the regulator, including the EN input pins, thermal shutdown, VCC Undervoltage, or a VCC Power cycle. Thermal Shutdown If the temperature of the die exceeds 170C, the VSW outputs will tri-state to protect the device from damage. The PG and all other protection circuitry will stay active to inform the system of the failure mode. Once the device cools to 160C, the device will attempt to start up again, following the normal soft start sequence with 10ms delay on PG. If the device reaches 170C, the shutdown/restart sequence will repeat. Output Overvoltage If the output of the regulator exceeds 106% of the regulation voltage, the VSW outputs will tri-state to protect the device from damage. This check occurs at the start of each switching cycle. If it occurs during the middle of a cycle, the switching for that cycle will complete, and the VSW outputs will tri-state at the beginning of the next cycle. VCC Under-Voltage Lockout The device is held in the off state until VCC reaches 1.9V. There is a 100mV hysteresis on this input, which requires the input to fall below 1.8V before the device will disable. TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 8 of 17 Semtech TS33000 Version 1 Typical Performance Characteristics TJ = -40C to 125C, VCC = 12V (unless otherwise noted) 100mV/div Enable 200mA/div 2V/div 2V/div PERFORMANCE RESULTS VOUT Fig.2 10mA to 300mA Load Step (VCC=4V, VOUT=3.3V) 100mV/div 200mA/div 50mV/div 200mV/div Fig.1 Startup Response Fig.3 10mA to 300mA Load Step (VCC=4V, VOUT=0.8V) TS33000 Specifications subject to change Final Datasheet Rev 1.9 May 1, 2015 Fig.4 Line Transient Response (VCC=4V, VOUT=0.8V) www.semtech.com WWW.TRIUNESYSTEMS.COM 9 of 17 Copyright © 2012, Triune Systems, LL Semtech 9 TS33000 Typical Performance Characteristics Version 1.9 TJ = -40C to 125C, VCC = 12V (unless otherwise noted) 0.0045 3.3 0.004 3.29 3.28 0.003 V CC=5.5V V CC=4 V 3.27 Delta (V) VOUT (V) V OUT=3.3V 0.0035 3.26 V OUT=1.8V 0.0025 0.002 0.0015 V OUT=0.8V 0.001 3.25 0.0005 3.24 0 -‐0.0005 3.23 0 100 200 300 400 500 4 600 4.5 5 5.5 Input Voltage (V) IOUT(mA) Fig.5 Load Regulation Fig.6 Line Regulation (IOUT=300mA) 100% 90% Efficiency 80% V CC=4V 70% V CC=5.5V VCC=2V 60% 50% 40% 30% 0 100 200 300 400 500 600 IOUT (mA) Fig.7 Efficiency vs. Output Current (VOUT=1.8V) Fig.8 Efficiency vs. Output Current (VOUT=3.3V) 90% 100% 80% V CC=4V 60% V CC=5.5V V CC=2V 40% 60% 30% 50% 20% 40% 10% 100 200 300 400 500 600 30% 0 IOUT(mA) 100 200 300 400 500 600 I OUT (mA) Fig.9 Efficiency vs. Output Current (VOUT=0.8V) TS33000 Final Datasheet Rev 1.9 MaySpecifications 1, 2015 subject to change V CC=5.5V 70% 50% 0 V CC=4V 80% Efficiency Efficiency V CC=2V 90% 70% Fig.10 Efficiency vs. Input Voltage (VOUT=3.3V) www.semtech.com WWW.TRIUNESYSTEMS.COM 10 of 17 Semtech Copyright © 2012, Triune Systems, LLC TS33000 TS33000 TS33000 TS33000 Version 1.9 Typical Performance Characteristics Version1.9 1.9 Version Version Version 1.9 1.9 Version 1.9 TJ = -40C to 125C, VCC = 12V (unless otherwise noted) 0.6 0.6 0.60.6 0.6 0.6 0.25 0.25 0.25 0.25 0.25 0.25 0.5 0.5 0.50.5 0.5 0.5 Standby C urrent (uA) Standby Standby Standby CCurrent urrent C urrent ((uA) uA) (uA) Standby C urrent (uA) Standby urrent μA) Standby Standby Standby CCCCurrent urrent Current ( ((μA) (μA) Standby urrent (μA) μA) 0.2 0.2 0.2 0.2 0.2 0.2 0.4 0.4 0.40.4 0.4 0.4 0.15 0.15 0.15 0.15 0.15 0.15 0.3 0.3 0.30.3 0.3 0.3 0.1 0.1 0.1 0.1 0.1 0.1 0.2 0.2 0.20.2 0.2 0.2 0.05 0.05 0.05 0.05 0.05 0.05 0 00 000 2 22 222 0.1 0.1 0.10.1 0.1 0.1 2.5 2.5 2.5 2.5 2.5 2.5 3 3.5 4 4.5 3.5 44 4.5 33 3.5 3.5 4.5 4.5 333 3.5 3.5 444 4.5 4.5 Input Voltage (V) InputVV Voltage Input Voltage oltage V) Input Input Input V oltage oltage ((V) V) ((((V) V) Input V oltage V) 5 55 555 0 0 0000 -‐50 -‐5-‐-‐0-‐555-‐00500 5.5 5.5 5.5 5.5 5.5 5.5 Fig.11 Standby Current vs. Input Voltage 0 0 0000 25 50 75 100 25 50 75 100 2525 25 5050 50 50 7575 75 75 100 100 100 25 100 Temperature(oC) o oC) Temperature Temperature( oooC) Temperature( Temperature( Temperature( Temperature( C)C)C)(°C) Fig.12 Standby Current vs. Temperature 125 125 125 125 125 125 0.06 0.06 0.06 0.06 0.06 0.06 Quesient urrent(mA) Quesient Quesient Quesient CCCCurrent(mA) urrent(mA) C urrent(mA) Quesient urrent(mA) 0.055 0.055 0.055 0.055 0.055 0.055 IOUT= 10mA IOUT 10mA IOUT IIIOUT = 10mA ====10mA 10mA OUT OUT 10mA Vout (V) Vout Vout Vout ((V) (V) Vout (V) V) 3.32 3.32 3.32 3.32 3.32 3.32 3.315 3.315 3.315 3.315 3.315 3.315 3.31 3.31 3.31 3.31 3.31 3.31 3.305 3.305 3.305 3.305 3.305 3.305 3.3 3.3 3.3 3.3 3.3 3.3 3.295 3.295 3.295 3.295 3.295 3.295 3.29 3.29 3.29 3.29 3.29 3.29 3.285 3.285 3.285 3.285 3.285 3.285 3.28 3.28 3.28 3.28 3.28 3.28 3.275 3.275 3.275 3.275 3.275 3.275 3.27 3.27 3.27 3.27 3.27 3.27 3.265 3.265 3.265 3.265 3.265 3.265 -‐50 -‐50 -‐50 -‐50 -‐50 -‐50 -‐25 -‐2-‐-‐5-‐222-‐55255 0.045 0.045 0.045 0.045 0.045 0.045 IOUT= 300mA IOUT 300mA IOUT = 300mA 300mA 300mA OUT OUT IIIOUT ====300mA -‐25 -‐25 -‐25 -‐25 -‐25 -‐25 0.05 0.05 0.05 0.05 0.05 0.05 0.04 0.04 0.04 0.04 0.04 0.04 0.035 0.035 0.035 0.035 0.035 0.035 0 00000 25 50 75 100 25 50 75 100 100 2525 25 25 5050 50 50 7575 75 75 100 100 100 o Temperature ( C) oC) Temperature (°C) o((C) o(oC) Temperature o Temperature Temperature Temperature ( C) Temperature ( C) Fig.13 Output Voltage vs. Temperature 0.03 0.03 0.03 0.03 0.03 0.03 -‐50 -‐50 -‐50 -‐50 -‐50 -‐50 125 125 125 125 125 125 601.5 601.5 601.5 601.5 601.5 601.5 601 601 601 601 601 601 600.5 600.5 600.5 600.5 600.5 600.5 -‐25 -‐25 -‐25 -‐25 -‐25 -‐25 0 00 000 25 50 75 100 125 25 50 75 100 100 125 125 25 25 25 50 50 50 75 75 75 100 100 125 125 25 50 75 100 125 o Temperature ( oC) o Temperature Temperature (oC) C) o Temperature Temperature Temperature (o(((°C) (C) C) Temperature C) Fig.14 Quiescent Current vs. Temperature Input urrent W ((mA) mA) Input Input Input CCCCurrent urrent C urrent NN NNo o o NSSSSo W W S(W (mA) Input urrent o W (mA) mA) Oscillator requency Oscillator Oscillator Oscillator FFFFrequency requency Frequency Oscillator requency 2.35 2.35 2.35 2.35 2.35 2.35 2.3 2.3 2.3 2.3 2.3 2.3 2.25 2.25 2.25 2.25 2.25 2.25 2.2 2.2 2.2 2.2 2.2 2.2 2.15 2.15 2.15 2.15 2.15 2.15 2.1 2.1 2.1 2.1 2.1 2.1 2.05 2.05 2.05 2.05 2.05 2.05 600 600 600 600 600 600 599.5 599.5 599.5 599.5 599.5 599.5 599 599 599 599 599 599 598.5 598.5 598.5 598.5 598.5 598.5 598 598 598 598 598 598 -‐50 -‐25 -‐50 -‐25 -‐25 -‐50 -‐50 -‐50 -‐25 -‐25 -‐50 -‐25 2 22 222 1.95 1.95 1.95 1.95 1.95 1.95 -‐50 -‐50 -‐50 -‐50 -‐50 -‐50 0 00000 25 50 75 100 125 25 50 50 75 75 100 100 125 125 25 25 25 50 50 75 75 100 100 125 125 25 50 75 100 125 Temperature (°C) (o ooooC) Temperature Temperature C) o( C) Temperature Temperature Temperature ( (((C) C) Temperature C) 25 50 75 100 125 25 50 75 100 100 125 125 25 25 25 50 50 50 75 75 75 100 100 125 125 25 50 75 100 125 o Temperature ((°C) C) Temperature o o o o Temperature C) o(C) Temperature Temperature Temperature ( (((C) C) C) Temperature Fig.16 Input Current vs. Temperature (No load, No switching) Fig.15 Oscillator Frequency vs. Temperature -‐25 -‐25 -‐25 -‐25 -‐25 -‐25 0 00 000 TS33000 FinalSpecifications Datasheet Rev 1.9 subject to change Specifications subject to change Specifications Specifications Specifications subject subject subject toto to change change change May 1, 2015 Specifications subject to change www.semtech.com WWW.TRIUNESYSTEMS.COM WWW.TRIUNESYSTEMS.COM WWW.TRIUNESYSTEMS.COM WWW.TRIUNESYSTEMS.COM WWW.TRIUNESYSTEMS.COM WWW.TRIUNESYSTEMS.COM 11 11 11 11 11 11 11 of 17 Copyright © 2012, Triune Systems, LLC Copyright©© ©2012, 2012, Triune Systems, LLC Copyright Copyright Copyright © 2012, 2012, Triune Triune Triune Systems, Systems, Systems, LLC LLC LLC Semtech Copyright © 2012, Triune Systems, LLC External Component Selection The internal compensation is optimized for a 4.7uF output capacitor and a 1.5uH inductor. To keep the output ripple low, a low ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, inductor should be able to handle the 400mA without saturation. Functional (continued) ApplicationDescription Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane 1.5748mm Component Traces Thermal Via 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only 0.5246 - 0.5606 mm Power Plane (1oz Cu) Package Solder Pad (bottom trace) 0.0 - 0.071 mm Board Base & Bottom Pad Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 12 of 17 Semtech Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Bottom Layer, 2oz Cu Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 13 of 17 Semtech Package Mechanical Drawings (all dimensions in mm) Units Dimension Limits N e A A1 A3 D E2 E D2 b L K Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Width Overall Width Exposed Pad Length Contact Width Contact Length Contact-to-Exposed Pad TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com MIN 0.80 0.00 1.55 1.55 0.20 0.20 0.20 MILLIMETERS NOM 16 0.50 BSC 0.90 0.02 0.20 REF 3.00 BSC 1.70 3.00 BSC 1.70 0.25 0.30 - MAX 1.00 0.05 1.80 1.80 0.30 0.40 - 14 of 17 Semtech Recommeded PCB Land Pattern DIMENSIONS IN MILLIMETERS Contact Pitch Optional Center Pad Width Optional Center Pad Length Contact Pad Spacing Contact Pad Spacing Contact Pad Width (X8) Contact Pad Length (X8) Distance Between Pads Units Dimension Limits E W2 T2 C1 C2 X1 Y1 G MIN 0.15 MILLIMETERS NOM 0.50 BSC 3.00 3.00 - MAX 1.70 1.70 0.35 0.65 - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 15 of 17 Semtech Ordering Information Part Number Description TS33000-M008QFNR 2.25MHz Sync Buck, 600mA - 0.8V TS33000-M012QFNR 2.25MHz Sync Buck, 600mA - 1.2V TS33000-M015QFNR 2.25MHz Sync Buck, 600mA - 1.5V TS33000-M018QFNR 2.25MHz Sync Buck, 600mA - 1.8V TS33000-M025QFNR 2.25MHz Sync Buck, 600mA - 2.5V TS33000-M033QFNR 2.25MHz Sync Buck, 600mA - 3.3V RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: • • • • • • • • • • • • Cadmium (Cd) Chlorofluorocarbons (CFCs) Chlorinate Hydrocarbons (CHCs) Halons (Halogen free) Hexavalent Chromium (CrVI) Hydrobromofluorocarbons (HBFCs) Hydrochlorofluorocarbons (HCFCs) Lead (Pb) Mercury (Hg) Perfluorocarbons (PFCs) Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDEs) TS33000 Final Datasheet May 1, 2015 Rev 1.9 www.semtech.com 16 of 17 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com TS33000 Final Datasheet May 1, 2015 Rev 1.9 17 of 17 Semtech