Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot FIRST QUARTER 2002 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product family) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 7. Temperature Humidity Bias & HAST 8. Steam Pressure Pot 6-7 8 9-10 9. Failure Description Detail 11 10. Failure Rate Calculations 12 11. Definitions 13 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: March 8, 2002 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has not deteriorated over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C) 3 Failure Rate: 4 FITS (1.8M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking a weighted average of each device’s AF multiplied by the corresponding sample size. See page 10 for a more detailed description of the FIT rate calculation methodology. 2. Data Retention Bake (150°C) 3 Failure Rate: 3 FITS (1.0M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C) 3 Failure Rate: 0.0% (0 failures out of 892) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) 3 Failure Rate: 0.0% (1.4M device-hours) 3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) 3 Failure Rate: 0.0% (0 failures out of 1,005) RELIABILITY MONITOR -- ATMEL PROPRIETARY 1 High Temperature Operating Life (sorted by FAMILY) FAMILY QTR ASIC 4 LAST 4Q 0 0 900 3,780 0 0 500 2,180 0 0 500 2,180 0 0 100 1,035 319,200 1,684,300 D-FLASH 4 LAST 4Q 0 0 300 300 0 0 100 100 0 0 100 100 0 0 100 100 EEPROM 4 LAST 4Q 0 0 3,108 22,012 0 0 800 2,900 0 0 800 2,800 0 0 EPLD 4 LAST 4Q 0 0 300 1,340 0 0 100 500 0 0 100 499 EPROM 4 LAST 4Q 0 0 300 1,500 0 0 100 499 0 0 FLASH 4 LAST 4Q 0 0 550 2,650 0 0 200 899 MICRO 4 LAST 4Q 0 0 300 1,750 0 0 S-CARD 4 LAST 4Q 0 45 4 LAST 4Q 0 0 5,758 33,377 ATMEL 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS 65 67 0 0 44 8 109,600 109,600 135 135 0 0 62 62 700 2,700 860,784 3,684,176 94 68 0 0 11 4 0 0 100 499 109,600 539,488 23 37 0 0 363 45 100 499 0 0 100 449 109,600 522,048 260 173 0 0 32 10 0 0 100 749 0 0 200 846 183,600 906,748 240 159 0 0 21 6 100 600 0 0 100 600 0 0 100 599 109,600 654,700 285 177 0 0 29 8 0 45 0 0 0 0 7,560 123 0 985 0 0 1,900 7,723 0 0 1,800 7,427 0 0 1,400 6,228 1,801,984 8,108,620 120 85 0 0 4 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR EFR PPM FITS 56K 4 LAST 4Q 0 0 300 1,380 0 0 100 580 0 0 100 535 0 0 100 490 109,600 558,460 41 50 0 0 204 33 55K 4 LAST 4Q 0 45 0 45 0 45 0 45 45,000 103 0 198 4 LAST 4Q 0 0 100 400 0 0 100 400 0 0 100 400 0 100 50,000 250,000 204 204 0 0 90 18 39K 4 LAST 4Q 0 0 300 600 0 0 100 200 0 0 100 200 0 0 100 200 109,600 219,200 135 158 0 0 62 26 37K 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 350 0 0 100 350 109,600 396,800 220 129 0 0 38 18 35K 4 LAST 4Q 0 0 550 1,150 0 0 200 399 0 0 100 299 0 0 100 297 133,600 350,848 166 171 0 0 41 15 34K 4 LAST 4Q 0 0 300 1,200 0 0 100 399 0 0 100 399 0 0 100 349 109,600 412,448 260 205 0 0 32 11 33K 4 LAST 4Q 0 600 0 200 0 200 0 198 218,200 103 0 41 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 100 59,600 288,400 41 41 0 0 375 77 4 LAST 4Q 0 0 100 400 0 0 100 400 0 0 100 400 0 200 50,000 300,000 41 41 0 0 447 74 19K 4 LAST 4Q 0 0 2,496 14,350 0 0 800 3,500 0 0 800 3,399 0 0 700 3,099 831,408 3,786,768 128 100 0 0 9 2 15K 4 LAST 4Q 0 0 1,012 10,852 0 0 200 800 0 0 200 800 0 0 200 800 238,976 1,282,496 47 39 0 0 82 18 ATMEL 4 LAST 4Q 0 0 5,758 33,377 0 0 1,900 7,723 0 0 1,800 7,427 0 0 1,400 6,228 1,801,984 8,108,620 120 85 0 0 4 1 42K 26K 25K 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 Data Retention Bake (sorted by FAMILY) FAMILY QTR Device-Hours AF FITS D-FLASH 4 LAST 4Q 0 0 50 100 0 0 50 100 0 0 50 100 50,000 100,000 259 259 71 35 EEPROM 4 LAST 4Q 0 0 730 3,494 0 0 730 3,494 0 0 730 3,494 730,000 3,494,000 259 259 5 1 EPLD 4 LAST 4Q 0 0 50 450 0 0 50 450 0 0 50 450 50,000 450,000 259 259 71 8 EPROM 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 FLASH 4 LAST 4Q 0 0 100 450 0 0 99 449 0 0 98 448 98,668 448,668 259 259 36 8 MICRO 4 LAST 4Q 0 0 50 299 0 0 50 296 0 0 50 296 50,000 296,504 259 259 71 12 ATMEL 4 LAST 4Q 0 0 1,030 4,993 0 0 1,029 4,989 0 0 1,028 4,988 1,028,668 4,989,172 259 259 3 1 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR Device-Hours AF FITS 39K 4 LAST 4Q 0 0 50 50 0 0 50 50 0 0 50 50 50,000 50,000 259 259 71 71 37K 4 LAST 4Q 0 0 50 300 0 0 50 300 0 0 50 300 50,000 300,000 259 259 71 12 35K 4 LAST 4Q 0 0 50 150 0 0 49 149 0 0 48 148 48,668 148,668 259 259 73 24 34K 4 LAST 4Q 0 0 50 150 0 0 50 150 0 0 50 150 50,000 150,000 259 259 71 24 33K 4 LAST 4Q 0 100 0 100 0 100 100,000 259 35 19K 4 LAST 4Q 0 0 630 3,243 0 0 630 3,240 0 0 630 3,240 630,000 3,240,504 259 259 6 1 15K 4 LAST 4Q 0 0 200 1,000 0 0 200 1,000 0 0 200 1,000 200,000 1,000,000 259 259 18 4 ATMEL 4 LAST 4Q 0 0 1,030 4,993 0 0 1,029 4,989 0 0 1,028 4,988 1,028,668 4,989,172 259 259 3 1 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Temperature Cycle PACKAGE QTR BCC 4 LAST 4Q 0 77 0 77 0.0% BGA 4 LAST 4Q 0 0 154 231 0 0 154 231 0.0% 0.0% CBGA 4 LAST 4Q 0 100 0 100 0.0% 4 LAST 4Q 0 15 0 0 0.0% DBGA 4 LAST 4Q 0 0 80 391 0 0 80 391 0.0% 0.0% LAP 4 LAST 4Q 0 77 0 77 0.0% 4 LAST 4Q 0 77 0 77 0.0% PDIP 4 LAST 4Q 0 0 150 350 0 0 141 338 0.0% 0.0% PLCC 4 LAST 4Q 0 0 177 808 0 0 177 805 0.0% 0.0% PQFP 4 LAST 4Q 0 154 0 154 0.0% SOIC 4 LAST 4Q 0 0 154 1,001 0 0 154 1,001 0.0% 0.0% TQFP 4 LAST 4Q 0 281 0 281 0.0% 4 LAST 4Q 0 0 100 500 0 0 100 499 0.0% 0.0% CQFP MSOP TSOP 200 Cycles REJ SS 1K Cycles REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR TSSOP 4 LAST 4Q 0 0 77 231 0 0 77 231 0.0% 0.0% VQFP 4 LAST 4Q 0 49 0 49 0.0% 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 0 892 4,392 0 0 883 4,361 0.0% 0.0% VSOP ATMEL 200 Cycles REJ SS 1K Cycles REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS PACKAGE QTR BCC 4 LAST 4Q 0 154 0 154 0 154 4 LAST 4Q 0 0 177 177 0 0 177 177 0 0 177 177 4 LAST 4Q 0 0 100 500 0 0 100 500 0 0 100 500 4 LAST 4Q 0 100 0 100 0 4 LAST 4Q 0 100 0 100 4 LAST 4Q 0 0 0 PLCC 4 LAST 4Q 0 0 100 400 PQFP 4 LAST 4Q 0 4 LAST 4Q BGA DBGA LAP MSOP PDIP SOIC TQFP TSOP TSSOP VQFP VSOP ATMEL HAST 100 Hours REJ SS Device-Hours % Defective 0 154,000 0.0% 0 177,000 177,000 0.0% 0.0% 0 0 100,000 500,000 0.0% 0.0% 100 0 0 100,000 0.0% 0 100 0 0 100,000 0.0% 0 0 0 0 0 150 350 300,000 700,000 0.0% 0.0% 0 0 100 400 0 0 100 400 0 0 100 448 300,000 1,296,000 0.0% 0.0% 177 0 177 0 177 0 0 177,000 0.0% 0 0 200 1,500 0 0 200 1,500 0 0 200 1,500 0 0 200,000 1,500,000 0.0% 0.0% 4 LAST 4Q 0 231 0 231 0 231 0 50 331,000 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 0 96 446 192,000 892,000 0.0% 0.0% 4 LAST 4Q 0 0 100 300 0 0 100 300 0 0 100 300 0 0 100,000 300,000 0.0% 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 49 98,000 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 50 100,000 0.0% 4 LAST 4Q 0 0 677 3,639 0 0 677 3,639 0 0 677 3,639 0 0 346 1,393 1,369,000 6,425,000 0.0% 0.0% 0 0 RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR BCC 4 LAST 4Q 0 77 0.0% BGA 4 LAST 4Q 0 0 177 254 0.0% 0.0% CBGA 4 LAST 4Q 0 100 0.0% DBGA 4 LAST 4Q 0 0 80 460 0.0% 0.0% LAP 4 LAST 4Q 0 100 0.0% 4 LAST 4Q 0 100 0.0% PDIP 4 LAST 4Q 0 0 150 350 0.0% 0.0% PLCC 4 LAST 4Q 0 0 198 898 0.0% 0.0% PQFP 4 LAST 4Q 0 177 0.0% SOIC 4 LAST 4Q 0 0 200 1,300 0.0% 0.0% TQFP 4 LAST 4Q 0 277 0.0% TSOP 4 LAST 4Q 0 0 100 489 0.0% 0.0% TSSOP 4 LAST 4Q 0 0 100 300 0.0% 0.0% MSOP 168 Hours REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Steam Pressure Pot PACKAGE QTR VQFP 4 LAST 4Q 0 49 0.0% 4 LAST 4Q 0 50 0.0% 4 LAST 4Q 0 0 1,005 4,981 0.0% 0.0% VSOP ATMEL 168 Hours REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Description Detail N/A RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Failure Rate Calculations Failure Rate: χ2 λ where, λ χ2 α n AF DH = = = = = = = α (1 − , 2⋅n + 2 ) 100 ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = e Z⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage (commonly 30% above nominal), and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 13