Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Second QUARTER 2013 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Failure Rate Calculations 10 10. Definitions 11 RELIABILITY MONITOR REPORT Reliability Monitor Report Date: Nov 1, 2013 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) ✓ Failure Rate: 11 FITS (590,760 device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) ✓ Failure Rate: 49 FITS (160K device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * ✓ Failure Rate: 0.00% (0 failures out of 159 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * ✓ Failure Rate: 0.00% (0 failures out of 936K device-hours) ✓ Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * ✓ Failure Rate: 0.00% (0 failures out of 160 units) RELIABILITY MONITOR REPORT * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours* WAF EFR PPM FITS MEMORY 1 LAST 4Q 0 899 0 240 0 240 0 240 271,632 135 0 25 MCU 1 LAST 4Q 0 0 300 377 0 0 80 157 0 0 80 157 0 0 80 157 90,560 167,560 236 181 0 0 43 30 RFA 1 LAST 4Q 0 0 2,785 11,655 0 0 385 2,528 0 0 385 2,528 0 0 385 1,535 500,200 2,620,596 119 117 0 0 15 3 ATMEL 1 LAST 4Q 0 0 3,085 12,931 0 0 465 2,925 0 0 465 2,925 0 0 465 1,932 590,760 3,059,788 137 123 0 0 11 2 RELIABILITY MONITOR REPORT 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR Device-Hours* WAF EFR PPM FITS UHF6 1 LAST 4Q 0 0 800 953 0 0 0 153 0 0 0 153 0 0 0 0 0 0 0 0 38,400 114,900 142 75 0 0 168 106 UHF5 1 LAST 4Q 0 800 0 0 0 0 0 0 0 0 38,400 117 0 204 1 LAST 4Q 0 154 0 154 0 154 0 0 0 0 77,000 117 0 102 1 LAST 4Q 0 77 0 77 0 77 0 0 0 0 38,500 206 0 116 1 LAST 4Q 0 77 0 77 0 77 0 77 0 0 77,000 42 0 285 1 LAST 4Q 0 77 0 77 0 77 0 0 0 0 38,500 117 0 203 1 LAST 4Q 0 157 0 157 0 157 0 157 0 0 157,000 6 0 987 1 LAST 4Q 0 152 0 152 0 152 0 0 0 0 76,000 60 0 201 1 LAST 4Q 0 73 0 73 0 73 0 73 0 0 73,000 96 0 130 75K 1 LAST 4Q 0 0 877 5,437 0 0 77 687 0 0 77 687 0 0 77 615 0 0 0 0 115,400 879,000 117 159 0 0 68 7 63K 1 LAST 4Q 0 899 0 240 0 240 0 240 0 0 271,632 135 0 25 1 LAST 4Q 0 800 0 0 0 0 0 0 0 0 38,400 44 0 548 45.5K 1 LAST 4Q 0 0 77 228 0 0 77 228 0 0 77 228 0 0 77 228 0 0 0 74 77,000 302,000 117 112 0 0 102 27 45.3K 1 LAST 4Q 0 154 0 77 0 77 0 77 0 77 157,696 142 0 41 45.2K 1 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0 0 77 77 0 0 0 0 77,000 115,500 117 113 0 0 102 70 45.1 K 1 LAST 4Q 0 77 0 77 0 77 0 0 0 0 38,500 42 0 571 1 LAST 4Q 0 154 0 154 0 154 0 0 0 0 77,000 111 0 108 1 LAST 4Q 0 1,177 0 77 0 77 0 77 0 0 129,800 109 0 65 SAC2NV SIGE1 IL4-12KC_PC I2L4 BD1-2_P BCDMOS 77K 58.9K 40.2K 40.1K RELIABILITY MONITOR REPORT 3 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR Device-Hours* WAF EFR PPM FITS 40K 1 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 0 0 0 0 77,000 77,000 117 117 0 0 102 102 35.9K 1 LAST 4Q 0 0 300 300 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 90,560 90,560 236 236 0 0 43 43 35.4K 1 LAST 4Q 0 0 877 954 0 0 77 154 0 0 77 154 0 0 77 154 0 0 0 0 115,400 192,400 117 117 0 0 68 41 ATMEL 1 LAST 4Q 0 0 3,085 12,931 0 0 465 2,925 0 0 465 2,925 0 0 465 1,932 0 0 0 151 590,760 3,059,788 137 123 0 0 11 2 RELIABILITY MONITOR REPORT 4 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours AF FITS MEMORY 1 LAST 4Q 0 480 0 480 0 480 480,000 117 16 MCU 1 LAST 4Q 0 0 160 320 0 0 160 320 0 0 160 320 160,000 320,000 117 117 49 24 ATMEL 1 LAST 4Q 0 0 160 800 0 0 160 800 0 0 160 800 160,000 800,000 117 117 49 10 RELIABILITY MONITOR REPORT 5 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 63 K 1 LAST 4Q 0 400 0 400 0 400 400,000 117 20 1 LAST 4Q 0 80 0 80 0 80 80,000 117 98 35.9K 1 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 35.4K 1 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 35K 1 LAST 4Q 0 80 0 80 0 80 80,000 117 98 1 LAST 4Q 0 80 0 80 0 80 80,000 117 98 1 LAST 4Q 0 0 160 800 0 0 160 800 0 0 160 800 160,000 800,000 117 117 49 10 37K 34K ATMEL Device-Hours AF RELIABILITY MONITOR REPORT 6 FITS Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR CASON 1 LAST 4Q 0 80 0 80 0 80 0 80 0.00% MLF / QFN 1 LAST 4Q 0 0 79 159 0 0 79 159 0 0 79 159 0 0 79 159 0.00% 0.00% PDIP 1 LAST 4Q 0 160 0 160 0 160 0 160 0.00% SOIC 1 LAST 4Q 0 0 80 400 0 0 80 400 0 0 80 400 0 0 80 400 0.00% 0.00% ATMEL 1 LAST 4Q 0 0 159 799 0 0 159 799 0 0 159 799 0 0 159 799 0.00% 0.00% RELIABILITY MONITOR REPORT % Defective 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CASON 1 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 234 1,392 468,000 2,784,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 237 474,000 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 80 708 160,000 1,416,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 468 4,111 936,000 8,222,000 0.00% 0.00% MLF / QFN PDIP SOIC ATMEL RELIABILITY MONITOR REPORT 8 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR CASON 1 LAST 4Q 0 80 0 80 0 80 0.0% MLF / QFN 1 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 0.0% 0.0% PDIP 1 LAST 4Q 0 160 0 160 0 160 0.0% SOIC 1 LAST 4Q 0 0 80 400 0 0 80 400 0 0 80 400 0.0% 0.0% ATMEL 1 LAST 4Q 0 0 160 800 0 0 160 800 0 0 160 800 0.00% 0.00% RELIABILITY MONITOR REPORT % Defective 9 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR REPORT 10 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR REPORT 11