Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2011 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Apr 12, 2011 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 11 FITS (1,366K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 15 FITS (523K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 542 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 429K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 465 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 4 LAST 4Q 0 0 82 568 0 0 82 568 0 0 82 568 0 0 82 568 82,000 568,000 23 34 0 0 492 48 ASIC 4 LAST 4Q 0 0 260 705 0 0 260 705 0 0 260 705 0 0 215 615 237,500 660,000 20 21 0 0 197 66 MEMORY 4 LAST 4Q 0 0 200 1,800 0 0 200 1,200 0 0 200 1,200 0 0 200 1,200 200,000 1,228,800 48 51 0 0 95 15 MCU 4 LAST 4Q 0 0 754 10,345 0 0 231 2,348 0 0 154 2,117 0 0 154 1,347 192,040 2,154,664 3 9 0 0 1,730 46 RFA 4 LAST 4Q 0 0 693 3,153 0 0 693 3,153 0 0 693 3,153 0 0 616 2,693 654,500 3,076,000 108 130 0 0 13 2 ATMEL 4 LAST 4Q 0 0 1,989 16,571 0 0 1,466 7,974 0 0 1,389 7,743 0 0 1,267 6,423 1,366,040 7,687,464 64 67 0 0 11 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 77 77,000 117 0 102 0 384 384,000 117 0 20 45 45 0 0 0 0 22,500 22,500 3 3 0 0 14,017 14,017 0 230 0 77 153,500 130 0 46 230 0 230 0 77 153,500 92 0 65 0 77 0 77 0 0 38,500 117 0 203 154 0 154 0 154 0 154 154,000 117 0 51 0 0 77 154 0 0 77 154 0 0 77 154 0 0 77 154 77,000 154,000 117 117 0 0 102 51 4 LAST 4Q 0 0 539 1,616 0 0 539 1,616 0 0 539 1,616 0 0 462 1,539 500,500 1,730,500 101 141 0 0 18 4 4 LAST 4Q 0 900 0 300 0 300 0 300 328,800 57 0 49 58K 4 LAST 4Q 0 0 677 3,533 0 0 154 805 0 0 77 728 0 0 77 728 115,040 871,880 3 3 0 0 2,994 397 57K 4 LAST 4Q 0 0 100 200 0 0 100 200 0 0 100 200 0 0 100 200 100,000 200,000 23 23 0 0 403 202 56.9K 4 LAST 4Q 0 240 0 240 0 240 0 240 240,000 48 0 79 56K 4 LAST 4Q 0 0 100 400 0 0 100 400 0 0 100 400 0 0 100 400 100,000 400,000 23 23 0 0 403 101 46K 4 LAST 4Q 0 0 82 328 0 0 82 328 0 0 82 328 0 0 82 328 82,000 328,000 23 23 0 0 492 123 45.6K 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 142 142 0 0 84 84 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 77 0 4 LAST 4Q 0 384 0 384 0 384 SCMOS2 4 LAST 4Q 0 0 45 45 0 0 45 45 0 0 SCMOS3 4 LAST 4Q 0 230 0 230 4 LAST 4Q 0 230 0 LAST 4Q 0 77 4 LAST 4Q 0 0.5UMSPDMEE 4 LAST 4Q 75K 63K UNI3 UHF SAC2NV I2L BICMOS2 4 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 154 154,000 117 0 51 0 0 292 1,534 292,000 2,220,284 34 28 0 0 92 15 0 0 1,267 6,423 1,366,040 7,687,464 64 67 0 0 11 2 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 154 0 154 0 154 0 35K 4 LAST 4Q 0 0 292 7,772 0 0 292 2,503 0 0 292 2,349 ATMEL 4 LAST 4Q 0 0 1,989 16,571 0 0 1,466 7,974 0 0 1,389 7,743 38.6 K * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS APG 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ASIC 4 LAST 4Q 0 1 0 0 0 0 0 0 0 0 0 0 0 0 117 117 MEMORY 4 0 80 0 80 0 80 80,000 98 LAST 4Q 0 465 0 465 0 465 465,000 117 117 MCU 4 LAST 4Q 0 0 443 3,265 0 0 443 2,957 0 0 443 2,726 443,000 2,893,244 117 117 18 3 RFA 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ATMEL 4 LAST 4Q 0 1 523 3,730 0 0 523 3,422 0 0 523 3,191 523,000 3,358,244 117 117 RELIABILITY MONITOR -- ATMEL PROPRIETARY 17 15 5 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS 63 K 4 LAST 4Q 0 0 80 465 0 0 80 465 0 0 80 465 80,000 465,000 117 117 98 17 58K 4 LAST 4Q 0 0 231 1,155 0 0 231 1,155 0 0 231 1,001 231,000 1,078,000 117 117 34 7 35K 4 LAST 4Q 0 0 212 2,110 0 0 212 1,802 0 0 212 1,725 212,000 1,815,244 117 117 37 4 ATMEL 4 LAST 4Q 0 0 523 3,730 0 0 523 3,422 0 0 523 3,191 523,000 3,358,244 117 117 15 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 77 0 77 0.00% 4 LAST 4Q 0 154 0 154 0 154 0 154 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 77 0.00% MLF / QFN 4 LAST 4Q 0 0 80 439 0 0 80 439 0 0 80 439 0 0 80 433 0.00% 0.00% SOIC 4 LAST 4Q 0 539 0 539 0 539 0 534 0.00% TQFP 4 LAST 4Q 0 0 385 1,232 0 0 385 1,232 0 0 385 1,309 0 0 221 899 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 77 0 77 0 77 0 77 0.00% TSSOP 4 LAST 4Q 0 0 77 358 0 0 77 358 0 0 77 358 0 0 77 281 0.00% 0.00% ATMEL 4 LAST 4Q 0 0 542 2,953 0 0 542 2,953 0 0 542 3,030 0 0 378 2,532 0.00% 0.00% CASON BGA LGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR BGA 4 LAST 4Q 0 154 0 154 0 154 0 0 154,000 0.00% MLF / QFN 4 LAST 4Q 0 0 0 283 0 0 0 283 0 0 0 283 0 0 80 157 160,000 597,000 0.00% 0.00% SOIC 4 LAST 4Q 0 385 0 385 0 385 0 154 693,000 0.00% TQFP 4 LAST 4Q 0 0 308 895 0 0 308 818 0 0 231 587 0 0 0 0 269,500 715,436 0.00% 0.00% TSSOP 4 LAST 4Q 0 0 0 231 0 0 0 231 0 0 0 231 0 0 0 0 231,000 0.00% 4 LAST 4Q 0 0 308 1,948 0 0 308 1,871 0 0 231 1,640 0 0 80 542 429,500 2,852,436 0.00% 0.00% ATMEL 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 77 0.0% 4 LAST 4Q 0 154 0 0 0 0 0.0% 4 LAST 4Q 0 77 0 77 0 77 0.0% MLF / QFN 4 LAST 4Q 0 0 80 439 0 0 80 157 0 0 80 157 0.0% 0.0% SOIC 4 LAST 4Q 0 539 0 154 0 154 0.0% TQFP 4 LAST 4Q 0 0 385 1,343 0 0 0 0 0 0 0 0 0.0% 0.0% TSOP / VSOP 4 LAST 4Q 0 77 0 77 0 77 0.0% TSSOP 4 LAST 4Q 0 0 0 231 0 0 0 0 0 0 0 0 #DIV/0! 0.0% ATMEL 4 LAST 4Q 0 0 465 2,937 0 0 80 542 0 0 80 542 0.00% 0.00% CASON BGA LGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 HNO I²L HNO SCMOS3 HNO 6BD1 0.8 ASIC / RFA ASIC / RFA RFA 6IL4 2 SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC ASIC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12